MC14012BDR2G

© Semiconductor Components Industries, LLC, 2014
July, 2014 − Rev. 11
1 Publication Order Number:
MC14012B/D
MC14012B
Dual 4-Input NAND Gates
The MC14012B dual 4−input NAND gates are constructed with
P−Channel and N−Channel enhancement mode devices in a single
monolithic structure (Complementary MOS). Their primary use is
where low power dissipation and/or high noise immunity is desired.
Features
Supply Voltage Range = 3.0 Vdc to 18 Vdc
All Outputs Buffered
Capable of Driving Two Low−Power TTL Loads or One Low−Power
Schottky TTL Load Over the Rated Temperature Range
Double Diode Protection on All Inputs
Pin−for−Pin Replacements for Corresponding CD4000 Series B
Suffix Devices
NLV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q100
Qualified and PPAP Capable
This Device is Pb−Free and is RoHS Compliant
MAXIMUM RATINGS (Voltages Referenced to V
SS
)
Symbol
Parameter Value Unit
V
DD
DC Supply Voltage Range 0.5 to +18.0 V
V
in
, V
out
Input or Output Voltage Range
(DC or Transient)
0.5 to V
DD
+ 0.5 V
I
in
, I
out
Input or Output Current
(DC or Transient) per Pin
± 10 mA
P
D
Power Dissipation, per Package
(Note 1)
500 mW
T
A
Ambient Temperature Range 55 to +125 °C
T
stg
Storage Temperature Range 65 to +150 °C
T
L
Lead Temperature
(8−Second Soldering)
260 °C
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
1. Temperature Derating: “D/DW” Package: –7.0 mW/_C From 65_C To 125_C
This device contains protection circuitry to guard against damage due to high
static voltages or electric fields. However, precautions must be taken to avoid
applications of any voltage higher than maximum rated voltages to this
high−impedance circuit. For proper operation, V
in
and V
out
should be constrained
to the range V
SS
(V
in
or V
out
) V
DD
.
Unused inputs must always be tied to an appropriate logic voltage level
(e.g., either V
SS
or V
DD
). Unused outputs must be left open.
MARKING DIAGRAM
SOIC−14
D SUFFIX
CASE 751A
1
14
14012BG
AWLYWW
A = Assembly Location
WL, L = Wafer Lot
YY, Y = Year
WW, W = Work Week
G = Pb−Free Package
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
ORDERING INFORMATION
http://onsemi.com
MC14012B
http://onsemi.com
2
1
13
3
4
5
2
10
11
12
9
NC = 6, 8
V
DD
= PIN 14
V
SS
= PIN 7
11
12
13
14
8
9
105
4
3
2
1
7
6
IN 2
B
IN 3
B
IN 4
B
OUT
B
V
DD
NC
IN 1
B
IN 3
A
IN 2
A
IN 1
A
OUT
A
V
SS
NC
IN 4
A
MC14012B
Dual 4−Input NAND Gate
NC = NO CONNECTION
Figure 1. Pin Assignment Figure 2. Logic Diagram
ORDERING INFORMATION
Device Package Shipping
MC14012BDG SOIC−14
(Pb−Free)
55 Units / Rail
NLV14012BDG* SOIC−14
(Pb−Free)
55 Units / Rail
MC14012BDR2G SOIC−14
(Pb−Free)
2500 Units / Tape & Reel
NLV14012BDR2G* SOIC−14
(Pb−Free)
2500 Units / Tape & Reel
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP
Capable.
MC14012B
http://onsemi.com
3
ELECTRICAL CHARACTERISTICS (Voltages Referenced to V
SS
)
Characteristic
Symbo
l
V
DD
Vdc
−55_C 25_C 125_C
Unit
Min Max Min
Typ
(Note 2)
Max Min Max
Output Voltage “0” Level
V
in
= V
DD
or 0
V
OL
5.0
10
15
0.05
0.05
0.05
0
0
0
0.05
0.05
0.05
0.05
0.05
0.05
Vdc
“1” Level
V
in
= 0 or V
DD
V
OH
5.0
10
15
4.95
9.95
14.95
4.95
9.95
14.95
5.0
10
15
4.95
9.95
14.95
Vdc
Input Voltage “0” Level
(V
O
= 4.5 or 0.5 Vdc)
(V
O
= 9.0 or 1.0 Vdc)
(V
O
= 13.5 or 1.5 Vdc)
V
IL
5.0
10
15
1.5
3.0
4.0
2.25
4.50
6.75
1.5
3.0
4.0
1.5
3.0
4.0
Vdc
“1” Level
(V
O
= 0.5 or 4.5 Vdc)
(V
O
= 1.0 or 9.0 Vdc)
(V
O
= 1.5 or 13.5 Vdc)
V
IH
5.0
10
15
3.5
7.0
11
3.5
7.0
11
2.75
5.50
8.25
3.5
7.0
11
Vdc
Output Drive Current
(V
OH
= 2.5 Vdc) Source
(V
OH
= 4.6 Vdc)
(V
OH
= 9.5 Vdc)
(V
OH
= 13.5 Vdc)
I
OH
5.0
5.0
10
15
–3.0
–0.64
–1.6
–4.2
–2.4
–0.51
–1.3
–3.4
–4.2
–0.88
–2.25
–8.8
–1.7
–0.36
–0.9
–2.4
mAdc
(V
OL
= 0.4 Vdc) Sink
(V
OL
= 0.5 Vdc)
(V
OL
= 1.5 Vdc)
I
OL
5.0
10
15
0.64
1.6
4.2
0.51
1.3
3.4
0.88
2.25
8.8
0.36
0.9
2.4
mAdc
Input Current I
in
15 ±0.1 ±0.00001 ±0.1 ±1.0
mAdc
Input Capacitance
(V
in
= 0)
C
in
5.0 7.5 pF
Quiescent Current
(Per Package)
I
DD
5.0
10
15
0.25
0.5
1.0
0.0005
0.0010
0.0015
0.25
0.5
1.0
7.5
15
30
mAdc
Total Supply Current (Notes 3, 4)
(Dynamic plus Quiescent,
Per Gate, C
L
= 50 pF)
I
T
5.0
10
15
I
T
= (0.3 mA/kHz) f + I
DD
/N
I
T
= (0.6 mA/kHz) f + I
DD
/N
I
T
= (0.9 mA/kHz) f + I
DD
/N
mAdc
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
2. Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance.
3. The formulas given are for the typical characteristics only at 25_C.
4. To calculate total supply current at loads other than 50 pF:
I
T
(C
L
) = I
T
(50 pF) + (C
L
− 50) Vfk
where: I
T
is in mA (per package), C
L
in pF, V = (V
DD
− V
SS
) in volts, f in kHz is input frequency, and k = 0.001 x the number of exercised
gates per package.

MC14012BDR2G

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
Logic Gates 3-18V Dual 4-Input NAND
Lifecycle:
New from this manufacturer.
Delivery:
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