LTC3890-2
22
38902f
APPLICATIONS INFORMATION
Alternatively, the TRACK/SS pin can be used to track two
(or more) supplies during start-up, as shown qualitatively
in Figures 7a and 7b. To do this, a resistor divider should
be connected from the master supply (V
X
) to the TRACK/
SS pin of the slave supply (V
OUT
), as shown in Figure 8.
During start-up V
OUT
will track V
X
according to the ratio
set by the resistor divider:
V
X
V
OUT
=
R
A
R
TRACKA
R
TRACKA
+R
TRACKB
R
A
+R
B
For coincident tracking (V
OUT
= V
X
during start-up):
R
A
= R
TRACKA
R
B
= R
TRACKB
INTV
CC
Regulators
The LTC3890-2 features two separate internal P-channel
low dropout linear regulators (LDO) that supply power at
the INTV
CC
pin from either the V
IN
supply pin or the EXT-
V
CC
pin depending on the connection of the EXTV
CC
pin.
INTV
CC
powers the gate drivers and much of the LTC3890-
2’s internal circuitry. The V
IN
LDO and the EXTV
CC
LDO
regulate
INTV
CC
to 5.1V. Each of these can supply a peak
current of 50mA and must be bypassed to ground with a
minimum of 4.7µF ceramic capacitor. No matter what type of
bulk capacitor is used, an additional 1µF ceramic capacitor
placed directly adjacent to the INTV
CC
and PGND pins is
highly recommended. Good bypassing is needed to supply
the high transient currents required by the MOSFET gate
drivers and to prevent interaction between the channels.
TIME
V
X(MASTER)
V
OUT(SLAVE)
OUTPUT VOLTAGE
38902 F07a
TIME
38902 F07b
V
X(MASTER)
V
OUT(SLAVE)
OUTPUT VOLTAGE
1/2 LTC3890-2
V
OUT
V
x
V
FB
TRACK/SS
38902 F08
R
B
R
A
R
TRACKA
R
TRACKB
(7a) Coincident Tracking
(7b) Ratiometric Tracking
Figure 8. Using the TRACK/SS Pin for Tracking
1/2 LTC3890-2
TRACK/SS
C
SS
SGND
38902 F06
Figure 6. Using the TRACK/SS Pin to Program Soft-Start
Figure 7. Two Different Modes of Output Voltage Tracking
LTC3890-2
23
38902f
High input voltage applications in which large MOSFETs
are being driven at high frequencies may cause the
maximum junction temperature rating for the LTC3890-2
to be exceeded. The INTV
CC
current, which is dominated
by the gate charge current, may be supplied by either the
V
IN
LDO or the EXTV
CC
LDO. When the voltage on the
EXTV
CC
pin is less than 4.7V, the V
IN
LDO is enabled. Power
dissipation for the IC in this case is highest and is equal
to V
IN
• I
INTVCC
. The gate charge current is dependent
on operating frequency as discussed in the Efficiency
Considerations section. The junction temperature can be
estimated by using the equations given in Note 3 of the
Electrical Characteristics. For example, the LTC3890E-2
INTV
CC
current is limited to less than 32mA from a 40V
supply when not using the EXTV
CC
supply at a 70°C ambi-
ent temperature:
T
J
= 70°C + (32mA)(40V)(43°C/W) = 125°C
To prevent the maximum junction temperature from be-
ing exceeded, the input supply current must be checked
while operating in forced continuous mode (PLLIN/MODE
= INTV
CC
) at maximum V
IN
.
When the voltage applied to EXTV
CC
rises above 4.7V, the
V
IN
LDO is turned off and the EXTV
CC
LDO is enabled. The
EXTV
CC
LDO remains on as long as the voltage applied to
EXTV
CC
remains above 4.5V. The EXTV
CC
LDO attempts
to regulate the INTV
CC
voltage to 5.1V, so while EXTV
CC
is less than 5.1V, the LDO is in dropout and the INTV
CC
voltage is approximately equal to EXTV
CC
. When EXTV
CC
is greater than 5.1V, up to an absolute maximum of 14V,
INTV
CC
is regulated to 5.1V.
Using the EXTV
CC
LDO allows the MOSFET driver and
control power to be derived from one of the LTC3890-2’s
switching regulator outputs (4.7V ≤ V
OUT
≤ 14V) during
normal operation and from the V
IN
LDO when the output
is out of regulation (e.g., start-up, short-circuit). If more
current is required through the EXTV
CC
LDO than is speci-
APPLICATIONS INFORMATION
fied, an external Schottky diode can be added between the
EXTV
CC
and INTV
CC
pins. In this case, do not apply more
than 6V to the EXTV
CC
pin and make sure that EXTV
CC
≤ V
IN
.
Significant efficiency and thermal gains can be realized
by powering INTV
CC
from the output, since the V
IN
cur-
rent resulting from the driver and control currents will be
scaled by a factor of (Duty Cycle)/(Switcher Efficiency).
For 5V to 14V regulator outputs, this means connecting
the EXTV
CC
pin directly to V
OUT
. Tying the EXTV
CC
pin to
an 8.5V supply reduces the junction temperature in the
previous example from 125°C to:
T
J
= 70°C + (32mA)(8.5V)(43°C/W) = 82°C
However, for 3.3V and other low voltage outputs, additional
circuitry is required to derive INTV
CC
power from the output.
