AYF353925

FPC connectors Y3BL (0.3mm pitch)
–4–
ACCTB52E 201602-T
EMBOSSED TAPE DIMENSIONS (Unit: mm)
• Dimension table (Unit: mm)
• Connector orientation with respect to embossed tape feeding direction
NOTES
Number of pins Type of taping A B C Quantity per reel
7 to 15 Tape I 16.0 7.5 17.4 5,000
23 to 45 Tape I 24.0 11.5 25.4 5,000
51 Tape II 32.0 14.2 33.4 5,000
• Specifications for taping • Specifications for the plastic reel
(In accordance with EIAJ ET-7200B.)
Leading direction after packaging
Leading direction after packaging
1.50 dia.
+0.1
0.0
(1.75)(B)
(2.0)
(4.0)
(8.0)
(A )
+0.3
0.1
(A±0.3)
Tape I Tape II
(28.4)
1.50 dia.
+0.1
0.0
(2.0)
(4.0)
(8.0)
(1.75)(B)
Embossed mounting-hole
Taping reel
Top cover tape
Embossed carrier tape
380 dia.
(C±1)
Label
Type
Direction
of tape progress
Y3BL
1. Recommended PC board and metal
mask patterns
Connectors are mounted with high pitch
density, intervals of contact pitch 0.4 mm,
0.5 mm or 0.6 mm.
In order to reduce solder and flux rise,
solder bridges and other issues make
sure the proper levels of solder is used.
The figures to the right are recommended
metal mask patterns. Please use our
recommended patterns basically.
Recommended PC board pattern
(mounting layout)
Recommended metal mask pattern
Metal mask thickness: When 120μm
(Front terminal portion opening area ratio: 74%)
(Back terminal portion opening area ratio: 96%)
(Soldering terminal portion opening area ratio: 54%)
0.28±0.03
0.60±0.03
0.30±0.03
0.23±0.03
0.70±0.03
0.23±0.03
0.60±0.03
0.075±0.03
0.84±0.03
0.34±0.03
0.44±0.03
3.15±0.03
0.30±0.03
0.60±0.01
0.22±0.01
0.22±0.01
0.60±0.01
0.22±0.01
0.70±0.01
0.245±0.01
0.58±0.01
3.15±0.01
(2.47)
0.34±0.01
0.34±0.01
Please refer to the latest product
specifications when designing your
product.
Notes on Using FPC Connectors
–1–
ACCTB13E 201701-T
Notes on Using FPC Connectors
About safety Remarks
• Do not use these connectors beyond the specification sheets.
The usage outside of specified rated current, dielectric strength,
and environmental conditions and so on may cause circuitry
damage via abnormal heating, smoke, and fire.
• In order to avoid accidents, your thorough specification review
is appreciated.
Please contact us if your usage is out of the specifications.
Otherwise, Panasonic Corporation cannot guarantee the quality
and reliability.
• Panasonic Corporation is consistently striving to improve
quality and reliability.
However, the fact remains that electrical components and
devices generally cause failures at a given statistical probability.
Furthermore, their durability varies with use environments or use
conditions. In this respect, please check for actual electrical
components and devices under actual conditions before use.
Continued usage in a state of degraded condition may cause the
deteriorated insulation, thus result in abnormal heat, smoke or
firing. Please carry out safety design and periodic maintenance
including redundancy design, design for fire spread prevention,
and design for malfunction prevention so that no accidents
resulting in injury or death, fire accidents, or social damage will
be caused as a result of failure of the products or ending life of
the products.
PC board design
• Design the recommended foot pattern in order to secure the
mechanical strength in the soldered areas of the terminal.
• In order to facilitate the connector mount, make sure to design
the board with reduced warpage.
• Please design and pay attention to the distance from the board
edge to the pattern. When cutting the board, do not give an
excessive stress to the connector, which risks damaging the
connector.
(Y3BW/Y5BW)
• Depending on FPC dimension and FPC insertion location,
there is a possibility that the holding contact and an FPC pattern
of both end of signal contacts are in short-circuited.
Please design the equipment not to be affected even if a board
pattern of holding contacts and an FPC pattern of both end of
signal contacts are in short-circuited.
(For example: Do not connect a board pattern of holding
contacts and GND. If connect a board pattern of holding
contacts and GND, also connect board pattern of both end of
signal contacts.)
FPC and equipment design
• Design the FPC based with recommended dimensions to
ensure the required connector performance.
When back lock type is used, secure enough space for closing
the lever and for open-close operation of the lever.
• Make sure that connector positioning and FPC length are
appropriate to prevent diagonal insertion of the FPC.
• Due to the FPC size, weight, or the reaction force of the routed
FPC, FPC removed and connector deformation may occur by a
fall, vibration, or other impact.
When using FPC connector for smart phones, cellular phones
and other applications which require falling resistance, please
pay attention to precautions.
• Carefully check the equipment design and take required
measures to prevent the FPC removed.
• If the shock of falling, vibration is applied to the FPC, please
design the equipment not to be applied a load to connector, such
as fixing the FPC.
• Make sure to design the FPC insertion part with reduced
warpage. Otherwise, the warpage may adversely affect the FPC
insertion.
Connector mounting
• Excessive mounter chucking force may deform the molded or
metal part of the connector. Consult us in advance if chucking is
to be applied.
• In case of dry condition, please note the occurrence of static
electricity.
The product may be adhered to the embossed carrier tape or
the cover tape in dry condition.
Recommended humidity is from 40%RH to 60%RH and please
remove static electricity by ionizer in manufacturing process.
(Y4BH)
When using in high-speed transmission applications,
please take care when designing the FPC/FFC, because the
differential impedance values may be uneven depending on
FPC/FFC dimensions settings, uneven dimensions, and
layering composition.
(Y3BW/Y5BW)
The holding contacts cannot be used as conductors.
The holding contacts are located on both ends of the
connector, and the shape of the soldered portions is the
