Si597
4 Rev. 1.1
Table 3. CLK± Output Frequency Characteristics
Parameter Symbol Test Condition Min Typ Max Unit
Nominal Frequency
1,2,3
f
O
LVDS/CML/LVPECL 10 810 MHz
CMOS 10 160 MHz
Temperature Stability
1,4
T
A
= –40 to +85 ºC –20
–50
+20
+50
ppm
ppm
Absolute Pull Range
1,4
APR V
DD
= 3.3 V ±15 ±370 ppm
Power up Time
5
t
OSC
——10ms
Notes:
1. See Section 3. "Ordering Information" on page 8 for further details.
2. Specified at time of order by part number.
3. Nominal output frequency set by V
CNOM
=V
DD
/2.
4. Selectable parameter specified by part number. See “Ordering Information”.
5. Time from power up or tristate mode to f
O
.
Table 4. CLK± Output Levels and Symmetry
Parameter Symbol Test Condition Min Typ Max Unit
LVPECL Output Option
1
V
O
mid-level V
DD
– 1.42 V
DD
– 1.25 V
V
OD
swing (diff) 1.1
1.9 V
PP
V
SE
swing (single-ended) 0.55
0.95 V
PP
LVDS Output Option
2
V
O
mid-level
1.125 1.20 1.275 V
V
OD
swing (diff)
0.5 0.7 0.9 V
PP
CML Output Option
2
V
O
2.5/3.3 V option mid-level V
DD
– 1.30 V
1.8 V option mid-level V
DD
– 0.36 V
PP
V
OD
2.5/3.3 V option swing (diff) 1.10 1.50 1.90 V
1.8 V option swing
(diff) 0.35 0.425 0.50 V
PP
CMOS Output Option
3
V
OH
0.8 x V
DD
V
DD
V
V
OL
——0.4
V
Rise/Fall time (20/80%)
t
R,
t
F
LVPECL/LVDS/CML 350 ps
CMOS with C
L
=15pF 2 ns
Symmetry (duty cycle) SYM LVPECL: V
DD
– 1.3 V (diff)
LVDS: 1.25 V (diff)
CMOS: V
DD
/2
45 55 %
Notes:
1. 50 to V
DD
– 2.0 V.
2. R
term
= 100 (differential).
3. C
L
= 15 pF. Sinking or sourcing 12 mA for V
DD
= 3.3V, 6mA for V
DD
= 2.5V, 3mA for V
DD
= 1.8 V.
Si597
Rev. 1.1 5
Table 5. CLK± Output Phase Jitter
Parameter Symbol Test Condition Min Typ Max Unit
Phase Jitter (RMS)
1,2
for F
OUT
of 50 MHz < F
OUT
<
810 MHz
J
Kv = 45 ppm/V
12 kHz to 20 MHz
—0.5ps
Kv = 95 ppm/V
12 kHz to 20 MHz
—0.5ps
Kv = 125 ppm/V
12 kHz to 20 MHz
—0.5ps
Kv = 185 ppm/V
12 kHz to 20 MHz
—0.5ps
Kv = 380 ppm/V
12 kHz to 20 MHz
—0.7ps
Notes:
1. Differential Modes: LVPECL/LVDS/CML. Refer to AN256 and AN266 for further information.
2. For best jitter and phase noise performance, always choose the smallest K
V
that meets the application’s minimum APR
requirements. See “AN266: VCXO Tuning Slope (K
V
), Stability, and Absolute Pull Range (APR)” for more information.
Table 6. CLK± Output Period Jitter
Parameter Symbol Test Condition Min Typ Max Unit
Period Jitter* J
PER
RMS 3 ps
Peak-to-Peak 35 ps
*Note: Any output mode, including CMOS, LVPECL, LVDS, CML. N = 1000 cycles. Refer to AN279 for further information.
Table 7. CLK± Output Phase Noise (Typical)
Offset Frequency 74.25 MHz
185 ppm/V
LVPECL
148.5 MHz
185 ppm/V
LVPECL
155.52 MHz
95 ppm/V
LVPECL
Unit
100 Hz
1kHz
10 kHz
100 kHz
1MHz
10 MHz
20 MHz
–77
–101
–121
–134
–149
–151
–150
–68
–95
–116
–128
–144
–147
–148
–77
–101
–119
–127
–144
–147
–148
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
Si597
6 Rev. 1.1
Table 8. Environmental Compliance and Package Information
Parameter Conditions/Test Method
Mechanical Shock MIL-STD-883, Method 2002
Mechanical Vibration MIL-STD-883, Method 2007
Solderability MIL-STD-883, Method 2003
Gross and Fine Leak MIL-STD-883, Method 1014
Resistance to Solder Heat MIL-STD-883, Method 2036
Moisture Sensitivity Level J-STD-020, MSL1
Contact Pads Gold over Nickel
Table 9. Thermal Characteristics
(Typical values TA = 25 ºC, V
DD
=3.3V)
Parameter Symbol Test Condition Min Typ Max Unit
Thermal Resistance Junction to Ambient
JA
Still Air 84.6 °C/W
Thermal Resistance Junction to Case
JC
Still Air 38.8 °C/W
Ambient Temperature T
A
–40 85 °C
Junction Temperature T
J
——125°C
Table 10. Absolute Maximum Ratings
1
Parameter Symbol Rating Unit
Maximum Operating Temperature T
AMAX
85 ºC
Supply Voltage, 1.8 V Option V
DD
–0.5 to +1.9 V
Supply Voltage, 2.5/3.3 V Option V
DD
–0.5 to +3.8 V
Input Voltage (any input pin) V
I
–0.5 to V
DD
+ 0.3 V
Storage Temperature T
S
–55 to +125 ºC
ESD Sensitivity (HBM, per JESD22-A114) ESD 2000 V
Soldering Temperature (Pb-free profile)
2
T
PEAK
260 ºC
Soldering Temperature Time @ T
PEAK
(Pb-free profile)
2
t
P
20–40 seconds
Notes:
1. Stresses beyond those listed in Absolute Maximum Ratings may cause permanent damage to the device. Functional
operation or specification compliance is not implied at these conditions. Exposure to maximum rating conditions for
extended periods may affect device reliability.
2. The device is compliant with JEDEC J-STD-020C. Refer to Si5xx Packaging FAQ available for download at
www.silabs.com/VCXO for further information, including soldering profiles.

597FE000700DG

Mfr. #:
Manufacturer:
Silicon Labs
Description:
XTAL OSC VCXO 2.5V 8SMD
Lifecycle:
New from this manufacturer.
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