NBSG86A
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13
PACKAGE DIMENSIONS
FCBGA-16
BA SUFFIX
PLASTIC 4 X 4 (mm) BGA FLIP CHIP PACKAGE
CASE 489-01
ISSUE O
0.20
LASER MARK FOR PIN 1
IDENTIFICATION IN
THIS AREA
D
E
M
A1
A2
A
0.10 Z
0.15 Z
ROTATED 90 CLOCKWISE
DETAIL K
_
5
VIEW M-M
e3 X
S
M
X0.15 YZ
0.08 Z
3
b16 X
FEDUCIAL FOR PIN A1
IDENTIFICATION IN THIS AREA
4321
A
B
C
D
4
16 X
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES
PER ASME Y14.5M, 1994.
3. DIMENSION b IS MEASURED AT THE MAXIMUM
SOLDER BALL DIAMETER, PARALLEL TO DATUM
PLANE Z.
4. DATUM Z (SEATING PLANE) IS DEFINED BY THE
SPHERICAL CROWNS OF THE SOLDER BALLS.
5. PARALLELISM MEASUREMENT SHALL EXCLUDE
ANY EFFECT OF MARK ON TOP SURFACE OF
PACKAGE.
DIM MIN MAX
MILLIMETERS
A 1.40 MAX
A1 0.25 0.35
A2 1.20 REF
b 0.30 0.50
D 4.00 BSC
E 4.00 BSC
e 1.00 BSC
S 0.50 BSC
K
-X-
-Y-
M
M
-Z-
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14
PACKAGE DIMENSIONS
16 PIN LGA 4x4, 1.0P
CASE 526AB-01
ISSUE C
DIM MIN TYP
MILLIMETERS
A 0.89 0.96
A1 0.22 0.26
A2
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
E
D
0.10 C
A2
A
A1
0.10 C
4X
SEATING
PLANE
D1
e
E1
e
0.05 C
0.03 C
A B
16X b
C
B
A
12 3
D 4.00 BSC
E
0.67 0.70
b 0.30 0.40
e 1.00 BSC
D1
E1 3.00 BSC
SIDE VIEW
TOP VIEW
BOTTOM VIEW
4
D
e/2
e/2
4.00 BSC
3.00 BSC
1.03
0.30
0.73
0.50
MAX
A
B
TERMINAL A1
LOCATOR
C
0.40
16X
PITCH
1.00
*For additional information on our Pb-Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
A
1
PITCH
1.00
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15
PACKAGE DIMENSIONS
16 PIN QFN
CASE 485G-01
ISSUE C
16X
SEATING
PLANE
L
D
E
0.15 C
A
A1
e
D2
E2
b
1
4
58
12
9
16 13
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.25 AND 0.30 MM FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
5. L
max
CONDITION CAN NOT VIOLATE 0.2 MM
MINIMUM SPACING BETWEEN LEAD TIP
AND FLAG
B
A
0.15 C
TOP VIEW
SIDE VIEW
BOTTOM VIEW
PIN 1
LOCATION
0.10 C
0.08 C
(A3)
C
16 X
e
16X
NOTE 5
0.10 C
0.05 C
A B
NOTE 3
K
16X
DIM MIN MAX
MILLIMETERS
A 0.80 1.00
A1 0.00 0.05
A3 0.20 REF
b 0.18 0.30
D 3.00 BSC
D2 1.65 1.85
E 3.00 BSC
E2 1.65 1.85
e 0.50 BSC
K
L 0.30 0.50
EXPOSED PAD
0.18 TYP
ǒ
mm
inches
Ǔ
SCALE 10:1
0.50
0.02
0.575
0.022
1.50
0.059
3.25
0.128
0.30
0.012
3.25
0.128
0.30
0.012
EXPOSED PAD
*For additional information on our Pb-Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
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NBSG86AMNR2G

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ON Semiconductor
Description:
Logic Gates 2.5V/3.3V SiGe Diff Smart Gate
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