13
AT17C/LV002
2281D12/01
Thermal Resistance Coefficients
(1)
Note: 1. For more information refer to the Thermal Characteristics of Atmels Packages, available on the Atmel web site, at
http://www.atmel.com/atmel/acrobat/doc0636.pdf.
Package Type θ
JC
[°C/W]
θ
JA
[°C/W]
Airflow = 0 ft/min
Leadless Array Package
(LAP)
8CN4 45 159.60
Plastic Leaded Chip Carrier
(PLCC)
20J 35 90
Thin Plastic Quad Flat
Package (TQFP)
44A 17 62
Plastic Leaded Chip Carrier
(PLCC)
44J 15 50
14
AT17C/LV002
2281D12/01
Ordering Information 5V Devices
Memory Size Ordering Code Package Operation Range
2-Mbit AT17C002-10CC
AT17C002-10JC
AT17C002-10TQC
AT17C002-10BJC
8CN4
20J
44A
44J
Commercial
(0°C to 70°C)
AT17C002-10CI
AT17C002-10JI
AT17C002-10TQI
AT17C002-10BJI
8CN4
20J
44A
44J
Industrial
(-40°C to 85°C)
Ordering Information 3.3V Devices
Memory Size Ordering Code Package Operation Range
2-Mbit AT17LV002-10CC
AT17LV002-10JC
AT17LV002-10TQC
AT17LV002-10BJC
8CN4
20J
44A
44J
Commercial
(0°C to 70°C)
AT17LV002-10CI
AT17LV002-10JI
AT17LV002-10TQI
AT17LV002-10BJI
8CN4
20J
44A
44J
Industrial
(-40°C to 85°C)
Package Type
8CN4 8-lead, 6 mm x 6 mm x 1 mm, Leadless Array Package (LAP) Pin-compatible with 8-lead SOIC/VOIC Packages
20J 20-lead, Plastic J-leaded Chip Carrier (PLCC)
44A 44-lead, Thin (1.0 mm) Plastic Quad Flat Package Carrier (TQFP)
44J 44-lead, Plastic J-leaded Chip Carrier (PLCC)
15
AT17C/LV002
2281D12/01
Packaging Information
8CN4 LAP
1150 E.Cheyenne Mtn Blvd.
Colorado Springs, CO 80906
TITLE
DRAWING NO.
R
REV.
8CN4, 8-lead (6 x 6 x 1.04 mm Body), Lead Pitch 1.27 mm,
Leadless Array Package (LAP)
A
8CN4
11/14/01
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL
MIN
NOM
MAX
NOTE
A 0.94 1.04 1.14
A1 0.30 0.34 0.38
b 0.45 0.50 0.55 1
D 5.89 5.99 6.09
E 4.89 5.99 6.09
e 1.27 BSC
e1 1.10 REF
L 0.95 1.00 1.05 1
L1 1.25 1.30 1.35 1
Note: 1. Metal Pad Dimensions.
Pin1 Corner
Marked Pin1 Indentifier
0.10 mm
TYP
4
3
2
1
5
6
7
8
Top View
L
b
e
L1
e1
Side View
A1
A
Bottom View
E
D

AT17LV002-10BJC

Mfr. #:
Manufacturer:
Microchip Technology / Atmel
Description:
FPGA - Configuration Memory Serial EEPROM
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union