HMC292ALC3B Data Sheet
Rev. A | Page 4 of 15
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter Rating
RF Input Power 18 dBm
IF Input Power 18 dBm
IF Source and Sink Current ±3 mA
Reflow Temperature 260°C
Maximum Junction Temperature 175°C
Continuous Power Dissipation, P
DISS
(T
A
= 85°C, Derate 5.12 mW/°C
Above 85°C)
460 mW
Operating Temperature Range −40 to +85°C
Storage Temperature Range −65 to +150°C
Lead Temperature Range −65 to +150°C
Electrostatic Discharge (ESD) Sensitivity
Human Body Model (HBM) 500 V
Field Induced Charged Device
Model (FICDM)
500 V
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
THERMAL RESISTANCE
Thermal performance is directly linked to printed circuit board
(PCB) design and operating environment. Careful attention to
PCB thermal design is required.
θ
JA
is the natural convection junction to ambient thermal resistance
measured in a one cubic foot sealed enclosure. θ
JC
is the junction to
case thermal resistance.
Table 3. Thermal Resistance
Package Type θ
JA
θ
JC
Unit
E-12-4
1
120 195 °C/W
1
See JEDEC standard JESD51-2 for additional information on optimizing the
thermal impedance (PCB with 3 × 3 vias).
ESD CAUTION