NCN6010
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13
The operating waveforms are given in Figure 12 to
illustrate the high peak current flowing in the transfer
capacitor. The real ripple voltage, coming from the
engineering board, is given in Figure 13.
TIME (ms)
I(R4)
-2.0 A
0 A
2.0 A
SEL>>
V(C2:2)
0 V
2.0 V
4.0 V
6.0 V
SIM_V
CC
Output Voltage
Load = 10 mA
Charge Pump Transfer
Capacitor Current
0204060
Figure 12. Simulated Charge Pump Typical Waveforms
Figure 13. SIM_VCC Output Voltage Ripple @ Iout = 10 mA
NCN6010
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14
Figure 14. Engineering Test Board
1
2
3
4
5
6
7
14
13
12
10
RESET
I/O
CLOCK
SIM_V
CC
SIM_IO
SIM_CLK
SIM_RST
C4
220 nF
U1
NCN6010
V
DD
STOP
MOD_V
CC
PWR_ON
Cta
Ctb
9
8
11
GND
TP6 TP7 TP8 TP9
RST CLK S_IO V
CC
17
18
8
4
3
2
1
5
7
SMARTCARD
J2
Swa
Swb
C8
C4
CLK
RST
V
CC
GND
I/O
V
PP
ISO7816
6
C1
47 mF
C2
1.0 mF
C3
100 nF
GND
GND
S2
POL. DET
+3.3 V
R2
10 k
POL. DET
+3.3 V
+3.3 V
S1
B7
B6
B5
B4
B3
B2
B1
B0
Y7
D6
D5
D4
D3
D2
D1
D0
26
25
24
23
22
21
20
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
R4
100 R
CLK
RST
I/O
PWR_ON
R3
1 k
TP1
E
TP2
RST
TP3
I/O
TP4
PWR
TP5
MOD
C5
100 nF
GND
+3.3 V
MOD_V
CC
GND
V
DD
ON
470 R
MANUAL PWR_ON
MANUAL MOD_V
CC
S4S3
+3.3 V+3.3 V
R5
10 k
R6
10 k
GND
J1
111 1 1
11 11
GND
GND
E
IRQ
GND
NCN6010
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15
The layout of the PCB is a key parameter to avoid the
voltage spikes that could pollute the rest of the system.
Figure 16 represents a typical printed circuit lay out, based
on the schematic diagram given in Figure 14, highlighting
the large ground plane used in this engineering tool.
Obviously, a GSM application will use much less area, but
cares must be observed to locate the capacitors as close as
possible to the integrated circuit associated pins.
Capacitors C1, C2, C3, C4 and C5 are ceramic, X7R, 10 V,
surface mount.
Figure 15. Engineering Test Board Silk Layer
Figure 16. Engineering Test Board Top Layer

NCN6010DTB

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
Translation - Voltage Levels 2.7V Sim Card
Lifecycle:
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