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74HCT27BQ-Q100X
P1-P3
P4-P6
P7-P9
P10-P12
P13-P15
P16-P16
74HC_HCT27_Q100
All informatio
n provided in thi
s document is su
bject to legal
disclaimers.
© NXP B.V
.
2013. All rights rese
rved.
Product data sheet
Rev
. 1 — 3 June 2013
9 of 15
NXP Semiconductors
74HC27-Q100; 74HCT27-Q100
T
riple 3-input NOR gate
12. Package
outline
Fig 8.
Pa
ckage outline SOT108-1
(SO14)
UNIT
A
max.
A
1
A
2
A
3
b
p
cD
(1)
E
(1)
(1)
eH
E
LL
p
QZ
y
w
v
θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
JEITA
mm
inches
1.75
0.25
0.10
1.45
1.25
0.25
0.49
0.36
0.25
0.19
8.75
8.55
4.0
3.8
1.27
6.2
5.8
0.7
0.6
0.7
0.3
8
0
o
o
0.25
0.1
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
1.0
0.4
SOT108-1
X
w
M
θ
A
A
1
A
2
b
p
D
H
E
L
p
Q
detail X
E
Z
e
c
L
v
M
A
(A )
3
A
7
8
1
14
y
076E06
MS-012
pin 1 index
0.069
0.010
0.004
0.057
0.049
0.01
0.019
0.014
0.0100
0.0075
0.35
0.34
0.16
0.15
0.05
1.05
0.041
0.244
0.228
0.028
0.024
0.028
0.012
0.01
0.25
0.01
0.004
0.039
0.016
99-12-27
03-02-19
0
2.5
5 mm
scale
SO14: plastic small outline package; 14 leads; body width 3.9 mm
SOT108-1
74HC_HCT27_Q100
All informatio
n provided in thi
s document is su
bject to legal
disclaimers.
© NXP B.V
.
2013. All rights rese
rved.
Product data sheet
Rev
. 1 — 3 June 2013
10 of 15
NXP Semiconductors
74HC27-Q100; 74HCT27-Q100
T
riple 3-input NOR gate
Fig 9.
Package outlin
e SOT402-
1 (TSSOP14)
UNIT
A
1
A
2
A
3
b
p
cD
(1)
E
(2)
(1)
eH
E
LL
p
QZ
y
w
v
θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
JEITA
mm
0.15
0.05
0.95
0.80
0.30
0.19
0.2
0.1
5.1
4.9
4.5
4.3
0.65
6.6
6.2
0.4
0.3
0.72
0.38
8
0
o
o
0.13
0.1
0.2
1
DIMENSIONS (mm are the original dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
0.75
0.50
SOT402-1
MO-153
99-12-27
03-02-18
w
M
b
p
D
Z
e
0.25
17
14
8
θ
A
A
1
A
2
L
p
Q
detail X
L
(A )
3
H
E
E
c
v
M
A
X
A
y
0
2.5
5 mm
scale
TSSOP14: plastic thin shrink small outline package; 14 leads; body width 4.4 mm
SOT402-1
A
max.
1.1
pin 1 index
74HC_HCT27_Q100
All informatio
n provided in thi
s document is su
bject to legal
disclaimers.
© NXP B.V
.
2013. All rights rese
rved.
Product data sheet
Rev
. 1 — 3 June 2013
1
1 of 15
NXP Semiconductors
74HC27-Q100; 74HCT27-Q100
T
riple 3-input NOR gate
Fig 10.
Package o
utline SOT762-1 (DHVQFN14)
terminal 1
index area
0.5
1
A
1
E
h
b
UNIT
y
e
0.2
c
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
JEITA
mm
3.1
2.9
D
h
1.65
1.35
y
1
2.6
2.4
1.15
0.85
e
1
2
0.30
0.18
0.05
0.00
0.05
0.1
DIMENSIONS (mm are the original dimensions)
SOT762-1
MO-241
- - -
- - -
0.5
0.3
L
0.1
v
0.05
w
0
2.5
5 mm
scale
SOT762-1
DHVQFN14: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads;
14 terminals; body 2.5 x 3 x 0.85 mm
A
(1)
max.
A
A
1
c
detail X
y
y
1
C
e
L
E
h
D
h
e
e
1
b
26
13
9
8
7
1
14
X
D
E
C
B
A
02-10-17
03-01-27
terminal 1
index area
A
C
C
B
v
M
w
M
E
(1)
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
D
(1)
P1-P3
P4-P6
P7-P9
P10-P12
P13-P15
P16-P16
74HCT27BQ-Q100X
Mfr. #:
Buy 74HCT27BQ-Q100X
Manufacturer:
Nexperia
Description:
Logic Gates 74HCT27BQ-Q100/DHVQFN14/REEL 7
Lifecycle:
New from this manufacturer.
Delivery:
DHL
FedEx
Ups
TNT
EMS
Payment:
T/T
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