VSMY98545
www.vishay.com
Vishay Semiconductors
Rev. 1.3, 01-Jul-16
1
Document Number: 81223
For technical questions, contact: emittertechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
High Power Infrared Emitting Diode, 850 nm,
Surface Emitter Technology
DESCRIPTION
As part of the SurfLight
TM
portfolio, the VSMY98545 is an
infrared, 850 nm emitting diode based on surface emitter
technology with high radiant power and high speed, molded
in low thermal resistance SMD package with lens. A 42 mil
chip provides outstanding low forward voltage and allows
DC operation of the device up to 1.5 A.
FEATURES
• Package type: surface mount
• Package form: high power SMD with lens
• Dimensions (L x W x H in mm): 3.85 x 3.85 x 2.24
• Peak wavelength: λ
p
= 850 nm
• High reliability
• High radiant power
• High radiant intensity
• Angle of half intensity: ϕ = ± 45°
• Low forward voltage
• Designed for high drive currents: up to 1.5 A (DC) and up
to 5 A pulses
• Low thermal resistance: R
thJP
= 10 K/W
• Floor life: 168 h, MSL 3, according to J-STD-020
• Lead (Pb)-free reflow soldering
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
APPLICATIONS
• Infrared illumination for CMOS cameras (CCTV)
• Illumination for cameras (3D gaming)
• Machine vision
• Bio identification
Note
• Test conditions see table “Basic Characteristics”
Note
• MOQ: minimum order quantity
PRODUCT SUMMARY
COMPONENT I
e
(mW/sr) ϕ (deg) λ
p
(nm)
t
r
(ns)
VSMY98545 380 ± 45 850 15
ORDERING INFORMATION
ORDERING CODE PACKAGING REMARKS PACKAGE FORM
VSMY98545 Tape and reel MOQ: 600 pcs, 600 pcs/reel High power with lens
ABSOLUTE MAXIMUM RATINGS (T
amb
= 25 °C, unless otherwise specified)
PARAMETER TEST CONDITION SYMBOL VALUE UNIT
Reverse voltage V
R
5V
Forward current I
F
1.5 A
Peak forward current t
p
/T = 0.5, t
p
= 100 μs I
FM
2A
Surge forward current t
p
= 100 μs I
FSM
5A
Power dissipation P
V
3.5 W
Junction temperature T
j
115 °C
Operating temperature range T
amb
-40 to +85 °C
Storage temperature range T
stg
-55 to +100 °C
Soldering temperature According to Fig. 10, J-STD-20 T
sd
260 °C
Thermal resistance junction / pin JESD 51 R
thJP
10 K/W