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ADG5409TCPZ-EP

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18
ADG5408-EP/ADG5409-EP Enhanced Product
Rev. 0 | Page 16 of 18
TEST CIRCUITS
S2
V
D
V
D
S8
S1
D
I
D
(ON)
NC
NC = NO CONNECT
A
13397-008
Figure 23. On Leakage
I
DS
SD
V
S
V
R
ON
= V/I
DS
13397-006
Figure 24. On Resistance
CHANNEL-TO-CHANNEL CROSSTALK = 20 log
V
OUT
GND
S1
D
S2
V
OUT
NETWORK
ANALYZER
R
L
50
R
L
50
V
S
V
S
V
DD
V
SS
0.1µF
V
DD
0.1µF
V
SS
13397-014
Figure 25. Channel-to-Channel Crosstalk
V
OUT
50
NETWORK
ANALYZER
R
L
50
Sx
D
V
S
V
DD
V
SS
0.1µF
V
DD
0.1µF
V
SS
GND
50
OFF ISOLATION = 20 log
V
OUT
V
S
13397-013
Figure 26. Off Isolation
S1
D
V
S
V
D
I
S
(OFF)
S8
I
D
(OFF)
A
A
A
13397-007
Figure 27. Off Leakage
V
OUT
R
S
AUDIO PRECISION
R
L
10k
IN
V
IN
Sx
D
V
S
V p-p
V
DD
V
SS
0.1µF
V
DD
0.1µF
V
SS
GND
13397-015
Figure 28. THD + Noise Figure
V
OUT
50
NETWORK
ANALYZER
R
L
50
Sx
D
INSERTION LOSS = 20 log
V
OUT
WITH SWITCH
V
OUT
WITHOUT SWITCH
V
S
V
DD
V
SS
0.1µF
V
DD
0.1µF
V
SS
GND
13397-017
Figure 29. Bandwidth
Enhanced Product ADG5408-EP/ADG5409-EP
Rev. 0 | Page 17 of 18
3V
0V
OUTPUT
t
r
< 20ns
t
f
< 20ns
A
DDRESS
DRIVE (V
IN
)
t
TRANSITION
t
TRANSITION
50% 50%
90%
90%
OUTPUT
ADG5408-EP*
A0
A1
A2
50
300
GND
S1
S2 TO S7
S8
D
35pF
V
IN
2.4V EN
V
DD
V
SS
V
DD
V
SS
V
S1
V
S8
*SIMILAR CONNECTION FOR ADG5409-EP.
13397-009
Figure 30. Address to Output Switching Times, t
TRANSITION
OUTPUT
A0
A1
A2
50
300
GND
S1
S2 TO S7
S8
D
35pF
V
IN
2.4V EN
V
DD
V
SS
V
DD
V
SS
V
S
*SIMILAR CONNECTION FOR ADG5409-EP.
3V
0V
OUTPUT
80% 80%
DDRESS
DRIVE (V
IN
)
t
D
13397-010
ADG5408-EP*
Figure 31. Break-Before-Make Delay, t
D
OUTPUT
A0
A1
A2
50
300
GND
S1
S2 TO S8
D
35pF
V
IN
EN
V
DD
V
SS
V
DD
V
SS
V
S
3V
0V
OUTPUT
50% 50%
t
OFF
(EN)
t
ON
(EN)
0.9V
O
0.9V
O
ENABLE
DRIVE (V
IN
)
13397-011
ADG5408-EP*
*SIMILAR CONNECTION FOR ADG5409-EP.
Figure 32. Enable Delay, t
ON
(EN), t
OFF
(EN)
3V
V
IN
V
OUT
Q
INJ
= C
L
× V
OUT
V
OUT
DSx
EN
GND
C
L
1nF
V
OUT
V
IN
R
S
V
S
V
DD
V
SS
V
DD
V
SS
A0
A1
A2
ADG5408-EP*
*SIMILAR CONNECTION FOR ADG5409-EP.
13397-012
Figure 33. Charge Injection
ADG5408-EP/ADG5409-EP Enhanced Product
Rev. 0 | Page 18 of 18
OUTLINE DIMENSIONS
2.70
2.60 SQ
2.50
COMPLIANT
TO
JEDEC STANDARDS MO-220-WGGC.
1
0.65
BSC
BOTTOM VIEWTOP VIEW
16
5
8
9
12
13
4
EXPOSED
PAD
P
I
N
1
I
N
D
I
C
A
T
O
R
4.10
4.00 SQ
3.90
0.45
0.40
0.35
S
EATING
PLANE
0.80
0.75
0.70
0.05 MAX
0.02 NOM
0.20 REF
0.20 MIN
COPLANARITY
0.08
PIN 1
INDICATOR
0.35
0.30
0.25
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
08-16-2010-C
Figure 34. 16-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
4 mm × 4 mm Body, Very Very Thin Quad
(CP-16-17)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Temperature Range Package Description Package Option
ADG5408TCPZ-EP-RL7 −55°C to +125°C 16-Lead Lead Frame Chip Scale Package [LFCSP_WQ] CP-16-17
ADG5408TCPZ-EP −55°C to +125°C 16-Lead Lead Frame Chip Scale Package [LFCSP_WQ] CP-16-17
ADG5409TCPZ-EP-RL7 −55°C to +125°C 16-Lead Lead Frame Chip Scale Package [LFCSP_WQ] CP-16-17
ADG5409TCPZ-EP −55°C to +125°C 16-Lead Lead Frame Chip Scale Package [LFCSP_WQ] CP-16-17
1
Z = RoHS Compliant Part.
©2015 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D13397-0-9/15(0)
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18

ADG5409TCPZ-EP

Mfr. #:
Buy ADG5409TCPZ-EP
Manufacturer:
Analog Devices Inc.
Description:
Multiplexer Switch ICs 8:1 & Dual 4:1 Latch up proof Muxes
Lifecycle:
New from this manufacturer.
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