NCV4276B
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3
Table 1. PIN FUNCTION DESCRIPTION
Pin No. Symbol Description
1 I Input; Battery Supply Input Voltage.
2 INH Inhibit; Set low-to inhibit.
3 GND Ground; Pin 3 internally connected to heatsink.
4 NC/VA Not connected for fixed voltage version/Voltage Adjust Input for adjustable voltage version; use an external
voltage divider to set the output voltage
5 Q Output: Bypass with a capacitor to GND. See Figures 3 to 7 and Regulator Stability Considerations section.
Table 2. MAXIMUM RATINGS*
Rating Symbol Min Max Unit
Input Voltage V
I
−42 45 V
Input Peak Transient Voltage V
I
− 45 V
Inhibit INH Voltage V
INH
−42 45 V
Voltage Adjust Input VA V
VA
−0.3 10 V
Output Voltage V
Q
−1.0 40 V
Ground Current I
q
− 100 mA
Input Voltage Operating Range V
I
V
Q
+ 0.5 V or 4.5 V
(Note 1)
40 V
ESD Susceptibility (Human Body Model)
(Machine Model)
(Charged Device Model)
−
−
−
4.0
250
1.25
−
−
−
kV
V
kV
Junction Temperature T
J
−40 150 °C
Storage Temperature T
stg
−50 150 °C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
*During the voltage range which exceeds the maximum tested voltage of I, operation is assured, but not specified. Wider limits may apply. Thermal
dissipation must be observed closely.
1. Minimum V
I
= 4.5 V or (V
Q
+ 0.5 V), whichever is higher.
Table 3. LEAD TEMPERATURE SOLDERING REFLOW (Note 2)
Lead Temperature Soldering
Reflow (SMD styles only), Leaded, 60−150 s above 183, 30 s max at peak
Reflow (SMD styles only), Lead Free, 60−150 s above 217, 40 s max at peak
Wave Solder (through hole styles only), 12 sec max
T
SLD
−
−
−
240
265
310
°C
2. Per IPC/JEDEC J−STD−020C.
Table 4. THERMAL CHARACTERISTICS (Notes 3 and 4)
Characteristic Test Conditions (Typical Value) Unit
DPAK 5-PIN PACKAGE
Min Pad Board (Note 5) 1, Pad Board (Note 6)
Junction-to-Tab (psi-JLx, y
JLx
) 4.2 4.7 C/W
Junction-to-Ambient (R
q
JA
, q
JA
) 100.9 46.8 C/W
D
2
PAK 5-PIN PACKAGE
0.4 sq. in. Spreader Board (Note 7) 1.2 sq. in. Spreader Board (Note 8)
Junction-to-Tab (psi-JLx, y
JLx
) 3.8 4.0 C/W
Junction-to-Ambient (R
q
JA
, q
JA
) 74.8 41.6 C/W
3. Minimum V
I
= 4.5 V or (V
Q
+ 0.5 V), whichever is higher.
4. Per IPC/JEDEC J−STD−020C.
5. 1 oz. copper, 0.26 inch
2
(168 mm
2
) copper area, 0.062″ thick FR4.
6. 1 oz. copper, 1.14 inch
2
(736 mm
2
) copper area, 0.062″ thick FR4.
7. 1 oz. copper, 0.373 inch
2
(241 mm
2
) copper area, 0.062″ thick FR4.
8. 1 oz. copper, 1.222 inch
2
(788 mm
2
) copper area, 0.062″ thick FR4.
