NTHD5904T1
http://onsemi.com
2
THERMAL CHARACTERISTICS
Characteristic Symbol Typ Max Unit
Maximum Junction−to−Ambient (Note 2)
t v 5 sec
Steady State
R
thJA
50
90
60
110
°C/W
Maximum Junction−to−Foot (Drain)
Steady State
R
thJF
30 40 °C/W
ELECTRICAL CHARACTERISTICS (T
J
= 25°C unless otherwise noted)
Characteristic
Symbol Test Condition Min Typ Max Unit
Static
Gate Threshold Voltage
V
GS(th)
V
DS
= V
GS
, I
D
= 250 mA
0.6 − − V
Gate−Body Leakage I
GSS
V
DS
= 0 V, V
GS
= "12 V − − "100 nA
Zero Gate Voltage Drain Current I
DSS
V
DS
= 16 V, V
GS
= 0 V − − 1.0 mA
V
DS
= 16 V, V
GS
= 0 V,
T
J
= 85°C
− − 5.0
On−State Drain Current (Note 3) I
D(on)
V
DS
w 5.0 V, V
GS
= 4.5 V 10 − − A
Drain−Source On−State Resistance (Note 3) r
DS(on)
V
GS
= 4.5 V, I
D
= 3.1 A − 0.065 0.075 W
V
GS
= 2.5 V, I
D
= 2.3 A − 0.115 0.143
Forward Transconductance (Note 3) g
fs
V
DS
= 10 V, I
D
= 3.1 A − 8.0 − S
Diode Forward Voltage (Note 3) V
SD
I
S
= 0.9 A, V
GS
= 0 V − 0.8 1.2 V
Dynamic (Note 4)
Total Gate Charge
Q
g
− 4.0 6.0
nC
Gate−Source Charge Q
gs
V
DS
= 10 V, V
GS
= 4.5 V,
I
= 3.1 A
− 0.6 −
Gate−Drain Charge Q
gd
.
− 1.3 −
Turn−On Delay Time t
d(on)
− 12 18
ns
Rise Time t
r
V
DD
= 10 V, R
L
= 10 W
− 35 55
Turn−Off Delay Time t
d(off)
I
D
^ 1.0 A, V
GEN
= 4.5 V,
R
G
= 6 W
− 19 30
Fall Time t
f
− 9.0 15
Source−Drain Reverse Recovery Time t
rr
I
F
= 0.9 A, di/dt = 100 A/ms
− 40 80
2. Surface Mounted on 1″ x 1″ FR4 Board.
3. Pulse Test: Pulse Width v 300 ms, Duty Cycle v 2%.
4. Guaranteed by design, not subject to production testing.