The following list summarizes the four possible connec-
tions for EXTV
CC
:
1. EXTV
CC
Grounded. This will cause INTV
CC
to be powered
from the internal 5.1V regulator resulting in an efficiency
penalty of up to 10% at high input voltages.
2. EXTV
CC
Connected Directly to V
OUT
. This is the normal
connection for a 5V to 14V regulator and provides the
highest efficiency.
3. EXTV
CC
Connected to an External Supply. If an external
supply is available in the 5V to 14V range, it may be
used to power EXTV
CC
providing it is compatible with the
MOSFET gate drive requirements. Ensure that EXTV
CC
< V
IN
.
4. EXTV
CC
Connected to an Output-Derived Boost Network.
For 3.3V and other low voltage regulators, efficiency
gains can still be realized by connecting EXTV
CC
to an
output-derived voltage that has been boosted to greater
than 4.7V. This can be done with the capacitive charge
pump shown in Figure 9. Ensure that EXTV
CC
< V
IN
.
LTC3890-2
24
38902f
APPLICATIONS INFORMATION
Topside MOSFET Driver Supply (C
B
, D
B
)
External bootstrap capacitors, C
B
, connected to the BOOST
pins supply the gate drive voltages for the topside MOSFETs.
Capacitor C
B
in the Functional Diagram is charged though
external diode D
B
from INTV
CC
when the SW pin is low.
When one of the topside MOSFETs is to be turned on, the
driver places the C
B
voltage across the gate-source of the
desired MOSFET. This enhances the top MOSFET switch
and turns it on. The switch node voltage, SW, rises to V
IN
and the BOOST pin follows. With the topside MOSFET
on, the boost voltage is above the input supply: V
BOOST
=
V
IN
+ V
INTVCC
. The value of the boost capacitor, C
B
, needs
to be 100 times that of the total input capacitance of the
topside MOSFET(s). The reverse breakdown of the external
Schottky diode must be greater than V
IN(MAX)
.
The external diode D
B
can be a Schottky diode or silicon
diode, but in either case it should have low-leakage and
fast recovery. Pay close attention to the reverse leakage
current specification for this diode, especially at high
temperatures where it generally increases substantially.
For applications with output voltages greater than ~5V
that are switching infrequently, a leaky diode D
B
can fully
discharge the bootstrap capacitor C
B
, creating a current
path from the output voltage to the BOOST pin to INTV
CC
.
Not only does this increase the quiescent current of the
converter, but it can cause INTV
CC
to rise to dangerous
levels if the leakage exceeds the current consumption on
INTV
CC
.
Particularly, this is a concern in Burst Mode operation at
no load or very light loads, where the part is switching
very infrequently and the current draw on INTV
CC
is very
low (typically about 35µA). Generally, pulse-skipping and
forced continuous modes are less sensitive to leakage,
since the more frequent switching keeps the bootstrap
capacitor C
B
charged, preventing a current path from the
output voltage to INTV
CC
.
However, in cases where the converter has been operat-
ing (in any mode) and then is shut down, if the leakage
of diode D
B
fully discharges the bootstrap capacitor C
B
before the output voltage discharges to below ~5V, then
the leakage current path can be created from the output
voltage to INTV
CC
. In shutdown, the INTV
CC
pin is able to
sink about 30µA. To accommodate diode leakage greater
than this amount in shutdown, INTV
CC
can be loaded
with an external resistor or clamped with a Zener diode.
Alternatively, the PGOOD resistor can be used to sink the
current (assuming the resistor pulls up to INTV
CC
) since
PGOOD is pulled low when the converter is shut down.
Nonetheless, using a low-leakage diode is the best choice
to maintain low quiescent current under all conditions.
Fault Conditions: Current Limit
The LTC3890-2 peak current mode control architecture
limits the inductor current when the output is shorted
to ground. Under short-circuit conditions with very low
duty cycles, the LTC3890-2 will begin cycle skipping in
order to limit the short-circuit current. In this situation
the bottom MOSFET will be dissipating most of the power.
The short-circuit ripple current is determined by the
minimum on-time, t
ON(MIN)
, of the LTC3890-2 (≈95ns),
the input voltage and inductor value:
ΔI
L(SC)
= t
ON(MIN)
V
IN
L
The resulting average short-circuit current is:
I
SC
=I
LIM(MAX)
1
2
ΔI
L(SC)
EXTV
CC
V
IN
TG1
SW
1/2 LTC3890-2
R
SENSE
V
OUT
C
OUT
38902 F09
MBOT
NDS331N
FDN340P
MTOP
2.2µF
2.2µF
C
IN
L
MBR0520
MBR0520
BG1
PGND
Figure 9. Capacitive Charge Pump for EXTV
CC

LTC3890MPUH-2#TRPBF

Mfr. #:
Manufacturer:
Analog Devices / Linear Technology
Description:
Switching Voltage Regulators High Voltage Dual Output Synchronous Step-Down Controller
Lifecycle:
New from this manufacturer.
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