VN5E050AJ-E Package and PCB thermal data
29/37
4 Package and PCB thermal data
4.1 PowerSSO-12 thermal data
Figure 35. PowerSSO-12 PC board
Note: Layout condition of R
th
and Z
th
measurements (PCB: Double layer, Thermal Vias, FR4
area= 77mm x 86mm, PCB thickness=1.6mm, Cu thickness=70 µm (front and back side),
Copper areas: from minimum pad lay-out to 8cm
2
).
Figure 36. R
thj-amb
Vs. PCB copper area in open box free air condition
35
40
45
50
55
60
65
0246810
RTHj_amb(°C/ W)
PCB Cu heatsink area (cm^2)
