SI4403CDY-T1-GE3

Vishay Siliconix
Si4403CDY
New Product
Document Number: 67341
S11-0243-Rev. A, 14-Feb-11
www.vishay.com
1
P-Channel 1.8 V (G-S) MOSFET
FEATURES
Halogen-free According to IEC 61249-2-21
Definition
•TrenchFET
®
Power MOSFET
100 % R
g
Tested
100 % UIS Tested
Compliant to RoHS Directive 2002/95/EC
APPLICATIONS
Adaptor Switch
High Current Load Switch
Notebook
PRODUCT SUMMARY
V
DS
(V) R
DS(on)
()I
D
(A)
d
Q
g
(Typ.)
- 20
0.0155 at V
GS
= - 4.5 V - 13.4
36.5 nC0.0195 at V
GS
= - 2.5 V - 12
0.0250 at V
GS
= - 1.8 V - 10.5
Notes:
a. Surface mounted on 1" x 1" FR4 board.
b. t = 10 s.
c. Maximum under steady state conditions is 85 °C/W.
d. Based on T
C
= 25 °C.
ABSOLUTE MAXIMUM RATINGS (T
A
= 25 °C, unless otherwise noted)
Parameter Symbol Limit Unit
Drain-Source Voltage V
DS
- 20
V
Gate-Source Voltage V
GS
± 8
Continuous Drain Current (T
J
= 150 °C)
T
C
= 25 °C
I
D
- 13.4
A
T
C
= 70 °C
- 10.7
T
A
= 25 °C
- 9.4
a, b
T
A
= 70 °C
- 7.5
a, b
Pulsed Drain Current
I
DM
- 40
Continuous Source-Drain Diode Current
T
C
= 25 °C
I
S
- 4.1
T
A
= 25 °C
- 2.1
a, b
Avalanche Current
L = 0.1 mH
I
AS
- 15
Single-Pulse Avalanche Energy E
AS
11.25 mJ
Maximum Power Dissipation
T
C
= 25 °C
P
D
5
W
T
C
= 70 °C 3.2
T
A
= 25 °C
2.5
a, b
T
A
= 70 °C
1.6
a, b
Operating Junction and Storage Temperature Range T
J
, T
stg
- 55 to 150 °C
THERMAL RESISTANCE RATINGS
Parameter Symbol Typical Maximum Unit
Maximum Junction-to-Ambient
a, c
t 10 s R
thJA
38 50
°C/W
Maximum Junction-to-Foot
Steady State
R
thJF
20 25
S
S
D
D
D
S
G
D
SO-8
5
6
7
8
Top View
2
3
4
1
Ordering Information: Si4403CDY-T1-GE3 (Lead (Pb)-free and Halogen-free)
S
G
D
P-Channel MOSFET
www.vishay.com
2
Document Number: 67341
S11-0243-Rev. A, 14-Feb-11
Vishay Siliconix
Si4403CDY
New Product
Notes:
a. Pulse test; pulse width 300 µs, duty cycle 2 %.
b. Guaranteed by design, not subject to production testing.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
SPECIFICATIONS (T
J
= 25 °C, unless otherwise noted)
Parameter Symbol Test Conditions Min. Typ. Max. Unit
Static
Drain-Source Breakdown Voltage V
DS
V
GS
= 0 V, I
D
= - 250 µA - 20 V
V
DS
Temperature Coefficient V
DS
/T
J
I
D
= - 250 µA
- 14.5
mV/°C
V
GS(th)
Temperature Coefficient V
GS(th)
/T
J
2.8
Gate-Source Threshold Voltage V
GS(th)
V
DS
= V
GS
, I
D
= - 250 µA - 0.4 - 1.0 V
Gate-Source Leakage I
GSS
V
DS
= 0 V, V
GS
= ± 8 V ± 100 nA
Zero Gate Voltage Drain Current I
DSS
V
DS
= - 20 V, V
GS
= 0 V - 1
µA
V
DS
= - 20 V, V
GS
= 0 V, T
J
= 70 °C - 10
On-State Drain Current
a
I
D(on)
V
DS
- 10 V, V
GS
= - 5 V - 20 A
Drain-Source On-State Resistance
a
R
DS(on)
V
GS
= - 4.5 V, I
D
