VN5E050AJ-E Package and PCB thermal data
31/37
Table 13. Thermal parameter
Area/island (cm
2
)Footprint28
R1 (°C/W) 0.7
R2 (°C/W) 2.8
R3 (°C/W) 3
R4 (°C/W) 8 8 7
R5 (°C/W) 22 15 10
R6 (°C/W) 26 20 15
C1 (W.s/°C) 0.001
C2 (W.s/°C) 0.0025
C3 (W.s/°C) 0.0166
C4 (W.s/°C) 0.2 0.1 0.1
C5 (W.s/°C) 0.27 0.8 1
C6 (W.s/°C) 3 6 9
Package information VN5E050AJ-E
32/37
5 Package information
5.1 ECOPACK
®
packages
In order to meet environmental requirements, ST offers these devices in ECOPACK
®
packages. These packages have a Lead-free second-level interconnect. The category of
Second-Level Interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97.
The maximum ratings related to soldering conditions are also marked on the inner box label.
ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.
5.2 Package mechanical data
Figure 39. PowerSSO-12 package dimensions
VN5E050AJ-E Package information
33/37
Table 14. PowerSSO-12 mechanical data
Symbol
Millimeters
Min. Typ. Max.
A 1.250 1.620
A1 0.000 0.100
A2 1.100 1.650
B 0.230 0.410
C 0.190 0.250
D 4.800 5.000
E 3.800 4.000
e0.800
H 5.800 6.200
h 0.250 0.500
L 0.400 1.270
k0° 8°
X 2.200 2.800
Y 2.900 3.500
ddd 0.100

VN5E050AJ-E

Mfr. #:
Manufacturer:
STMicroelectronics
Description:
Gate Drivers SNGL CH HIside drive with analog curren
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

Products related to this Datasheet