NXP Semiconductors Product specification
Rectifier diodes BYV29F, BYV29X series
ultrafast
ISOLATION LIMITING VALUE & CHARACTERISTIC
T
hs
= 25 ˚C unless otherwise specified
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
V
isol
Peak isolation voltage from SOD100 package; R.H. ≤ 65%; clean and - - 1500 V
all terminals to external dustfree
heatsink
V
isol
R.M.S. isolation voltage from SOD113 package; f = 50-60 Hz; - - 2500 V
all terminals to external sinusoidal waveform; R.H. ≤ 65%; clean
heatsink and dustfree
C
isol
Capacitance from pin 2 to f = 1 MHz - 10 - pF
external heatsink
THERMAL RESISTANCES
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
R
th j-hs
Thermal resistance junction to with heatsink compound - - 5.5 K/W
heatsink without heatsink compound - - 7.2 K/W
R
th j-a
Thermal resistance junction to in free air. - 55 - K/W
ambient
ELECTRICAL CHARACTERISTICS
T
j
= 25 ˚C unless otherwise stated
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
V
F
Forward voltage I
F
= 8 A; T
j
= 150˚C - 0.90 1.03 V
I
F
= 8 A - 1.05 1.25 V
I
F
= 20 A - 1.20 1.40 V
I
R
Reverse current V
R
= V
RRM
- 2.0 50 µA
V
R
= V
RRM
; T
j
= 100 ˚C - 0.1 0.35 mA
Q
s
Reverse recovery charge I
F
= 2 A to V
R
≥ 30 V; - 40 60 nC
dI
F
/dt = 20 A/µs
t
rr
Reverse recovery time I
F
= 1 A to V
R
≥ 30 V; - 50 60 ns
dI
F
/dt = 100 A/µs
I
rrm
Peak reverse recovery current I
F
= 10 A to V
R
≥ 30 V; - 4.0 5.5 A
dI
F
/dt = 50 A/µs; T
j
= 100˚C
V
fr
Forward recovery voltage I
F
= 10 A; dI
F
/dt = 10 A/µs - 2.5 - V
February 1999 2 Rev 1.400