= - 9 A 0.0125 0.0155
V
GS
= - 2.5 V, I
D
= - 6 A 0.0155 0.0195
V
GS
= - 1.8 V, I
D
= - 3 A 0.0195 0.0250
Forward Transconductance
a
g
fs
V
DS
= - 10 V, I
D
= - 9 A 40 S
Dynamic
b
Input Capacitance C
iss
V
DS
= - 10 V, V
GS
= 0 V, f = 1 MHz
2380
pFOutput Capacitance C
oss
340
Reverse Transfer Capacitance C
rss
280
Total Gate Charge Q
g
V
DS
= - 10 V, V
GS
= - 8 V, I
D
= - 5 A 60 90
nC
V
DS
= - 10 V, V
GS
= - 4.5 V, I
D
= - 5 A
36.5 55
Gate-Source Charge Q
gs
3.1
Gate-Drain Charge Q
gd
9.9
Gate Resistance R
g
f = 1 MHz 1.0 4.8 9.6
Tur n - O n D e l ay Time t
d(on)
V
DD
= - 10 V, R
L
= 2
I
D
- 5 A, V
GEN
= - 8 V, R
g
= 1
714
ns
Rise Time t
r
918
Turn-Off DelayTime t
d(off)
108 200
Fall Time t
f
41 80
Tur n - O n D e l ay Time t
d(on)
V
DD
= - 10 V, R
L
= 2
I
D
- 5 A, V
GEN
= - 4.5 V, R
g
= 1
14 28
Rise Time t
r
16 32
Turn-Off DelayTime t
d(off)
101 200
Fall Time t
f
40 80
Drain-Source Body Diode Characteristics
Continous Source-Drain Diode Current I
S
T
C
= 25 °C - 4.1
A
Pulse Diode Forward Current I
SM
- 40
Body Diode Voltage V
SD
I
S
= - 3 A, V
GS
= 0 V - 0.66 - 1.2 V
Body Diode Reverse Recovery Time t
rr
I
F
= - 2.3 A, dI/dt = 100 A/µs, T
J
= 25 °C
81 150 ns
Body Diode Reverse Recovery Charge Q
rr
150 300 nC
Reverse Recovery Fall Time t
a
43
ns
Reverse Recovery Rise Time t
b
38
Document Number: 67341
S11-0243-Rev. A, 14-Feb-11
www.vishay.com
3
Vishay Siliconix
Si4403CDY
New Product
TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)
Output Characteristics
On-Resistance vs. Drain Current
Gate Charge
0
8
16
24
32
40
0.0 0.5 1.0 1.5 2.0 2.5
I
D
- Drain Current (A)
V
DS
- Drain-to-Source Voltage (V)
V
GS
= 5 V thru 2 V
V
GS
= 1 V
V
GS
= 1.5 V
0.010
0.014
0.018
0.022
0.026
0.030
0 6 12 18 24 30
R
DS(on)
- On-Resistance (Ω)
I
D
- Drain Current (A)
V
GS
= 2.5 V
V
GS
= 1.8 V
V
GS
= 4.5 V
0
2
3
5
6
8
0 13 26 39 52 65
V
GS
- Gate-to-Source Voltage (V)
Q
g
- Total Gate Charge (nC)
V
DS
= 15 V
V
DS
= 10 V
V
DS
= 5 V
I
D
= 5 A
Transfer Characteristics
Capacitance
On-Resistance vs. Junction Temperature
0
2
4
6
8
10
0.0 0.4 0.8 1.2 1.6 2.0
I
D
- Drain Current (A)
V
GS
- Gate-to-Source Voltage (V)
T
C
= 125 °C
T
C
= - 55 °C
T
C
= 25 °C
0
900
1800
2700
3600
4500
0 4 8 12 16 20
C - Capacitance (pF)
V
DS
- Drain-to-Source Voltage (V)
C
iss
C
oss
C
rss
0.6
0.8
1.0
1.2
1.4
1.6
-50-250 255075100125150
R
DS(on)
-On-Resistance
(Normalized)
T
J
- Junction Temperature (°C)
I
D
= 10 A
V
GS
= 4.5 V
V
GS
= 1.8 V

SI4403CDY-T1-GE3

Mfr. #:
Manufacturer:
Vishay / Siliconix
Description:
MOSFET 1.8V P-Channel
Lifecycle:
New from this manufacturer.
Delivery:
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