IRFP460APBF

Document Number: 91234 www.vishay.com
S09-1284-Rev. B, 13-Jul-09 1
Power MOSFET
IRFP460A, SiHFP460A
Vishay Siliconix
FEATURES
Low Gate Charge Q
g
Results in Simple Drive
Requirement
Improved Gate, Avalanche and Dynamic dV/dt
Ruggedness
Fully Characterized Capacitance and Avalanche Voltage
and Current
Effective C
oss
Specified
Compliant to RoHS Directive 2002/95/EC
APPLICATIONS
Switch Mode Power Supply (SMPS)
Uninterruptable Power Supply
High Speed Power Switching
TYPICAL SMPS TOPOLOGIES
Full Bridge
PFC Boost
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).
b. Starting T
J
= 25 °C, L = 4.3 mH, R
g
= 25 Ω, I
AS
= 20 A (see fig. 12).
c. I
SD
20 A, dI/dt 125 A/µs, V
DD
V
DS
, T
J
150 °C.
d. 1.6 mm from case.
PRODUCT SUMMARY
V
DS
(V) 500
R
DS(on)
(Ω)V
GS
= 10 V 0.27
Q
g
(Max.) (nC) 105
Q
gs
(nC) 26
Q
gd
(nC) 42
Configuration Single
N-Channel MOSFET
G
D
S
TO-247
G
D
S
Available
RoHS*
COMPLIANT
ORDERING INFORMATION
Package TO-247
Lead (Pb)-free
IRFP460APbF
SiHFP460A-E3
SnPb
IRFP460A
SiHFP460A
ABSOLUTE MAXIMUM RATINGS T
C
= 25 °C, unless otherwise noted
PARAMETER SYMBOL LIMIT UNIT
Drain-Source Voltage V
DS
500
V
Gate-Source Voltage V
GS
± 30
Continuous Drain Current V
GS
at 10 V
T
C
= 25 °C
I
D
20
AT
C
= 100 °C 13
Pulsed Drain Current
a
I
DM
80
Linear Derating Factor 2.2 W/°C
Single Pulse Avalanche Energy
b
E
AS
960 mJ
Repetitive Avalanche Current
a
I
AR
20 A
Repetitive Avalanche Energy
a
E
AR
28 mJ
Maximum Power Dissipation T
C
= 25 °C P
D
280 W
Peak Diode Recovery dV/dt
c
dV/dt 3.8 V/ns
Operating Junction and Storage Temperature Range T
J
, T
stg
- 55 to + 150
°C
Soldering Recommendations (Peak Temperature) for 10 s 300
d
Mounting Torque 6-32 or M3 screw
10 lbf · in
1.1 N · m
* Pb containing terminations are not RoHS compliant, exemptions may apply
www.vishay.com Document Number: 91234
2 S09-1284-Rev. B, 13-Jul-09
IRFP460A, SiHFP460A
Vishay Siliconix
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).
b. Pulse width 300 µs; duty cycle 2 %.
c. C
oss
eff. is a fixed capacitance that gives the same charging time as C
oss
while V
DS
is rising from 0 % to 80 % V
DS
.
THERMAL RESISTANCE RATINGS
PARAMETER SYMBOL TYP. MAX. UNIT
Maximum Junction-to-Ambient R
thJA
-40
°C/WCase-to-Sink, Flat, Greased Surface R
thCS
0.24 -
Maximum Junction-to-Case (Drain) R
thJC
-0.45
SPECIFICATIONS T
J
= 25 °C, unless otherwise noted
PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNIT
Static
Drain-Source Breakdown Voltage V
DS
V
GS
= 0 V, I
D
= 250 µA 500 - -
V
V
DS
Temperature Coefficient ΔV
DS
/T
J
Reference to 25 °C, I
D
= 1 mA - 0.61 -
V/°C
Gate-Source Threshold Voltage V
GS(th)
V
DS
= V
GS
, I
D
= 250 µA 2.0 - 4.0 V
Gate-Source Leakage I
GSS
V
GS
= ± 30 V - - ± 100 nA