same as that of the signal contacts.
Use caution to ensure connect identification.
(Y3BL)
Soldering terminal structure
• Since soldering terminals touch FPC, note that the short
circuit may occur when the metal parts exposed on side of
FPC.
• Depending on FPC dimension, there is a possibility that
soldering terminals and an FPC pattern of both end of signal
contacts are in short-circuited.
Please design the equipment not to be affected even if a
board pattern of soldering terminals and an FPC pattern of
both end of signal contacts are in short-circuited.
(For example: Do not connect a board pattern of soldering
terminals and GND. If connect a board pattern of soldering
terminals and GND, also connect board pattern of both end of
signal contacts.)
Notes on Using FPC Connectors
–2–
ACCTB13E 201701-T
Soldering
1) Manual soldering
• As this product is compact size, please avoid the excessive
solder. Because the excessive solder makes creepage and flux
wicking at contact portion, or impact contact by soldering
interference.
• Please use the soldering iron under specified temperature and
times.
• Soldering flux may contaminate the contact portion, please
check the contact portion after soldering with a magnifying
glass. If the contamination is found, please clean the
contamination before use.
• As excessive force to terminal by manual soldering has some
possibilities of contact portion deformation, please be careful to
the force by hand.
• Please clean soldering iron tip.
• Make sure that the soldering iron tip is heated within the
temperature and time limits indicated in the specifications.
• Flux from the solder wire may adhere to the contact surfaces
during soldering operations. After soldering, carefully check the
contact surfaces and cleans off any flux solder use.
• Be aware that a load applied to the connector terminals while
soldering may displace the contact.
Thoroughly clean the iron tip.
2) Reflow soldering
When cream solder printing is used, screen method is
recommended.
To achieve the appropriate soldering state, make sure that the
reflow temperature, PC board foot pattern, window size and
thickness of metal mask are recommended condition.
• Note that excess solder on the terminals prevents complete
insertion of the FPC, and causes flux climbing up.
• A screen thickness of 120μm is recommended during cream
solder printing.
When applying the different thickness of a screen, please
contact us.
There may be a case of difficult self-alignment depending on
the connector size. In that case, please be careful to align
terminals and solder pads.
The following diagram shows the recommended reflow
soldering temperature profile.
• Infrared reflow soldering is able to passed two times.
The temperature is measured on the PC board surface near
connector terminals.
The condition of solder or flux creepage and wettability depend
on the type of solder and flux. Please set the reflow temperature
and oxygen level by considering the solder and flux
characteristics.
• Do not use resin-containing solder. Otherwise, the contacts
might be firmly fixed.
When performing reflow soldering on the back of the PC board
after reflow soldering the connector, secure the connector using,
for example, an adhesive.
(Double reflow soldering on the same side is possible.)
Do not apply refl
ow heating while a lever is closing (or on the
way of closing). The terminals may be deformed by reflow
heating with a lever is closing (or on the way of closing).
3) Rework of soldering portion.
• Rework shall be only one time.
• Please avoid the supplementary flux in case of rework for
soldering bridge, as this may cause flux creepage to contact
portion.
When adding the solder for reworking, do not add an excessive
solder.
• Please use the soldering iron under specified temperature.
As the excessive force on the terminals may cause the
deformation and the integrity of solderability will be lost
during reflow soldering, please avoid dropping or rough
handling of the product.
When the soldering is not completed, do not open/ close
the lever or insert/ remove an FPC.
And the external compulsory force to the terminal may
cause the fixing force lowering between the terminal and
the molding or the coplanarity failures.
In addition, do not insert an FPC into the connector before
soldering the connector.
When cutting or bending the PC board after mounting the
connector, please avoid the stress at the soldering portion.
PC board
As thick coverlay / solder resist and adhesive may cause poor
soldering, please set thickness of coverlay and adhesive as thin
as possible.
Precautions for insertion/removal of FPC
These connectors are of the back lock type, which has the FPC
insertion section on the opposite side of the lever.
Be careful not to make a mistake in the FPC insertion position or
the lever opening/closing position. Otherwise, a contact failure or
connector breakage may occur.
• Do not insert an FPC upside down. Inserting an FPC in a
direction opposite to that you intended may cause an operation
failure or malfunction.
• Insert an FPC with the lever opened at right angle, that is, in
the factory default position.
150°C
180°C
230°C
220°C
200°C
260°C
Temperature
Upper limit (Soldering heat resistance)
Lower limit (Solder wettability)
Preheating
Peak temperature
Time
25 sec.
70 sec.60 to 120 sec.
(Except for Y3BC)
• A
void touching the lever (applying any external force) until
an FPC is inserted.
Do not open/close the lever without an FPC inserted. Failure
to follow this instruction will cause the contacts to warp,
leading to the contact tips to interfere with the insertion of an
FPC, deforming the terminals. Failure to follow this
instruction may cause the lever to be removed, terminals to
be deformed, and/or the FPC insertion force to increase.
No stress here
Without an FPC inserted

AYF353925

Mfr. #:
Manufacturer:
Panasonic Industrial Devices
Description:
FFC & FPC Connectors FPC Y3BL - Contact PEW to purchase non-stock item
Lifecycle:
New from this manufacturer.
Delivery:
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