BYC30W-600PQ

NXP Semiconductors
BYC30W-600P
Hyperfast power diode
BYC30W-600P All information provided in this document is subject to legal disclaimers. © NXP N.V. 2014. All rights reserved
Product data sheet 10 February 2014 3 / 9
Symbol Parameter Conditions Min Max Unit
t
p
= 10 ms; T
j(init)
= 25 °C; sine-wave
pulse; Fig. 4
- 270 AI
FSM
non-repetitive peak forward
current
t
p
= 8.3 ms; T
j(init)
= 25 °C; sine-wave
pulse; Fig. 4
- 300 A
T
stg
storage temperature -65 175 °C
T
j
junction temperature - 175 °C
I
F(AV)
(A)
0 504020 3010
003aak738
30
60
90
P
tot
(W)
0
δ = 1
0.5
0.2
0.1
Fig. 1. Forward power dissipation as a function of
average forward current; square waveform;
maximum values
003aak739
I
F(AV)
(A)
0 302010
20
40
60
P
tot
(W)
0
a = 1.57
1.9
2.2
2.8
4.0
Fig. 2. Forward power dissipation as a function of
average forward current; sinusoidal waveform;
maximum values
T
mb
(°C)
-50 20015050 1000
aaa-010282
15
30
45
I
F(AV)
(A)
0
115 °C
Fig. 3. Forward current as a function of mounting base
temperature; maximum values
t
p
(s)
10
-5
10
-2
10
-3
10
-4
aaa-010283
10
3
10
2
10
4
I
FSM
(A)
10
t
p
T
j(init)
= 25 °C max
I
F
I
FSM
t
Fig. 4. Non-repetitive peak forward current as a
function of pulse width; sinusoidal waveform;
maximum values
NXP Semiconductors
BYC30W-600P
Hyperfast power diode
BYC30W-600P All information provided in this document is subject to legal disclaimers. © NXP N.V. 2014. All rights reserved
Product data sheet 10 February 2014 4 / 9
9. Thermal characteristics
Table 6. Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit
R
th(j-mb)
thermal resistance
from junction to
mounting base
with heatsink compound; Fig. 5 - - 1 K/W
R
th(j-a)
thermal resistance
from junction to
ambient
in free air - 45 - K/W
aaa-010284
t
p
(s)
10
-6
1 1010
-1
10
-2
10
-5
10
-3
10
-4
10
-2
10
-3
1
10
-1
10
Z
th(j-mb)
(K/W)
10
-4
t
p
t
p
T
P
t
T
δ =
δ = 0.5
δ = 0.3
δ = 0.1
δ = 0.05
δ = 0.02
δ = 0.01
single pulse
Fig. 5. Transient thermal impedance from junction to mounting base as a function of pulse duration
10. Characteristics
Table 7. Characteristics
Symbol Parameter Conditions Min Typ Max Unit
Static characteristics
I
F
= 30 A; T
j
= 25 °C; Fig. 6 - 2 2.75 VV
F
forward voltage
I
F
= 30 A; T
j
= 150 °C; Fig. 6 - 1.38 1.8 V
V
R
= 600 V; T
j
= 25 °C - - 10 µAI
R
reverse current
V
R
= 600 V; T
j
= 150 °C - - 1 mA
Dynamic characteristics
I
F
= 30 A; V
R
= 200 V; dI
F
/dt = 200 A/
µs; T
j
= 25 °C; Fig. 7
- 50 - nCQ
r
recovered charge
I
F
= 30 A; V
R
= 200 V; dI
F
/dt = 200 A/
µs; T
j
= 125 °C; Fig. 7
- 280 - nC
NXP Semiconductors
BYC30W-600P
Hyperfast power diode
BYC30W-600P All information provided in this document is subject to legal disclaimers. © NXP N.V. 2014. All rights reserved
Product data sheet 10 February 2014 5 / 9
Symbol Parameter Conditions Min Typ Max Unit
I
F
= 1 A; V
R
= 30 V; dI
F
/dt = 200 A/µs;
T
j
= 25 °C; Fig. 7
- 18 22 ns
I
F
= 30 A; V
R
= 200 V; dI
F
/dt = 200 A/
µs; T
j
= 25 °C; Fig. 7
- 35 - ns
I
F
= 30 A; V
R
= 200 V; dI
F
/dt = 200 A/
µs; T
j
= 125 °C; Fig. 7
- 70 - ns
t
rr
reverse recovery time
I
F
= 30 A; V
R
= 400 V; dI
F
/dt = 500 A/
µs; T
j
= 25 °C; Fig. 7
- 29 - ns
I
F
= 30 A; V
R
= 200 V; dI
F
/dt = 200 A/
µs; T
j
= 25 °C; Fig. 7
- 3.5 - AI
RM
peak reverse recovery
current
I
F
= 30 A; V
R
= 200 V; dI
F
/dt = 200 A/
µs; T
j
= 125 °C; Fig. 7
- 7.6 - A
003aak742
V
F
(V)
0 321
20
10
30
40
I
F
(A)
0
(1) (2) (3)
Fig. 6. Forward current as a function of forward
voltage
003aac562
t
rr
time
100 %
25 %
I
F
dl
F
dt
I
R
I
RM
Q
r
Fig. 7. Reverse recovery definitions; ramp recovery

BYC30W-600PQ

Mfr. #:
Manufacturer:
WeEn Semiconductors
Description:
Rectifiers Hyperfast pwr diode
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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