Si597
6 Rev. 1.1
Table 8. Environmental Compliance and Package Information
Parameter Conditions/Test Method
Mechanical Shock MIL-STD-883, Method 2002
Mechanical Vibration MIL-STD-883, Method 2007
Solderability MIL-STD-883, Method 2003
Gross and Fine Leak MIL-STD-883, Method 1014
Resistance to Solder Heat MIL-STD-883, Method 2036
Moisture Sensitivity Level J-STD-020, MSL1
Contact Pads Gold over Nickel
Table 9. Thermal Characteristics
(Typical values TA = 25 ºC, V
DD
=3.3V)
Parameter Symbol Test Condition Min Typ Max Unit
Thermal Resistance Junction to Ambient
JA
Still Air — 84.6 — °C/W
Thermal Resistance Junction to Case
JC
Still Air — 38.8 — °C/W
Ambient Temperature T
A
–40 — 85 °C
Junction Temperature T
J
——125°C
Table 10. Absolute Maximum Ratings
1
Parameter Symbol Rating Unit
Maximum Operating Temperature T
AMAX
85 ºC
Supply Voltage, 1.8 V Option V
DD
–0.5 to +1.9 V
Supply Voltage, 2.5/3.3 V Option V
DD
–0.5 to +3.8 V
Input Voltage (any input pin) V
I
–0.5 to V
DD
+ 0.3 V
Storage Temperature T
S
–55 to +125 ºC
ESD Sensitivity (HBM, per JESD22-A114) ESD 2000 V
Soldering Temperature (Pb-free profile)
2
T
PEAK
260 ºC
Soldering Temperature Time @ T
PEAK
(Pb-free profile)
2
t
P
20–40 seconds
Notes:
1. Stresses beyond those listed in Absolute Maximum Ratings may cause permanent damage to the device. Functional
operation or specification compliance is not implied at these conditions. Exposure to maximum rating conditions for
extended periods may affect device reliability.
2. The device is compliant with JEDEC J-STD-020C. Refer to Si5xx Packaging FAQ available for download at
www.silabs.com/VCXO for further information, including soldering profiles.