DW (ADW1)
–6–
ASCTB8E 201603-T
NOTES
1. For cautions for use, please read
“GENERAL APPLICATION
GUIDELINES”.
2. Solder and cleaning conditions
1) Flow solder mounting conditions
Please obey the following conditions
when soldering automatically.
(1) Preheating: within 120°C 248°F
(solder surface terminal portion)
and within 120 seconds
(2) Soldering iron: 260°C±5°C
500°F±41°F (solder
temperature) and within 6
seconds (soldering time)
*Furthermore, because the type
of PC board used and other
factors may influence the
relays, test that the relays
function properly on the actual
PC board on which they are
mounted.
2) Reflow solder mounting (Pin-in-
Paste mounting) conditions
• Cautions to observe when
mounting temperature increases in
the relay are greatly dependent on
the way different parts are located
a PC board and the heating
method of the reflow device.
Therefore, please conduct testing
on the actual device beforehand
after making sure the parts
soldered on the relay terminals
and the top of the relay case are
within the temperature conditions
given above.
3) Since this is not a sealed type relay,
do not clean it as is. Also, be careful
not to allow flux to overflow above
the PC board or enter the inside of
the relay.
3. Max. applied voltage
It is not allowed to apply the
continuous maximum voltage to the
coil.
In order to obtain the specified
performance, please apply nominal
coil voltage.
4. Set/reset pulse time of latching type
relay
Regarding the set/reset pulse time of
the latching type relay, it is
recommended to apply nominal coil
voltage for minimum 30ms pulse
across the coil to secure the sure
operation considering the ambient
temperature and condition change
through service life.
T2
T3
T1
t1 t2
T1 = 150 to 180°C
T
2 = 230°C
T
3 = 250°C
t
1 = 60 to 120 seconds
t
2 = within 30 seconds
302 to 356°F
446°F or more
482°F or less
