16
FN8097.3
May 2, 2006
Figure 10. Random Address Read Sequence
Figure 11. Sequential Read Sequence
0
Slave
Address
Word
Address 1
A
C
K
A
C
K
S
t
a
r
t
S
t
o
p
Slave
Address
Data
A
C
K
1
S
t
a
r
t
SDA Bus
Signals from
the Slave
Signals from
the Master
A
C
K
Word
Address 0
1111
1111
0000000
101
101
Data
(2)
S
t
o
p
Slave
Address
Data
(n)
A
C
K
A
C
K
SDA Bus
Signals from
the Slave
Signals from
the Master
1
Data
(n-1)
A
C
K
A
C
K
(n is any integer greater than 1)
Data
(1)
X1205
17
FN8097.3
May 2, 2006
APPLICATION SECTION
CRYSTAL OSCILLATOR AND TEMPERATURE
COMPENSATION
Intersil has now integrated the oscillator compensation
circuity on-chip, to eliminate the need for external
components and adjust for crystal drift over tempera-
ture and enable very high accuracy timekeeping
(<5ppm drift).
The Intersil RTC family uses an oscillator circuit with
on-chip crystal compensation network, including
adjustable load-capacitance. The only external com-
ponent required is the crystal. The compensation net-
work is optimized for operation with certain crystal
parameters which are common in many of the surface
mount or tuning-fork crystals available today. Table 4
summarizes these parameters.
Table 5 contains some crystal manufacturers and part
numbers that meet the requirements for the Intersil
RTC products.
The turnover temperature in Table 4 describes the
temperature where the apex of the of the drift vs. tem-
perature curve occurs. This curve is parabolic with the
drift increasing as (T-T0)
2
. For an Epson MC-405
device, for example, the turnover temperature is typi-
cally 25 deg C, and a peak drift of >110ppm occurs at
the temperature extremes of -40 and +85 deg C. It is
possible to address this variable drift by adjusting the
load capacitance of the crystal, which will result in pre-
dictable change to the crystal frequency. The Intersil
RTC family allows this adjustment over temperature
since the devices include on-chip load capacitor trim-
ming. This control is handled by the Analog Trimming
Register, or ATR, which has 6 bits of control . The load
capacitance range covered by the ATR circuit is
approximately 3.25pF to 18.75pF, in 0.25pf incre-
ments. Note that actual capacitance would also
include about 2pF of package related capacitance. In-
circuit tests with commercially available crystals dem-
onstrate that this range of capacitance allows fre-
quency control from +116ppm to –37ppm, using a
12.5pF load crystal.
In addition to the analog compensation afforded by the
adjustable load capacitance, a digital compensation
feature is available for the Intersil RTC family. There
are three bits known as the Digital Trimming Register
or DTR, and they operate by adding or skipping pulses
in the clock signal. The range provided is ±30ppm in
increments of 10ppm. The default setting is 0ppm. The
DTR control can be used for coarse adjustments of
frequency drift over temperature or for crystal initial
accuracy correction.
Table 4. Crystal Parameters Required for Intersil RTC’s
Table 5. Crystal Manufacturers
Parameter Min Typ Max Units Notes
Frequency 32.768 kHz
Freq. Tolerance ±100 ppm Down to 20ppm if desired
Turnover Temperature 20 25 30 °C Typically the value used for most
crystals
Operating Temperature Range -40 85 °C
Parallel Load Capacitance 12.5 pF
Equivalent Series Resistance 50 kΩ For best oscillator performance
Manufacturer Part Number Temp Range +25°C Freq Toler.
Citizen CM201, CM202, CM200S -40 to +85°C ±20ppm
Epson MC-405, MC-406 -40 to +85°C ±20ppm
Raltron RSM-200S-A or B -40 to +85°C ±20ppm
SaRonix 32S12A or B -40 to +85°C ±20ppm
Ecliptek ECPSM29T-32.768K -10 to +60°C ±20ppm
ECS ECX-306/ECX-306I -10 to +60°C ±20ppm
Fox FSM-327 -40 to +85°C ±20ppm
X1205
18
FN8097.3
May 2, 2006
A final application for the ATR control is in-circuit cali-
bration for high accuracy applications, along with a
temperature sensor chip. Once the RTC circuit is pow-
ered up with battery backup, the PHZ output is set at
32.768kHz and frequency drift is measured. The ATR
control is then adjusted to a setting which minimizes
drift. Once adjusted at a particular temperature, it is
possible to adjust at other discrete temperatures for
minimal overall drift, and store the resulting settings in
the EEPROM. Extremely low overall temperature drift
is possible with this method. The Intersil evaluation
board contains the circuitry necessary to implement
this control.
