FEBRUARY 8, 2017 7 6-OUTPUT 3.3V PCIE ZERO-DELAY BUFFER
9DBL0641 / 9DBL0651 DATASHEET
Electrical Characteristics–DIF Low-Power HCSL Outputs
Electrical Characteristics–Current Consumption
TA = T
AMB,
Supply Voltages per normal operation conditions, See Test Loads for Loading Conditions
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS NOTES
dV/dt Scope avera
g
in
g
on, fast settin
g
22.84
V/ns
1,2,3
dV/dt Scope avera
g
in
g
on, slow settin
g
1.2 1.9 3.1
V/ns
1,2,3
Slew rate matching
Δ
dV/dt Slew rate matching 7 20
%
1,2,4
Voltage High V
HIGH
660 768 850 7
Voltage Low V
LOW
-150 -11 150 7
Max Voltage Vmax 811 1150 7
Min Voltage Vmin -300 -49 7
Crossing Voltage (abs) Vcross_abs Scope averaging off 250 357 550 mV 1,5
Crossing Voltage (var)
Δ
-Vcross Scope averaging off 14 140 mV 1,6
2
Measured from differential waveform
7
At default SMBus settings.
Slew rate
Statistical measurement on single-ended signal
using oscilloscope math function. (Scope
averaging on)
mV
Measurement on single ended signal using
absolute value. (Scope averaging off)
mV
1
Guaranteed by desi
g
n and characterization, not 100% tested in production.
3
Slew rate is measured through the Vswing voltage range centered around differential 0V. This results in a +/-150mV window around
differential 0V.
4
Matching applies to rising edge rate for Clock and falling edge rate for Clock#. It is measured using a +/-75mV window centered on
the average cross point where Clock rising meets Clock# falling. The median cross point is used to calculate the voltage thresholds the
oscilloscope is to use for the edge rate calculations.
5
Vcross is defined as voltage where Clock = Clock# measured on a component test board and only applies to the differential rising
edge (i.e. Clock rising and Clock# falling).
6
The total variation of all Vcross measurements in any particular system. Note that this is a subset of Vcross_min/max (Vcross
absolute) allowed. The intent is to limit Vcross induced modulation by setting
Δ
-Vcross to be smaller than Vcross absolute.
TA = T
AMB,
Supply Voltages per normal operation conditions, See Test Loads for Loading Conditions
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS NOTES
I
DDA
VDDA, PLL Mode, @100MHz 7 15 mA
I
DD
VDDx, All outputs active @100MHz 17 22 mA
I
DDIO
VDDIO, All outputs active @100MHz 20 25 mA
I
DDAPD
VDDA, CKPWRGD_PD#=0 0.6 2 mA 2
I
DDPD
VDDx, CKPWRGD_PD#=0 3.8 6 mA 2
I
DDIOPD
VDDIO, CKPWRGD_PD#=0 0.04 0.10 mA 2
1
Guaranteed by design and characterization, not 100% tested in production.
2
Input clock stopped.
Powerdown Current
Operating Supply Current
6-OUTPUT 3.3V PCIE ZERO-DELAY BUFFER 8 FEBRUARY 8, 2017
9DBL0641 / 9DBL0651 DATASHEET
Electrical Characteristics–Output Duty Cycle, Jitter, Skew and PLL Characteristics
Electrical Characteristics–Filtered Phase Jitter Parameters - PCIe Common Clocked
(CC) Architectures
TA = T
AMB,
Supply Voltages per normal operation conditions, See Test Loads for Loading Conditions
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS NOTES
-3dB point in High BW Mode (100MHz) 2 3.3 4 MHz 1,5
-3dB point in Low BW Mode (100MHz) 1 1.5 2 MHz 1,5
PLL Jitter Peaking t
JPEAK
Peak Pass band Gain (100MHz) 0.8 2 dB 1
Duty Cycle t
D
C
Measured differentially, PLL Mode 45 50 55 % 1
Duty Cycle Distortion t
DCD
Measured differentially, Bypass Mode -1 0.0 1 % 1,3
t
p
dBYP
Bypass Mode, V
T
= 50% 2500 3406 4500 ps 1
t
p
dPLL
PLL Mode V
T
= 50% -100 8 100 ps 1,4
Skew, Output to Output t
sk3
V
T
= 50% 21 55 ps 1,4
PLL mode 15 50 ps 1,2
Additive Jitter in Bypass Mode 0.1 1 ps 1,2
1
Guaranteed by design and characterization, not 100% tested in production.
2
Measured from differential waveform
3
Duty cycle distortion is the difference in duty cycle between the output and the input clock when the device is operated in bypass mode.
4
All outputs at default slew rate
5
The MIN/TYP/MAX values of each BW setting track each other, i.e., Low BW MAX will never occur with Hi BW MIN.
