Analog Integrated Circuit Device Data
12 Freescale Semiconductor
33790
REVISION HISTORY
REVISION HISTORY
Revision Date Description of Changes
7.0 5/2006
• Implemented Revision History page
• Converted to Freescale format
8.0 11/2006
• Updated data sheet format
• Removed Peak Package Reflow Temperature During Reflow (solder reflow) parameter from
Maximum Ratings on page 5. Added note with instructions to obtain this information from
www.freescale.com.
9.0 11/2006
• Minor correction changes to Figure 1 and ordering information
10.0 12/2006
• Restated note Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC
standard J-STD-020C. For Peak Package Reflow Temperature and Moisture Sensitivity Levels
(MSL), Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes and enter
the core ID to view all orderable parts. (i.e. MC33xxxD enter 33xxx), and review parametrics. on
page 5
11.0 3/2008
• Removed watermark from page 1.
12.0 12/2011
• Removed part numbers MCZ33790EG/R2, MC33790DW/R2 and added part number
MC33790HEG/R2.
• Deleted references to MC68HC55.
• Updated Freescale form and style.
13.0 2/2014
• No technical changes. Revised back page. Updated document properties. Added SMARTMOS
sentence to last paragraph on page 1.