LPC2387 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 5.1 — 16 October 2013 61 of 66
NXP Semiconductors
LPC2387
Single-chip 16-bit/32-bit MCU
17. Revision history
Table 19. Revision history
Document ID Release date Data sheet status Change notice Supersedes
LPC2387 v.5.1 20131016 Product data sheet - LPC2387 v.5
Modifications:
Table 3 “Pin description, Table note 6: Changed glitch filter spec from 5 ns to 10 ns.
Table 8 “Dynamic characteristics: Changed min clock cycle time from 42 to 40.
LPC2387 v.5 20120109 Product data sheet - LPC2387 v.4
Modifications:
Table 3 “Pin description”: Added Table note 7 “This pin has no built-in pull-up and no built-in
pull-down resistor.” for TCK and TDO pins.
Table 3 “Pin description”: Added Table note 8 “This pin has a built-in pull-up resistor.” for
TMS, TDI, TRST, and RTCK pins.
Table 3 “Pin description”: Updated description for USB_UP_LED.
Added Table 6 “Thermal resistance value (C/W): ±15 %”.
Table 4 “Limiting values”: Added “non-operating” to conditions column of T
stg
.
Table 4 “Limiting values”: Updated Table note 5 “The maximum non-operating storage
temperature is different than the temperature for required shelf life which should be
determined based on required shelf lifetime. Please refer to the JEDEC specification
(J-STD-033B.1) for further details.”.
Section 14.5 “Standard I/O pin configuration”: Updated bullets.
LPC2387 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 5.1 — 16 October 2013 62 of 66
NXP Semiconductors
LPC2387
Single-chip 16-bit/32-bit MCU
LPC2387 v.4 20110210 Product data sheet - LPC2387 v.3
Modifications:
Table 3 “Pin description”: Added Table note 9 for XTAL1 and XTAL2 pins.
Table 3 “Pin description”: Added Table note 10 for RTCX1 and RTCX2 pins.
Table 4 “Limiting values”: Changed V
ESD
min/max to 2500/+2500.
Table 7 “Static characteristics”: Removed R
pu
.
Table 7 “Static characteristics”, Table note 13: Changed value from 18 to 33.
Table 7 “Static characteristics”: Updated min, typical and max values for oscillator pins.
Table 7 “Static characteristics”: Updated conditions and typical values for I
DD(DCDC)pd(3V3)
,
I
BATact
; added I
DD(DCDC)dpd(3V3)
and I
BAT
.
Table 7 “Static characteristics”: Changed I
2
C-bus V
hys
typical from 0.5V
DD
to 0.05V
DD
.
Section 2 “Features and benefits”: Added deep power-down information.
Section 7.2 “On-chip flash programming memory” “On-chip flash programming memory”:
Removed text regarding flash endurance minimum specs.
Section 7.23 “RTC and battery RAM”: Added deep power-down information.
Section 7.24.2 “PLL”: Changed input clock frequency max to 25 MHz.
Section 7.24.3 “Wake-up timer”: Added deep power-down information.
Section 7.24.4 “Power control”: Added deep power-down information.
Added Section 7.24.4.4 “Deep power-down mode”.
Section 7.25.2 “Brownout detection”: Changed V
DD(3V3)
to V
DD(DCDC)(3V3)
.
Added Section 9 “Thermal characteristics”.
Added Section 10.1 “Power-down mode”.
Added Section 10.2 “Deep power-down mode”.
Added Section 10.3 “Electrical pin characteristics”.
Added Section 11.1 “Internal oscillators”.
Added Section 11.2 “I/O pins”.
Added Section 11.4 “Flash memory”.
Added Section 13 “DAC electrical characteristics”.
Added Section 14.2 “Crystal oscillator XTAL input and component selection”.
Added Section 14.3 “RTC 32 kHz oscillator component selection”.
Added Section 14.4 “XTAL and RTCX Printed Circuit Board (PCB) layout guidelines”.
Added Section 14.5 “Standard I/O pin configuration”.
Added Section 14.6 “Reset pin configuration”.
Moved Figure 12 “External clock timing (with an amplitude of at least V
i(RMS)
= 200 mV)” to
below Table 8 “Dynamic characteristics”.
LPC2387 v.3 20081029 Product data sheet - LPC2387 v.2
Modifications:
Added USB host/OTG features
Table 4: changed storage temperature range from 40 C/125 C to 65 C/150 C.
Table 6, V
hys
, moved 0.4 from Typ to Min column.
Table 6, V
I
, added Table note 8.
Table 6: updated Table note 10.
LPC2387 v.2 20080201 Product data sheet - LPC2387 v.1
LPC2387 v.1 20080114 Product data sheet - -
Table 19. Revision history
…continued
Document ID Release date Data sheet status Change notice Supersedes
LPC2387 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 5.1 — 16 October 2013 63 of 66
NXP Semiconductors
LPC2387
Single-chip 16-bit/32-bit MCU
18. Legal information
18.1 Data sheet status
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
18.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
18.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
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In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
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Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
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changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
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authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
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Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms
, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
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applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
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construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Document status
[1][2]
Product status
[3]
Definition
Objective [short] data sheet Development This document contains data from the objective specification for product development.
Preliminary [short] data sheet Qualification This document contains data from the preliminary specification.
Product [short] data sheet Production This document contains the product specification.

LPC2387FBD100,551

Mfr. #:
Manufacturer:
NXP Semiconductors
Description:
ARM Microcontrollers - MCU 16/32 bit micro
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