Data Sheet ADuM4150
Rev. B | Page 21 of 21
OUTLINE DIMENSIONS
Figure 19. 20-Lead Standard Small Outline Package, with Increased Creepage [SOIC_IC]
Wide Body
(RI-20-1)
Dimension shown in millimeters
ORDERING GUIDE
Model
1, 2
No. of
Inputs,
V
DD1
Side
No. of
Inputs,
V
DD2
Side
Maximum
Data Rate
(MHz)
Maximum
Propagation
Delay, 5 V (ns)
Isolation
Rating
(V ac)
Temperature
Range
Package
Description
Package
Option
ADuM4150ARIZ 4 2 10 24 5000 −40°C to +125°C 20-Lead SOIC_IC RI-20-1
ADuM4150ARIZ-RL 4 2 10 24 5000 −40°C to +125°C 20-Lead SOIC_IC,
13” Tape and Reel
RI-20-1
ADuM4150BRIZ 4 2 17 13 5000 −40°C to +125°C 20-Lead SOIC_IC RI-20-1
ADuM4150BRIZ-RL 4 2 17 13 5000 −40°C to +125°C 20-Lead SOIC_IC,
13” Tape and Reel
RI-20-1
EVAL-ADuM3150Z Evaluation Board
1
Z = RoHS Compliant Part.
2
The EVAL-ADuM3150Z uses a functionally equivalent device for evaluation. The pad layout on the EVAL-ADuM3150Z evaluation board does not support the 20-lead
SOIC_IC package.
11-15-2011-A
20
11
101
SEATING
PLANE
COPLANARITY
0.1
1.27 BSC
15.40
15.30
15.20
7.60
7.50
7.40
2.64
2.54
2.44
1.01
0.76
0.51
0.30
0.20
0.10
10.51
10.31
10.11
0.46
0.36
2.44
2.24
PIN 1
MARK
1.93 REF
8°
0°
0.32
0.23
0.71
0.50
0.31
45°
0.25 BSC
GAGE
PLANE
COMPLIANT TO JEDEC STANDARDS MS-013
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registered trademarks are the property of their respective owners.
D12371-0-9/16(B)
