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LT3990HMSE#PBF

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P22
LT3990/LT3990-3.3/LT3990-5
19
3990fa
PACKAGE DESCRIPTION
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
3.00 ±0.10
(4 SIDES)
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-2).
CHECK THE LTC WEBSITE DATA SHEET FOR CURRENT STATUS OF VARIATION ASSIGNMENT
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
TOP AND BOTTOM OF PACKAGE
0.40 ± 0.10
BOTTOM VIEW—EXPOSED PAD
1.65 ± 0.10
(2 SIDES)
0.75 ±0.05
R = 0.125
TYP
2.38 ±0.10
(2 SIDES)
15
106
PIN 1
TOP MARK
(SEE NOTE 6)
0.200 REF
0.00 – 0.05
(DD) DFN REV C 0310
0.25 ± 0.05
2.38 ±0.05
(2 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
1.65 ±0.05
(2 SIDES)2.15 ±0.05
0.50
BSC
0.70 ±0.05
3.55 ±0.05
PACKAGE
OUTLINE
0.25 ± 0.05
0.50 BSC
DD Package
10-Lead Plastic DFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1699 Rev C)
PIN 1 NOTCH
R = 0.20 OR
0.35 × 45°
CHAMFER
LT3990/LT3990-3.3/LT3990-5
20
3990fa
PACKAGE DESCRIPTION
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
MSOP (MSE16) 0911 REV E
0.53 ±0.152
(.021 ±.006)
SEATING
PLANE
0.18
(.007)
1.10
(.043)
MAX
0.17 –0.27
(.007 – .011)
TYP
0.86
(.034)
REF
0.50
(.0197)
BSC
16
1615 1413121110
1 2 3 4 5 6 7 8
9
9
1
8
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
6. EXPOSED PAD DIMENSION DOES INCLUDE MOLD FLASH. MOLD FLASH ON E-PAD SHALL
NOT EXCEED 0.254mm (.010") PER SIDE.
0.254
(.010)
0° – 6° TYP
DETAIL “A”
DETAIL “A”
GAUGE PLANE
5.23
(.206)
MIN
3.20 – 3.45
(.126 – .136)
0.889 ±0.127
(.035 ±.005)
RECOMMENDED SOLDER PAD LAYOUT
0.305 ±0.038
(.0120 ±.0015)
TYP
0.50
(.0197)
BSC
BOTTOM VIEW OF
EXPOSED PAD OPTION
2.845 ±0.102
(.112 ±.004)
2.845 ±0.102
(.112 ±.004)
4.039 ±0.102
(.159 ±.004)
(NOTE 3)
1.651 ±0.102
(.065 ±.004)
1.651 ±0.102
(.065 ±.004)
0.1016 ±0.0508
(.004 ±.002)
3.00 ±0.102
(.118 ±.004)
(NOTE 4)
0.280 ±0.076
(.011 ±.003)
REF
4.90 ±0.152
(.193 ±.006)
DETAIL “B”
DETAIL “B”
CORNER TAIL IS PART OF
THE LEADFRAME FEATURE.
FOR REFERENCE ONLY
NO MEASUREMENT PURPOSE
0.12 REF
0.35
REF
MSE Package
16-Lead Plastic MSOP, Exposed Die Pad
(Reference LTC DWG # 05-08-1667 Rev E)
LT3990/LT3990-3.3/LT3990-5
21
3990fa
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
REVISION HISTORY
REV DATE DESCRIPTION PAGE NUMBER
B 08/12 Title, Features, Typical Application clarified to add fixed output versions
Clarified Absolute Maximum Ratings, added H-grade option
Clarified pinout for fixed voltage options, clarified Ordering Information for fixed output and H-grades
Clarified Electrical Characteristics table
Clarified Typical Performance Characteristics
Clarified Pin Functions and Block Diagram
Clarified EN/UVLO text and formula
Clarified Typical Applications
1
2
2
3
4, 6
7, 8
14, 15
17
(Revision history begins at Rev B)
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LT3990HMSE#PBF

Mfr. #:
Buy LT3990HMSE#PBF
Manufacturer:
Analog Devices / Linear Technology
Description:
Switching Voltage Regulators 60V, 350mA Step-Down Regulator with 2uA Quiescent Current and Integrated Diodes in DFN
Lifecycle:
New from this manufacturer.
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