NCP1337
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13
Brown−Out
The brown−out protection comparator has a fixed
reference of 500 mV. When the comparator is activated
(i.e., when the input voltage V
IN
is above the starting level),
a 10 mA internal current source is activated and creates an
offset across the bottom resistor of the external resistor
divider. It gives the minimum hysteresis of the brown−out
protection. By adding a series resistor between the divider
and the BO pin, it is possible to adjust (increase) the
hysteresis.
The BO pin also features two additional comparators: the
first one (that toggles at 3.0 V) stops the DRV pulses,
whereas the second one (that toggles at 5.0 V) permanently
latches off the controller (the V
CC
should be forced below
4.0 V to release the latch).
Figure 8 gives the internal implementation of the BO
pin.
+
-
+
5 V
Permanent Latch
+
-
+
3 V
Enable
Vdd
10 mA current source activated
when V
BOK
is high
+
-
+
500 mV
BOK
BO
Rhyst
V
in
3.3 meg
11 k
Figure 8. Internal Implementation of BO Pin
NCP1337
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14
PACKAGE DIMENSIONS
SOIC−7
D SUFFIX
CASE 751U
ISSUE E
SEATING
PLANE
1
4
58
R
J
X 45
_
K
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B ARE DATUMS AND T
IS A DATUM SURFACE.
4. DIMENSION A AND B DO NOT INCLUDE
MOLD PROTRUSION.
5. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
S
D
H
C
DIM
A
MIN MAX MIN MAX
INCHES
4.80 5.00 0.189 0.197
MILLIMETERS
B 3.80 4.00 0.150 0.157
C 1.35 1.75 0.053 0.069
D 0.33 0.51 0.013 0.020
G 1.27 BSC 0.050 BSC
H 0.10 0.25 0.004 0.010
J 0.19 0.25 0.007 0.010
K 0.40 1.27 0.016 0.050
M 0 8 0 8
N 0.25 0.50 0.010 0.020
S 5.80 6.20 0.228 0.244
−A−
−B−
G
M
B
M
0.25 (0.010)
−T−
B
M
0.25 (0.010) T
S
A
S
M
7 PL
____
1.52
0.060
7.0
0.275
0.6
0.024
1.270
0.050
4.0
0.155
ǒ
mm
inches
Ǔ
SCALE 6:1
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
NCP1337
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15
PACKAGE DIMENSIONS
PDIP−7 (PDIP−8 LESS PIN 7)
P SUFFIX
CASE 626B
ISSUE C
14
58
b2
NOTE 8
D
b
L
A1
A
eB
E
A
TOP VIEW
C
SEATING
PLANE
0.010 CA
SIDE VIEW
END VIEW
END VIEW
WITH LEADS CONSTRAINED
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCHES.
3. DIMENSIONS A, A1 AND L ARE MEASURED WITH THE PACK-
AGE SEATED IN JEDEC SEATING PLANE GAUGE GS−3.
4. DIMENSIONS D, D1 AND E1 DO NOT INCLUDE MOLD FLASH
OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS ARE NOT
TO EXCEED 0.10 INCH.
5. DIMENSION E IS MEASURED AT A POINT 0.015 BELOW DATUM
PLANE H WITH THE LEADS CONSTRAINED PERPENDICULAR
TO DATUM C.
6. DIMENSION E3 IS MEASURED AT THE LEAD TIPS WITH THE
LEADS UNCONSTRAINED.
7. DATUM PLANE H IS COINCIDENT WITH THE BOTTOM OF THE
LEADS, WHERE THE LEADS EXIT THE BODY.
8. PACKAGE CONTOUR IS OPTIONAL (ROUNDED OR SQUARE
CORNERS).
E1
M
8X
c
D1
B
H
NOTE 5
e
e/2
A2
NOTE 3
M
B
M
NOTE 6
M
DIM MIN MAX
INCHES
A −−−− 0.210
A1 0.015 −−−−
b 0.014 0.022
C 0.008 0.014
D 0.355 0.400
D1 0.005 −−−−
e 0.100 BSC
E 0.300 0.325
M −−−− 10
−− 5.33
0.38 −−
0.35 0.56
0.20 0.36
9.02 10.16
0.13 −−
2.54 BSC
7.62 8.26
−−− 10
MIN MAX
MILLIMETERS
E1 0.240 0.280 6.10 7.11
b2
eB −−−− 0.430 −− 10.92
0.060 TYP 1.52 TYP
A2 0.115 0.195 2.92 4.95
L 0.115 0.150 2.92 3.81
°°
NCP1337/D
Soft−Skip is a trademark of Semiconductor Components Industries, LLC (SCILLC).
P
UBLICATION ORDERING INFORMATION
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SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed
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NCP1337DR2G

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
Switching Controllers PWM CONTROLLER
Lifecycle:
New from this manufacturer.
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