NTHD5904T1

© Semiconductor Components Industries, LLC, 2005
February, 2005 Rev. XXX
1 Publication Order Number:
NTHD5904T1/D
NTHD5904T1
Power MOSFET
Dual N−Channel
3.1 Amps, 20 Volts
Features
Low R
DS(on)
for Higher Efficiency
Logic Level Gate Drive
Miniature ChipFETt Surface Mount Package Saves Board Space
Applications
Power Management in Portable and BatteryPowered Products; i.e.,
Cellular and Cordless Telephones and PCMCIA Cards
MAXIMUM RATINGS (T
A
= 25°C unless otherwise noted)
Rating
Symbol 5 secs
Steady
State
Unit
DrainSource Voltage V
DS
20 V
GateSource Voltage V
GS
"12 V
Continuous Drain Current
(T
J
= 150°C) (Note 1)
T
A
= 25°C
T
A
= 85°C
I
D
"4.2
"3.0
"3.1
"2.2
A
Pulsed Drain Current I
DM
"10 A
Continuous Source Current
(Diode Conduction) (Note 1)
I
S
1.8 0.9 A
Maximum Power Dissipation
(Note 1)
T
A
= 25°C
T
A
= 85°C
P
D
2.1
1.1
1.1
0.6
W
Operating Junction and Storage
Temperature Range
T
J
, T
stg
55 to +150 °C
1. Surface Mounted on 1 x 1 FR4 Board.
G
D
S
NChannel MOSFET
1
1
1
G
S
2
2
NChannel MOSFET
D
2
Device Package Shipping
ORDERING INFORMATION
NTHD5904T1 ChipFET 3000/Tape & Reel
ChipFET
CASE 1206A
STYLE 2
DUAL NCHANNEL
3.1 AMPS, 20 VOLTS
R
DS(on)
= 75 mW
1
2
3
45
6
7
8
PIN CONNECTIONS
MARKING
DIAGRAM
A1
A1 = Specific Device Code
1
2
3
4
8
7
6
5
S
1
G
1
S
2
G
2
D
1
D
1
D
2
D
2
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NTHD5904T1
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2
THERMAL CHARACTERISTICS
Characteristic Symbol Typ Max Unit
Maximum JunctiontoAmbient (Note 2)
t v 5 sec
Steady State
R
thJA
50
90
60
110
°C/W
Maximum JunctiontoFoot (Drain)
Steady State
R
thJF
30 40 °C/W
ELECTRICAL CHARACTERISTICS (T
J
= 25°C unless otherwise noted)
Characteristic
Symbol Test Condition Min Typ Max Unit
Static
Gate Threshold Voltage
V
GS(th)
V
DS
= V
GS
, I
D
= 250 mA
0.6 V
GateBody Leakage I
GSS
V
DS
= 0 V, V
GS
= "12 V "100 nA
Zero Gate Voltage Drain Current I
DSS
V
DS
= 16 V, V
GS
= 0 V 1.0 mA
V
DS
= 16 V, V
GS
= 0 V,
T
J
= 85°C
5.0
OnState Drain Current (Note 3) I
D(on)
V
DS
w 5.0 V, V
GS
= 4.5 V 10 A
DrainSource OnState Resistance (Note 3) r
DS(on)
V
GS
= 4.5 V, I
D
= 3.1 A 0.065 0.075 W
()
V
GS
= 2.5 V, I
D
= 2.3 A 0.115 0.143
Forward Transconductance (Note 3) g
fs
V
DS
= 10 V, I
D
= 3.1 A 8.0 S
Diode Forward Voltage (Note 3) V
SD
I
S
= 0.9 A, V
GS
= 0 V 0.8 1.2 V
Dynamic (Note 4)
Total Gate Charge
Q
g
V 10 V V 45 V
4.0 6.0
nC
GateSource Charge Q
gs
V
DS
= 10 V, V
GS
= 4.5 V,
I
D
= 3.1 A
0.6
GateDrain Charge Q
gd
I
D
= 3
.
1 A
1.3
TurnOn Delay Time t
d(on)
12 18
ns
Rise Time t
r
V
DD
= 10 V, R
L
= 10 W
I
D
^ 10 A V
GEN
= 4 5 V
35 55
TurnOff Delay Time t
d(off)
I
D
^ 1.0 A, V
GEN
= 4.5 V,
R
G
= 6 W
19 30
Fall Time t
f
R
G
6 W
9.0 15
SourceDrain Reverse Recovery Time t
rr
I
F
= 0.9 A, di/dt = 100 A/ms
40 80
2. Surface Mounted on 1 x 1 FR4 Board.
3. Pulse Test: Pulse Width v 300 ms, Duty Cycle v 2%.
4. Guaranteed by design, not subject to production testing.
NTHD5904T1
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3
TYPICAL ELECTRICAL CHARACTERISTICS
C
oss
V
GS
= 5 thru 3 V
10
8
6
4
2
0
10
8
6
4
2
0
0 0.5 1.0 1.5 2.0 2.5 3.0
0 0.5 1.0 1.5 2.0 2.5
2.5 V
2 V
T
C
= 55°C
25°C
125°C
V
GS
= 4.5 V
V
GS
= 2.5 V
5
4
3
2
1
0
0234
0.30
0.25
0.15
0.05
0
0246810
600
300
200
100
0
048121620
C
iss
C
rss
V
DS
= 10 V
I
D
= 3.1 A
1.6
1.4
1.2
1.0
0.8
0.6
50 25 0 25 50 75 100 125 15
0
V
GS
= 4.5 V
I
D
= 3.1 A
1
1.5 V
3.
5
3.0
0.20
0.10
500
400
V
DS
, DraintoSource Voltage (V) V
GS
, GatetoSource Voltage (V)
I
D,
Drain Current (A)
I
D
, Drain Current (A)
V
DS
, DraintoSource Voltage (V)
C, Capacitance (pF)
r
DS(on),
OnResistance (
Ω )
Q
g,
Total Gate Charge (nC)
V
GS,
GatetoSource Voltage (V)
(Normalized)
T
J
, Junction Temperature (°C)
I
D,
Drain Current (A)
r
DS(on),
OnResistance (
Ω )
Figure 1. Output Characteristics Figure 2. Transfer Characteristics
Figure 3. OnResistance vs. Drain Current Figure 4. Capacitance
Figure 5. Gate Charge Figure 6. OnResistance vs.
Junction Temperature

NTHD5904T1

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
MOSFET 2N-CH 20V 3.1A CHIPFET
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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