MKP1848S DC-Link
www.vishay.com
Vishay Roederstein
Revision: 19-Mar-13
7
Document Number: 26010
For technical questions, contact: dc-film@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
CONSTRUCTION DESCRIPTION
Low inductive wound cell elements of metallized polypropylene film, potted with resin in a flame retardant case.
SPECIFIC METHOD OF MOUNTING TO WITHSTAND VIBRATION AND SHOCK
The capacitor unit is designed for mounting on a printed circuit board. In order to withstand vibration and shock tests, it must
be insured that the stand-off pips are in good contact with the printed circuit board. The capacitors shall be mechanically fixed
by the leads and the body clamped.
SPACE REQUIREMENTS ON PRINTED-CIRCUIT BOARD FOR 2 PINS PRODUCTS
The maximum space for length (l
max.
), width (w
max.
) and height (h
max.
) of film capacitors to take in account on the printed circuit
board is shown in the drawings.
For products with pitch = 37.5 mm, = 0.7 mm for l and w, and = 0 mm for h
For products with pitch = 52.5 mm, = 1.0 mm for l and w, and = 0 mm for h
Eccentricity defined as in drawing. The maximum eccentricity is smaller than or equal to the lead diameter of the product
concerned.
SPACE REQUIREMENTS ON PRINTED-CIRCUIT BOARD FOR MULTIPLE PINS PRODUCTS
The product height with seating plane as given by “IEC 60717” as reference: h
max.
= h . The maximum length and width of film
capacitors is shown in the figure.
SOLDERING CONDITIONS
For general soldering conditions and wave soldering profile we refer to the document “Soldering Conditions Vishay Film
Capacitors”: www.vishay.com/doc?28171
STORAGE TEMPERATURE
Storage temperature: T
stg
= - 25 °C to + 35 °C with RH maximum 75 % without condensation
RATINGS AND CHARACTERISTICS REFERENCE CONDITIONS
Unless otherwise specified, all electrical values apply to an ambient temperature of 23 °C ± 1 °C, an atmospheric pressure of
86 kPa to 106 kPa and a relative humidity of 50 % ± 2 %.
For reference testing, a conditioning period shall be applied over 96 h ± 4 h by heating the products in a circulating air oven at
the rated temperature and a relative humidity not exceeding 20 %.
DIMENSIONS in millimeters
P1 L
max.
W
max.
Ø D H
37.5 I + 1.5 w + 1.8 1.5 h + 0.5
52.5 I + 1.8 w + 2.0 1.7 h + 0.5
Eccentricity
w
max.
= w + Δ
h
max.
= h + Δ
I
max.
= I + Δ
Seating plane
L
max.
P1
w
max.
P2
2 x P2 ± 0.5 mm
Ø D