PLL Bandwidth BW
Skew, Input to Output
Jitter, Cycle to cycle t
jcyc-cyc
T
AMB
= over the specified operating range. Supply Voltages per normal operation conditions, See Test Loads for Loading Conditions
PARAMETER SYMBOL CONDITIONS MIN TYP MAX
INDUSTRY
LIMIT
UNITS Notes
t
jp
hPCIeG1-CC
PCIe Gen 1 23 32 86 ps (p-p) 1,2,3,5
PCIe Gen 2 Lo Band
10kHz < f < 1.5MHz
(PLL BW of 5-16MHz or 8-5MHz, CDR = 5MHz)
0.6 0.8 3
ps
(rms)
1,2,5
PCIe Gen 2 High Band
1.5MHz < f < Nyquist (50MHz)
(PLL BW of 5-16MHz or 8-5MHz, CDR = 5MHz)
1.7
2.1 3.1
ps
(rms)
1,2,5
t
jphPCIeG3-CC
PCIe Gen 3
(PLL BW of 2-4MHz or 2-5MHz, CDR = 10MHz)
0.4
0.48 1
ps
(rms)
1,2,5
t
jphPCIeG4-CC
PCIe Gen 4
(PLL BW of 2-4MHz or 2-5MHz, CDR = 10MHz)
0.4
0.48 0.5
ps
(rms)
1,2,5
t
jphPCIeG1-CC
PCIe Gen 1 0.0 0.01
ps
(p-p)
1,2,5
PCIe Gen 2 Lo Band
10kHz < f < 1.5MHz
(PLL BW of 5-16MHz or 8-5MHz, CDR = 5MHz)
0.0 0.01
ps
(rms)
1,2,4,5
PCIe Gen 2 High Band
1.5MHz < f < Nyquist (50MHz)
(PLL BW of 5-16MHz or 8-5MHz, CDR = 5MHz)
0.0 0.01
ps
(rms)
1,2,4,5
t
jphPCIeG3-CC
PCIe Gen 3
(PLL BW of 2-4MHz or 2-5MHz, CDR = 10MHz)
0.0 0.01
ps
(rms)
1,2,4,5
t
jphPCIeG4-CC
PCIe Gen 4
(PLL BW of 2-4MHz or 2-5MHz, CDR = 10MHz)
0.0 0.01
ps
(rms)
1,2,4,5
1
Applies to all outputs.
5
Driven by 9FGL0841 or equivalent
Phase Jitter,
PLL Mode
t
jphPCIeG2-CC
Additive Phase Jitter,
Bypass mode
n/a
t
jphPCIeG2-CC
2
Based on PCIe Base Specification Rev4.0 version 0.7draft. See http://www.pcisig.com for latest specifications.
3
Sample size of at least 100K cycles. This fi
g
ures extrapolates to 108ps pk-pk @ 1M cycles for a BER of 1-12.
4
For RMS values additive jitter is calculated by solvin
g
the followin
g
equation for b [a^2+b^2=c^
2
] where a is rms input jitter and c is rms total jitter.
FEBRUARY 8, 2017 9 6-OUTPUT 3.3V PCIE ZERO-DELAY BUFFER
9DBL0641 / 9DBL0651 DATASHEET
Electrical Characteristics–Filtered Phase Jitter Parameters - PCIe Separate
Reference Independent Spread (SRIS) Architectures
5
Electrical Characteristics– Unfiltered Phase Jitter Parameters
T
AMB
= over the specified operating range. Supply Voltages per normal operation conditions, See Test Loads for Loading Conditions
PARAMETER SYMBOL CONDITIONS MIN TYP MAX
INDUSTRY
LIMIT
UNITS Notes
t
jphPCIeG2-
SRIS
PCIe Gen 2
(PLL BW of 16MHz , CDR = 5MHz)
1.2 1.5 2
ps
(rms)
1,2
t
jphPCIeG3-
SRIS
PCIe Gen 3
(PLL BW of 2-4MHz or 2-5MHz, CDR = 10MHz)
0.5
ps
(rms)
1,2,6
t
jphPCIeG2-
SRIS
PCIe Gen 2
(PLL BW of 16MHz , CDR = 5MHz)
0.0 0.01
ps
(rms)
1,2,4
t
jphPCIeG3-
SRIS
PCIe Gen 3
(PLL BW of 2-4MHz or 2-5MHz, CDR = 10MHz)
0.0
0.01
ps
(rms)
1,2,4,6
1
Applies to all outputs.
Phase Jitter, PLL Mode
n/a
6
This device does not support PCIe Gen3 SRIS in PLL mode. It supports PCIe Gen3 SRIS in bypass mode.
Additive Phase Jitter,
Bypass mode
n/a
2
Based on PCIe Base Specification Rev3.1a. These filters are different than Common Clock filters. See http://www.pcisi
g
.com for latest specifications.
3
Sample size of at least 100K cycles. This figures extrapolates to 108ps pk-pk @ 1M cycles for a BER of 1-12.
4
For RMS values, additive jitter is calculated by solving the following equation for b [a^2+b^2=c^2 ] where a is rms input jitter and c is rms total jitter.
5
As of PCIe Base Specification Rev4.0 draft 0.7, SRIS is not currently defined for Gen1 or Gen4.
TA = T
AMB,
Supply Voltages per normal operation conditions, See Test Loads for Loading Conditions
PARAMETER SYMBOL CONDITIONS MIN TYP MAX
INDUSTRY
LIMIT UNITS Notes
t
jph156M
156.25MHz, 1.5MHz to 10MHz, -20dB/decade
rollover < 1.5MHz, -40db/decade rolloff > 10MHz
159 N/A
fs
(rms)
1,2,3
t
jph156M12k-
20
156.25MHz, 12kHz to 20MHz, -20dB/decade
rollover <12kHz, -40db/decade rolloff > 20MHz
363 N/A
fs
(rms)
1,2,3
1
Guaranteed by design and characterization, not 100% tested in production.
3
For RMS figures, additive jitter is calculated by solving the following equation: Additive jitter = SQRT[(total jitter)^2 - (input jitter)^2]
Additive Phase Jitter,
Fanout Mode
2
DRiven by Rohde&Schartz SMA100

9DBL0651BKILF

Mfr. #:
Manufacturer:
IDT
Description:
Clock Buffer 3.3V LP-HCSL PCIE ZDB FOB
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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