DLW21SZ491XQ2L

Spec No. JEFL243C-9115B-01 P7/10
MURATA MFG.CO., LTD
Reference Only
14.5 Attention regarding P.C.B. bending
The following shall be considered when designing and laying out P.C.B.'s.
(1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to
warping the board.
Products direction
Products shall be location the sideways
Direction (Length : a<b) to the mechanical
Stress.
(2) Components location on P.C.B. separation.
It is effective to implement the following measures, to reduce stress in separating the board.
It is best to implement all of the following three measures; however, implement as many measures as possible
to reduce stress.
Contents of Measures Stress Level
(1) Turn the mounting direction of the component parallel to the board separation surface. A > D *1
(2) Add slits in the board separation part. A > B
(3) Keep the mounting position of the component away from the board separation surface. A > C
*1 A > D is valid when stress is added vertically to the perforation as with Hand Separation.
If a Cutting Disc is used, stress will be diagonal to the PCB, therefore A > D is invalid.
(3)
Mounting Components Near Screw Holes
When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during
the tightening of the screw. Mount the component in a position as far away from the screw holes as possible.
14.6 Attention Regarding P.C.B. Design
< The Arrangement of Products >
P.C.B. shall be designed so that products are
far from the portion of perforation.
The portion of perforation shall be designed
as narrow as possible, and shall be designed
so as not to be applied the stress in the
case of P.C.B. separation.
Products shall not be arranged on the line
of a series of holes when there are big
holes in P.C.B.
(Because the stress concentrate on the
line of holes.)
Poor example
Good example
b
a
×
×
P.C.B.
Portion of
Perforation
Portion of
Perforation
Product
Product
P.C.B.
Hole
×
Screw Hole
Recommended
Perforation
Slit
A
B
C
D
Spec No. JEFL243C-9115B-01 P8/10
MURATA MFG.CO., LTD
Reference Only
Pick- up nozzle
Support pin
P.C.B.
Product
< Products Placing >
Support pins shall be set under P.C.B .
to prevent causing a warp to P.C.B.
during placing the products on the other
side of P.C.B.
< P.C.B. Separation >
P.C.B. shall not be separated with hand.
P.C.B. shall be separated with the fixture so as not to cause P.C.B. bending.
14.7 Standard Land Dimensions (Reflow)
1 If the pattern is made with wider than 1.2mm. It will result to let component turn around,
because melting speed is different. In the worst case, short circuit between lines may be occured.
2 If the pattern is made with less than 0.4mm , in the worst case , short circuit between lines may be
occurred deu to the spread of soldering paste or mount placeing accuracy.
3 If the pattern is made with wider than 0.8mm, the strength of bending will be reduced.
4 Do not use gilded pattern. A copper wire may cause open by dissolution of metallization.
14.8 Standard Soldering Condition
1.Reflow Soldering
(1)Standard printing pattern of solder paste
Standard thickness of the solder paste
should be 100 to 150µm.
Use the solder paste printing pattern of the
right pattern.
For the resist and copper foil pattern, use
standard land dimensions.
Use the Solder Sn-3.0Ag-0.5Cu for pattern printing.
Spread of soldering paste between lines may
cause short circuit of lines.
(2) Soldering Temperature
Temperature difference between soldering and surface of components must be within 150°C,
in preheating. When components are immersed in liquid after soldering, temperature difference
should be within 100°C. If preheating is not enough, components may be cracked and cause deterioration in
insulation resistance.
0.8
2.6
0.5
1.2
(in mm)
0.8
2.6
1.2
0.4
(in mm)
Resist
Copper foil pattern
No pattern
1
2
3
Spec No. JEFL243C-9115B-01 P9/10
MURATA MFG.CO., LTD
Reference Only
(3) Soldering Condition
Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting
in the deterioration of product quality.
Standard Profile Limit Profile
Pre-heating 150180°C 90s±30s
Heating above 220°C30s60s above 230°C60s max.
Peak temperature 245±3°C 260°C10s
Cycle of reflow 2 times 2 times
2. Reworking with Soldering iron
The following conditions must be strictly followed when using a soldering iron after being
mounted by reflow soldering.
· Pre-heating: 150°C, 1 min · Soldering iron output: 30W max.
· Tip temperature: 350°C max. · Tip diameter:φ3mm max.
· Soldering time : 3(+1,-0) seconds. · Times : 2times max.
Notes : Do not touch the products directly with the soldering iron.
Do not remove the product from P.C.B.. If the removed product is re-soldered on
P.C.B. ,characteristic impedance may change.
3. Solder Volume
Solder shall be used not to be exceeded the upper limits as shown below.
Accordingly increasing the solder volume, the mechanical stress to Chip is also increased.
Exceeding solder volume may cause the failure of mechanical or electrical performance.
14.9 Caution for use
When you hold products with a tweezer, please hold
like a figure of the right side, and sharp material,
such as a pair of tweezers, shall not be touched to
the winding portion to prevent the breaking of wire.
Mechanical shock should not be applied to the products
mounted on the board to prevent the breaking
of the core.
T
1/3T
t
T (T:Tickness of electrode)
Upper limit
Recommendable
150
90s±30s
Time(s)
245±3°C
Tem
p
.
(°C)
220°C
3060s
180
260/10s
230°C
60s max.
Limit Profile
Standard Profile
tweezer

DLW21SZ491XQ2L

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Manufacturer:
Description:
Common Mode Chokes Dual 490Ohm 100MHz 190mA 770mOhm DCR SMD Automotive
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New from this manufacturer.
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