IN
SD
HVG
LVG
D99IN1017
Figure 1. Input/Output Timing Diagram
Symbol Pin Parameter Test Condition Min. Typ. Max. Unit
Vcchys 2 Vcc UV Hysteresis 2 V
Iqccu 2 Undervoltage Quiescent Supply Current Vcc 11V 150 µA
Iqcc 2 Quiescent Current Vin = 0 380 500 µA
Bootstrapped supply Voltage Section
Vboot 8 Bootstrap Supply Voltage 17 V
IQBS Quiescent Current Vout = Vboot; IN = HIGH 200 µA
ILK High Voltage Leakage Current VHVG = Vout = Vboot =
600V
10 µA
Rdson Bootstrap Driver on Resistance (*) Vcc 12.5V; IN = LOW 125
High/Low Side Driver
Iso 5,7 Source Short Circuit Current VIN = Vih (tp < 10µs) 300 400 mA
Isi Sink Short Circuit Current VIN = Vil (tp < 10µs) 500 650 mA
Logic Inputs
Vil 2,3 Low Level Logic Threshold Voltage 1.5 V
Vih High Level Logic Threshold Voltage 3.6 V
Iih High Level Logic Input Current VIN = 15V 50 70 µA
Iil Low Level Logic Input Current VIN = 0V 1 µA
Iref 3 Dead Time Setting Current 28 µA
dt 3 vs
5,7
Dead Time Setting Range (**) Rdt = 47k
Rdt = 146
Rdt = 270k
0.4 0.5
1.5
2.7 3.1
µs
µs
µs
Vdt 3 Shutdown Threshold 0.5 V
(*)
R
DSON
is tested in the following way: R
DSON
=
(
V
CC
V
CBOOT1
)
(
V
CC
V
CBOOT2
)
I
1
(
V
CC,
V
CBOOT1
)
I
2
(
V
CC
,V
CBOOT2
)
where I
1
is pin 8 current when V
CBOOT
= V
CBOOT1
, I
2
when V
CBOOT
= V
CBOOT2
(**) Pin 3 is a high impedence pin. Therefore dt can be set also forcing a certain voltage V
3
on this pin. The dead time is the same obtained
with a Rdt if it is: Rdt
Iref = V
3
.
DC Operation
(continued)
L6384
4/10
BOOTSTRAP DRIVER
A bootstrap circuitry is needed to supply the high
voltage section. This function is normally accom-
plished by a high voltage fast recovery diode (fig.
4a). In the L6384 a patented integrated structure
replaces the external diode. It is realized by a
high voltage DMOS, driven synchronously with
the low side driver (LVG), with in series a diode,
as shown in fig. 4b
An internal charge pump (fig. 4b) provides the
DMOS driving voltage .
The diode connected in series to the DMOS has
been added to avoid undesirable turn on of it.
CBOOT selection and charging
:
To choose the proper C
BOOT
value the external
MOS can be seen as an equivalent capacitor.
This capacitor C
EXT
is related to the MOS total
gate charge :
C
EXT
=
Q
gate
V
gate
The ratio between the capacitors C
EXT
and C
BOOT
is proportional to the cyclical voltage loss .
It has to be:
C
BOOT
>>>C
EXT
e.g.: if Q
gate
is 30nC and V
gate
is 10V, C
EXT
is
3nF. With C
BOOT
= 100nF the drop would be
300mV.
If HVG has to be supplied for a long time, the
C
BOOT
selection has to take into account also the
leakage losses.
e.g.: HVG steady state consumption is lower than
200
µ
A, so if HVG T
ON
is 5ms, C
BOOT
has to
supply 1
µ
C to C
EXT
. This charge on a 1
µ
F ca-
pacitor means a voltage drop of 1V.
The internal bootstrap driver gives great advan-
tages: the external fast recovery diode can be
avoided (it usually has great leakage current).
This structure can work only if V
OUT
is close to
GND (or lower) and in the meanwhile the LVG is
on. The charging time (T
charge
) of the C
BOOT
is
the time in which both conditions are fulfilled and
it has to be long enough to charge the capacitor.
The bootstrap driver introduces a voltage drop
due to the DMOS R
DSON
(typical value: 125
Ohm). At low frequency this drop can be ne-
glected. Anyway increasing the frequency it
must be taken in to account.
The following equation is useful to compute the
drop on the bootstrap DMOS:
V
drop
=
I
charge
R
dson
V
drop
=
Q
gate
T
charge
R
dson
where Q
gate
is the gate charge of the external
power MOS, R
dson
is the on resistance of the
bootstrap DMOS, and T
charge
is the charging time
of the bootstrap capacitor.
For example: using a power MOS with a total
gate charge of 30nC the drop on the bootstrap
DMOS is about 1V, if the T
charge
is 5
µ
s. In fact:
V
drop
=
30nC
5
µ
s
125
~ 0.8V
V
drop
has to be taken into account when the voltage
drop on C
BOOT
is calculated: if this drop is too high,
or the circuit topology doesn’t allow a sufficient
charging time, an external diode can be used.
For both high and low side buffers @25˚C Tamb
0 1 2 3 4 5 C (nF)
0
50
100
150
200
250
time
(nsec)
Tr
D99IN1015
Tf
Figure 2. Typical Rise and Fall Times vs.
Load Capacitance
02468101214V
S
(V)
10
10
2
10
3
10
4
Iq
(µA)
D99IN1016
Figure 3. Quiescent Current vs. Supply
Voltage
L6384
5/10
50 100 150 200 250 300
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
dt (
µ
s)
Rdt (kOhm)
Typ.
@ Vcc = 14.4V
Figure 5. Dead Time vs. Resistance.
-45 -25 0 25 50 75 100 125
T
j
(°C)
0
0.5
1
1.5
2
2.5
3
dt (us)
R=47K
R=146K
R=270K
T
y
p.
T
y
p.
T
y
p.
@ Vcc = 14.4V
Figure 6. Dead Time vs. Temperature.
-45 -25 0 25 50 75 100 125
0
100
200
300
400
Ton,Toff (ns)
@ Rdt = 47kOhm
@ Rdt = 146kOhm
@ Rdt = 270kOhm
T
j
(
°C
)
T
y
p.
T
y
p.
T
y
p.
@ Vcc = 14.4V
Figure 7. Driver Propagation Delay vs.
Temperature.
-45 -25 0 25 50 75 100 125
0
0.2
0.4
0.6
0.8
1
Vdt (V)
T
j
(
°C
)
T
p.
@ Vcc = 14.4V
Figure 8. Shutdown Threshold vs. Temperature
TO LOAD
D99IN1067
H.V.
HVG
ab
LVG
HVG
LVG
C
BOOT
TO LOAD
H.V.
C
BOOT
D
BOOT
V
BOOT
V
S
V
S
V
OUT
V
BOOT
V
OUT
Figure 4. Bootstrap Driver
L6384
6/10

L6384D013TR

Mfr. #:
Manufacturer:
STMicroelectronics
Description:
Gate Drivers Hi-Volt Half Bridge
Lifecycle:
New from this manufacturer.
Delivery:
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