16
AT17C/LV002
2281D12/01
20J PLCC
1.14(0.045) X 45˚
PIN NO. 1
IDENTIFIER
1.14(0.045) X 45˚
0.51(0.020)MAX
0.318(0.0125)
0.191(0.0075)
A2
2325 Orchard Parkway
San Jose, CA 95131
TITLE
DRAWING NO.
R
REV.
20J, 20-lead, Plastic J-leaded Chip Carrier (PLCC)
B
20J
10/04/01
45˚ MAX (3X)
Notes: 1. This package conforms to JEDEC reference MS-018, Variation AA.
2. Dimensions D1 and E1 do not include mold protrusion.
Allowable protrusion is .010"(0.254 mm) per side. Dimension D1
and E1 include mold mismatch and are measured at the extreme
material condition at the upper or lower parting line.
3. Lead coplanarity is 0.004" (0.102 mm) maximum.
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL
MIN
NOM
MAX
NOTE
A 4.191 4.572
A1 2.286 3.048
A2 0.508
D 9.779 10.033
D1 8.890 9.042 Note 2
E 9.779 10.033
E1 8.890 9.042 Note 2
D2/E2 7.366 8.382
B 0.660 0.813
B1 0.330 0.533
e 1.270 TYP
A
A1
B1
D2/E2
B
e
E1 E
D1
D
17
AT17C/LV002
2281D–12/01
44A TQFP
2325 Orchard Parkway
San Jose, CA 95131
TITLE
DRAWING NO.
R
REV.
44A, 44-lead, 10 x 10 mm Body Size, 1.0 mm Body Thickness,
0.8 mm Lead Pitch, Thin Profile Plastic Quad Flat Package (TQFP)
B
44A
10/5/2001
PIN 1 IDENTIFIER
0˚~7˚
PIN 1
Notes: 1. This package conforms to JEDEC reference MS-026, Variation ACB.
2. Dimensions D1 and E1 do not include mold protrusion. Allowable
protrusion is 0.25 mm per side. Dimensions D1 and E1 are maximum
plastic body size dimensions including mold mismatch.
3. Lead coplanarity is 0.10 mm maximum.
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL
MIN
NOM
MAX
NOTE
A 1.20
A1 0.05 0.15
A2 0.95 1.00 1.05
D 11.75 12.00 12.25
D1 9.90 10.00 10.10 Note 2
E 11.75 12.00 12.25
E1 9.90 10.00 10.10 Note 2
B 0.30 0.45
C 0.09 0.20
L 0.45 0.75
e 0.80 TYP
L
C
A1
A2 A
D1
D
e
E1 E
B
18
AT17C/LV002
2281D–12/01
44J PLCC
1.14(0.045) X 45˚
PIN NO. 1
IDENTIFIER
1.14(0.045) X 45˚
0.51(0.020)MAX
0.318(0.0125)
0.191(0.0075)
A2
2325 Orchard Parkway
San Jose, CA 95131
TITLE
DRAWING NO.
R
REV.
44J, 44-lead, Plastic J-leaded Chip Carrier (PLCC)
B
44J
10/04/01
45˚ MAX (3X)
Notes: 1. This package conforms to JEDEC reference MS-018, Variation AC.
2. Dimensions D1 and E1 do not include mold protrusion.
Allowable protrusion is .010"(0.254 mm) per side. Dimension D1
and E1 include mold mismatch and are measured at the extreme
material condition at the upper or lower parting line.
3. Lead coplanarity is 0.004" (0.102 mm) maximum.
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL
MIN
NOM
MAX
NOTE
A 4.191 4.572
A1 2.286 3.048
A2 0.508 ––
D 17.399 17.653
D1 16.510 16.662 Note 2
E 17.399 17.653
E1 16.510 16.662 Note 2
D2/E2 14.986 16.002
B 0.660 0.813
B1 0.330 0.533
e 1.270 TYP
A
A1
B1
D2/E2
B
e
E1 E
D1
D

AT17LV002-10BJC

Mfr. #:
Manufacturer:
Microchip Technology / Atmel
Description:
FPGA - Configuration Memory Serial EEPROM
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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