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PCK351DB,118

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18
PCK351_2 © Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet Rev. 02 — 16 December 2005 16 of 18
Philips Semiconductors
PCK351
1 : 10 clock distribution device with 3-state outputs
[4] These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the
solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink
on the top side, the solder might be deposited on the heatsink surface.
[5] If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
[6] Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
[7] Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger
than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
[8] Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered
pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by
using a hot bar soldering process. The appropriate soldering profile can be provided on request.
[9] Hot bar soldering or manual soldering is suitable for PMFP packages.
14. Revision history
Table 12: Revision history
Document ID Release date Data sheet status Change notice Doc. number Supersedes
PCK351_2 20051216 Product data sheet - - PCK351-01
Modifications:
• The format of this data sheet has been redesigned to comply with the new presentation and
information standard of Philips Semiconductors.
• Section 2 “Features”: deleted (old) 12th bullet
• Table 2 “Ordering information”: changed “Temperature range = −65 °C to +150 °C” to
“T
amb
= −40 °C to +85 °C”
• Table 5 “Limiting values”:
– removed (old) Table note [1]; this is now presented in the Definitions section
– symbol “I
O
” changed to “I
O(sink)
”
– row “I
CC
, I
GND
” split to 2 rows, and parameter for each revised
• Table 6 “Recommended operating conditions”:
– moved (old) Table note [1] to description below table title
– split row “t
r
, t
f
”
• Table 7 “Static characteristics”: changed parameter description of V
IK
from “input diode voltage”
to “input clamping voltage”
• Table 8 “Dynamic characteristics”:
– in descriptive line below table title: changed “t
r
=t
f
= ≤ 3.0 ns” to “t
r
=t
f
= ≤ 2.5 ns”
– (V
CC
= 3.3 V) typical value for t
PLH
and t
PHL
(A to Yn) changed from 3.6 ns to 3.8 ns
– (V
CC
= 3.3 V) typical value for t
PHZ
and t
PZH
(OE to Yn) changed from 4.0 ns to 3.8 ns
– (V
CC
= 3.3 V) t
r
and t
f
minimum values changed from “-” to “0.3 ns”; maximum values
changed from “-” to “2.0 ns”
– subheading “V
CC
= 3.3 to 3.6 V; T
amb
=0°Cto+70°C” changed to
“V
CC
= 3.0 V to 3.6 V; T
amb
= −40 °C to +85 °C”
– (V
CC
= 3.0 V to 3.6 V) values for t
PLH
and t
PHL
(A to Yn) changed from “-” to “2.5 ns” (min),
“3.3 ns” (typ), “5.9 ns” (max)
– (V
CC
= 3.0 V to 3.6 V) t
r
and t
f
minimum values changed from “-” to “0.3 ns”; maximum values
changed from “-” to “2.0 ns”
PCK351-01 20020514 Product data 853-2344 28198 9397 750 09791 -
Philips Semiconductors
PCK351
1 : 10 clock distribution device with 3-state outputs
PCK351_2 © Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet Rev. 02 — 16 December 2005 17 of 18
15. Data sheet status
[1] Please consult the most recently issued data sheet before initiating or completing a design.
[2] The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at
URL http://www.semiconductors.philips.com.
[3] For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
16. Definitions
Short-form specification — The data in a short-form specification is
extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.
Limiting values definition — Limiting values given are in accordance with
the Absolute Maximum Rating System (IEC 60134). Stress above one or
more of the limiting values may cause permanent damage to the device.
These are stress ratings only and operation of the device at these or at any
other conditions above those given in the Characteristics sections of the
specification is not implied. Exposure to limiting values for extended periods
may affect device reliability.
Application information — Applications that are described herein for any
of these products are for illustrative purposes only. Philips Semiconductors
makes no representation or warranty that such applications will be suitable for
the specified use without further testing or modification.
17. Disclaimers
Life support — These products are not designed for use in life support
appliances, devices, or systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips Semiconductors
customers using or selling these products for use in such applications do so
at their own risk and agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Right to make changes — Philips Semiconductors reserves the right to
make changes in the products - including circuits, standard cells, and/or
software - described or contained herein in order to improve design and/or
performance. When the product is in full production (status ‘Production’),
relevant changes will be communicated via a Customer Product/Process
Change Notification (CPCN). Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no
license or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products are
free from patent, copyright, or mask work right infringement, unless otherwise
specified.
18. Trademarks
Notice — All referenced brands, product names, service names and
trademarks are the property of their respective owners.
19. Contact information
For additional information, please visit: http://www.semiconductors.philips.com
For sales office addresses, send an email to: sales.addresses@www.semiconductors.philips.com
Level Data sheet status
[1]
Product status
[2] [3]
Definition
I Objective data Development This data sheet contains data from the objective specification for product development. Philips
Semiconductors reserves the right to change the specification in any manner without notice.
II Preliminary data Qualification This data sheet contains data from the preliminary specification. Supplementary data will be published
at a later date. Philips Semiconductors reserves the right to change the specification without notice, in
order to improve the design and supply the best possible product.
III Product data Production This data sheet contains data from the product specification. Philips Semiconductors reserves the
right to make changes at any time in order to improve the design, manufacturing and supply. Relevant
changes will be communicated via a Customer Product/Process Change Notification (CPCN).
© Koninklijke Philips Electronics N.V. 2005
All rights are reserved. Reproduction in whole or in part is prohibited without the prior
written consent of the copyright owner. The information presented in this document does
not form part of any quotation or contract, is believed to be accurate and reliable and may
be changed without notice. No liability will be accepted by the publisher for any
consequence of its use. Publication thereof does not convey nor imply any license under
patent- or other industrial or intellectual property rights.
Date of release: 16 December 2005
Document number: PCK351_2
Published in The Netherlands
Philips Semiconductors
PCK351
1 : 10 clock distribution device with 3-state outputs
20. Contents
1 General description . . . . . . . . . . . . . . . . . . . . . . 1
2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
3 Quick reference data . . . . . . . . . . . . . . . . . . . . . 2
4 Ordering information . . . . . . . . . . . . . . . . . . . . . 2
5 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 3
6 Pinning information. . . . . . . . . . . . . . . . . . . . . . 4
6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4
7 Functional description . . . . . . . . . . . . . . . . . . . 5
7.1 Function table . . . . . . . . . . . . . . . . . . . . . . . . . . 5
7.2 Logic symbol. . . . . . . . . . . . . . . . . . . . . . . . . . . 5
8 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 6
9 Recommended operating conditions. . . . . . . . 6
10 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 7
10.1 AC waveforms. . . . . . . . . . . . . . . . . . . . . . . . . . 9
11 Test information. . . . . . . . . . . . . . . . . . . . . . . . 11
12 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 12
13 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
13.1 Introduction to soldering surface mount
packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
13.2 Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 14
13.3 Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 14
13.4 Manual soldering . . . . . . . . . . . . . . . . . . . . . . 15
13.5 Package related soldering information . . . . . . 15
14 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 16
15 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 17
16 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
17 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
18 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
19 Contact information . . . . . . . . . . . . . . . . . . . . 17
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PCK351DB,118

Mfr. #:
Buy PCK351DB,118
Manufacturer:
NXP Semiconductors
Description:
IC CLK BUFFER 1:10 125MHZ 24SSOP
Lifecycle:
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