For more detailed operation see Intersil’s application
note AN154 on Intersil’s website at www.intersil.com.
Layout Considerations
The crystal input at X1 has a very high impedance and
will pick up high frequency signals from other circuits on
the board. Since the X2 pin is tied to the other side of
the crystal, it is also a sensitive node. These signals can
couple into the oscillator circuit and produce double
clocking or mis-clocking, seriously affecting the accu-
racy of the RTC. Care needs to be taken in layout of the
RTC circuit to avoid noise pickup. Below in Figure 12 is
a suggested layout for the X1205 SOIC device.
Figure 12. Suggested Layout for Intersil RTC in SO-8
The X1 and X2 connections to the crystal are to be
kept as short as possible. A thick ground trace around
the crystal is advised to minimize noise intrusion, but
ground near the X1 and X2 pins should be avoided as
it will add to the load capacitance at those pins. Keep
in mind these guidelines for other PCB layers in the
vicinity of the RTC device. A small decoupling capaci-
tor at the Vcc pin of the chip is mandatory, with a solid
connection to ground.
Assembly
Most electronic circuits do not have to deal with
assembly issues, but with the RTC devices assembly
includes insertion or soldering of a live battery into an
unpowered circuit. If a socket is soldered to the board,
and a battery is inserted in final assembly, then there
are no issues with operation of the RTC. If the battery
is soldered to the board directly, then the RTC device
Vback pin will see some transient upset from either
soldering tools or intermittent battery connections
which can stop the circuit from oscillating. Once the
battery is soldered to the board, the only way to assure
the circuit will start up is to momentarily (very short
period of time!) short the Vback pin to ground and the
circuit will begin to oscillate.
Oscillator Measurements
When a proper crystal is selected and the layout guide-
lines above are observed, the oscillator should start up
in most circuits in less than one second. Some circuits
may take slightly longer, but startup should definitely
occur in less than 5 seconds. When testing RTC cir-
cuits, the most common impulse is to apply a scope
probe to the circuit at the X2 pin (oscillator output) and
observe the waveform. DO NOT DO THIS! Although in
some cases you may see a useable waveform, due to
the parasitics (usually 10pF to ground) applied with the
scope probe, there will be no useful information in that
waveform other than the fact that the circuit is oscillat-
ing. The X2 output is sensitive to capacitive impedance
so the voltage levels and the frequency will be affected
by the parasitic elements in the scope probe. Applying a
scope probe can possibly cause a faulty oscillator to
start up, hiding other issues (although in the Intersil
RTC’s, the internal circuitry assures startup when using
the proper crystal and layout).
The best way to analyze the RTC circuit is to power it
up and read the real time clock as time advances, or if
the chip has the PHZ output, look at the output of that
pin on an oscilloscope (after enabling it with the con-
trol register, and using a pullup resistor for an open-
drain output). Alternatively, the X1226/1286/1205
devices have an IRQ- output which can be checked by
setting an alarm for each minute. Using the pulse
interrupt mode setting, the once-per-minute interrupt
functions as an indication of proper oscillation.
Backup Battery Operation
Many types of batteries can be used with the Intersil
RTC products. 3.0V or 3.6V Lithium batteries are
appropriate, and sizes are available that can power a
Intersil RTC device for up to 10 years. Another option
is to use a supercapacitor for applications where Vcc
may disappear intermittently for short periods of time.
X1205

X1205S8

Mfr. #:
Manufacturer:
Renesas / Intersil
Description:
IC RTC CLK/CALENDAR I2C 8-SOIC
Lifecycle:
New from this manufacturer.
Delivery:
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