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VSMY98545

P1-P3P4-P6P7-P7
VSMY98545
www.vishay.com
Vishay Semiconductors
Rev. 1.3, 01-Jul-16
4
Document Number: 81223
For technical questions, contact: emittertechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Fig. 9 - Relative Radiant Intensity vs. Angular Displacement
TAPING DIMENSIONS in millimeters
Notes
• Empty component pockets sealed with top cover tape.
• 7 inch reel - 600 pieces per reel.
• The maximum number of consecutive missing lamps is two.
• In accordance with ANSI / EIA 481-1-A-1994 specifications.
I
e, rel
- Relative Radiant Intensity
0.6
80°
0°
0.7
0.4 0.2 0
30°
70°
60°
50°
40°
10° 20°
1.0
0.9
0.8
ϕ
- Angular Displacement
Ø 13.0
(0.512)
typ.
14.40 (0.57) typ.
Ø 60.0 ± 1.0
(2.36 ± 0.039)
Ø 178 ± 2.0
(7.0 ± 0.08)
4.00 ± 0.10
8.00 ± 0.10
12.00
+ 0.30
- 0.10
2.00 ± 0.05
1.75 ± 0.10
5.50 ± 0.05
Ø 1.50 + 0.10
Ø 1.50 + 0.25
Cathode
VSMY98545
www.vishay.com
Vishay Semiconductors
Rev. 1.3, 01-Jul-16
5
Document Number: 81223
For technical questions, contact: emittertechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
PACKAGE DIMENSIONS in millimeters
Notes
• Tolerance is ± 0.10 mm (0.004") unless otherwise noted.
• Specifications are subject to change without notice.
Ø 2.76
3.85 ± 0.1
3.85 ± 0.1
2.24 ± 0.1
0.40 ± 0.05
0.15 ± 0.05
R0.15
R1.38
2.80
1.00
1.90
2.70
Anode
Cathode
1.00.5
2.8
2.8
VSMY98545
www.vishay.com
Vishay Semiconductors
Rev. 1.3, 01-Jul-16
6
Document Number: 81223
For technical questions, contact: emittertechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SOLDER PROFILE
Fig. 10 - Lead (Pb)-free Reflow Solder Profile
According to J-STD-020
DRYPACK
Devices are packed in moisture barrier bags (MBB) to
prevent the products from moisture absorption during
transportation and storage. Each bag contains a desiccant.
FLOOR LIFE
Floor life (time between soldering and removing from MBB)
must not exceed the time indicated on MBB label:
Floor life: 168 h
Conditions: T
amb
< 30 °C, RH < 60 %
Moisture sensitivity level 3, according to J-STD-020B
DRYING
In case of moisture absorption devices should be baked
before soldering. Conditions see J-STD-020 or label.
Devices taped on reel dry using recommended conditions
192 h at 40 °C (+ 5 °C), RH < 5 %.
255 °C to 260 °C
10 s max.
6 °C/s max.
3 °C/s max.
3 °C/s max.
150 °C
200 °C
217 °C
60 s to 120 s
60 s max.
Time
Temperature
22932
P1-P3P4-P6P7-P7

VSMY98545

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Infrared Emitters - High Power 45Degree 350mW 850nm
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