Zero Gate Voltage Drain Current I
DSS
V
DS
= 500 V, V
GS
= 0 V - - 25
µA
V
DS
= 400 V, V
GS
= 0 V, T
J
= 125 °C - - 250
Drain-Source On-State Resistance R
DS(on)
V
GS
= 10 V I
D
= 12 A
b
--0.27Ω
Forward Transconductance g
fs
V
DS
= 50 V, I
D
= 12 A
b
11 - -
S
Dynamic
Input Capacitance C
iss
V
GS
= 0 V,
V
DS
= 25 V,
f = 1.0 MHz, see fig. 5
- 3100 -
pF
Output Capacitance C
oss
- 480 -
Reverse Transfer Capacitance C
rss
-18-
Output Capacitance C
oss
V
GS
= 0 V
V
DS
= 1.0 V, f = 1.0 MHz 4430
V
DS
= 400 V, f = 1.0 MHz 130
Effective Output Capacitance C
oss
eff. V
DS
= 0 V to 400 V
c
140
Total Gate Charge Q
g
V
GS
= 10 V
I
D
= 20 A, V
DS
= 400 V,
see fig. 6 and 13
b
- - 105
nC Gate-Source Charge Q
gs
--26
Gate-Drain Charge Q
gd
--42
Turn-On Delay Time t
d(on)
V
DD
= 250 V, I
D
= 20 A,
R
G
= 4.3 Ω, R
D
= 13 Ω, see fig. 10
b
-18-
ns
Rise Time t
r
-55-
Turn-Off Delay Time t
d(off)
-45-
Fall Time t
f
-39-
Drain-Source Body Diode Characteristics
Continuous Source-Drain Diode Current I
S
MOSFET symbol
showing the
integral reverse
p - n junction diode
--20
A
Pulsed Diode Forward Current
a
I
SM
--80
Body Diode Voltage V
SD
T
J
= 25 °C, I
S
= 20A, V
GS
= 0 V
b
--1.8V
Body Diode Reverse Recovery Time t
rr
T
J
= 25 °C, I
F
= 20 A, dI/dt = 100 A/µs
b
- 480 710 ns
Body Diode Reverse Recovery Charge Q
rr
-5.07.5µC
Forward Turn-On Time t
on
Intrinsic turn-on time is negligible (turn-on is dominated by L
S
and L
D
)
S
D
G
Document Number: 91234 www.vishay.com
S09-1284-Rev. B, 13-Jul-09 3
IRFP460A, SiHFP460A
Vishay Siliconix
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
Fig. 1 - Typical Output Characteristics
Fig. 2 - Typical Output Characteristics
Fig. 3 - Typical Transfer Characteristics
Fig. 4 - Normalized On-Resistance vs. Temperature
1
0.1
91234_01
20 µs Pulse Width
T
C
= 25 °C
4.5 V
V
DS
, Drain-to-Source Voltage (V)
I
D
, Drain-to-Source Current (A)
10
2
10
1
0.1
10
10
2
Bottom
To p
V
GS
15 V
10 V
8.0 V
7.0 V
6.0 V
5.5 V
5.0 V
4.5 V
10
2
10
1
10 10
2
V
DS
,
Drain-to-Source Voltage (V)
I
D
, Drain-to-Source Current (A)
4.5 V
20 µs Pulse Width
T
C
= 150 °C
91234_02
Bottom
To p
V
GS
15 V
10 V
8.0 V
7.0 V
6.0 V
5.5 V
5.0 V
4.5 V
1
20 µs Pulse Width
V
DS
= 50 V
I
D
, Drain-to-Source Current (A)
V
GS
,
Gate-to-Source Voltage (V)
5.0 6.0 7.0 8.0 9.04.0
25 °C
150 °C
91234_03
10
2
10
1
0.1
I
D
= 20 A
V
GS
= 10 V
3.0
0.0
0.5
1.0
1.5
2.0
2.5
- 60 - 40 - 20 0 20 40
60
80 100
120
140 160
T
J
,
Junction Temperature (°C)
R
DS(on)
, Drain-to-Source On Resistance
(Normalized)
91234_04

IRFP460APBF

Mfr. #:
Manufacturer:
Vishay / Siliconix
Description:
MOSFET N-CH 500V HEXFET MOSFET
Lifecycle:
New from this manufacturer.
Delivery:
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