Package information USBULC6-2M6
6/10
4 Package information
● Epoxy meets UL94, V0
In order to meet environmental requirements, ST (also) offers these devices in ECOPACK®
packages. ECOPACK® packages are Lead-free. The category of second level Interconnect
is marked on the inner box label, in compliance with JEDEC Standard JESD97. The
maximum ratings related to soldering conditions are also marked on the inner box label.
ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.
Note: Product marking may be rotated by 90° for assembly plant differentiation. In no case should
this product marking be used to orient the component for its placement on a PCB. Only pin
1 mark is to be used for this purpose.
Figure 15. Footprint dimensions in mm [inches]
Table 3. Micro QFN 1.45x1.00 6L dimensions
Ref.
Dimensions
Millimeters Inches
Min. Typ. Max. Min. Typ. Max.
A 0.50 0.55 0.60 0.020 0.022 0.024
A1 0.00 0.02 0.05 0.000 0.001 0.002
b 0.18 0.25 0.30 0.007 0.010 0.012
D
(1)
1. ± 0.1 mm
1.45 0.057
E
(1)
1.00 0.039
e
(2)
2. ± 0.05 mm
0.50 0.020
K 0.20 0.008
L 0.30 0.35 0.40 0.012 0.014 0.016
E
D
A
A1
e
b
k
L
N
1
1
2
2
0.50
[0.020]
0.25
[0.010]
0.65
[0.026]
0.30
[0.012]
1.60
[0.063]
