NCV8508B
http://onsemi.com
22
PACKAGE DIMENSIONS
0.539
D
PAK−7 (SHORT LEAD)
CASE 936AB−01
ISSUE B
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
E 0.380 0.420 9.65 10.67
D 0.325 0.368 8.25 9.53
A 0.170 0.180 4.32 4.57
b 0.026 0.036 0.66 0.91
c2 0.045 0.055 1.14 1.40
e 0.050 BSC 1.27 BSC
H 0.579 13.69 14.71
L1
A1 0.000 0.010 0.00 0.25
c 0.017 0.026 0.43 0.66
E
D
L1
c2
c
b
e
E1
D1
H
−−− 0.066 −−− 1.68
L 0.058 0.078 1.47 1.98
M
L3 0.010 BSC 0.25 BSC
0 8 °°0 8 °°
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
RECOMMENDED
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCHES.
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH AND GATE PROTRUSIONS. MOLD FLASH
AND GATE PROTRUSIONS NOT TO EXCEED
0.005 MAXIMUM PER SIDE. THESE DIMENSIONS
TO BE MEASURED AT DATUM H.
4. THERMAL PAD CONTOUR OPTIONAL WITHIN
DIMENSIONS E, L1, D1, AND E1. DIMENSIONS
D1 AND E1 ESTABLISH A MINIMUM MOUNTING
SURFACE FOR THE THERMAL PAD.
D1 0.270 −−− 6.86 −−−
E1 0.245 −−− 6.22 −−−
A
DIMENSIONS: MILLIMETERS
0.424
7X
0.584
0.310
0.136
0.040
0.050
PITCH
SOLDERING FOOTPRINT*
A1
L3
B
H
L
M
DETAIL C
SEATING
PLANE
GAUGE
PLANE
A
7X
M
A
M
0.13 B
E/2
B
SEATING
PLANE
A
A
DETAIL C
VIEW A−A
M
A
M
0.10 B
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