OMO ElectronicOMO Electronic
Expand menu
Hello, Sign inMy Account
0 Cart

ADG409BR-REEL

P1-P3P4-P6P7-P9P10-P12P13-P15
Data Sheet ADG408/ADG409
Rev. D | Page 13 of 15
TERMINOLOGY
R
ON
Ohmic resistance between D and S.
ΔR
ON
Difference between the R
ON
of any two channels.
I
S
(Off)
Source leakage current when the switch is off.
I
D
(Off)
Drain leakage current when the switch is off.
I
D
, I
S
(On)
Channel leakage current when the switch is on.
V
D
(V
S
)
Analog voltage on Terminal D and Terminal S.
C
S
(Off)
Channel input capacitance for off condition.
C
D
(Off)
Channel output capacitance for off condition.
C
D
, C
S
(On)
On switch capacitance.
C
IN
Digital input capacitance.
t
ON
(EN)
Delay time between the 50% and 90% points of the digital input
and switch on condition.
t
OFF
(EN)
Delay time between the 50% and 90% points of the digital input
and switch off condition.
t
TRANSITION
Delay time between the 50% and 90% points of the digital
inputs and the switch on condition when switching from one
address state to another.
t
OPEN
Off time measured between the 80% point of both switches
when switching from one address state to another.
V
INL
Maximum input voltage for Logic 0.
V
INH
Minimum input voltage for Logic 1.
I
INL
(I
INH
)
Input current of the digital input.
Crosstalk
A measure of unwanted signal that is coupled through from one
channel to another as a result of parasitic capacitance.
Off Isolation
A measure of unwanted signal coupling through an off channel.
Charge Injection
A measure of the glitch impulse transferred from the digital
input to the analog output during switching.
I
DD
Positive supply current.
I
SS
Negative supply current.
ADG408/ADG409 Data Sheet
Rev. D | Page 14 of 15
OUTLINE DIMENSIONS
COMPLIANT TO JEDEC STANDARDS MS-001-BB
0.022
0.018
0.015
0.150
0.130
0.115
0.070
0.060
0.055
0.021
0.016
0.011
0.045
0.039
0.030
0.195
0.130
0.115
16
1
8
9
0.100
BSC
0.775
0.755
0.735
0.210
MAX
0.015
MIN
0.280
0.250
0.240
0.430
MAX
0.012
0.010
0.008
0.325
0.310
0.300
0.015
GAUGE
PLANE
03-07-2014-D
SEATING
PLANE
TOP VIEW
SIDE VIEW
END VIEW
PIN 1
INDICATOR
Figure 28. 16-Lead Plastic Dual In-Line Package [PDIP]
Narrow Body
(N-16)
Dimensions shown in inches and (millimeters)
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
COMPLIANT TO JEDEC STANDARDS MS-012-AC
16
9
8
1
4.00 (0.1575)
3.80 (0.1496)
10.00 (0.3937)
9.80 (0.3858)
1.27 (0.0500)
BSC
6.20 (0.2441)
5.80 (0.2283)
SEATING
PLANE
0.25 (0.0098)
0.10 (0.0039)
0.51 (0.0201)
0.31 (0.0122)
1.75 (0.0689)
1.35 (0.0531)
8°
0°
0.50 (0.0197)
0.25 (0.0098)
1.27 (0.0500)
0.40 (0.0157)
0.25 (0.0098)
0.17 (0.0067)
COPLANARITY
0.10
45°
Figure 29. 16-Lead Standard Small Outline Package [SOIC_N]
Narrow Body
(R-16)
Dimensions shown in millimeters and (inches)
Data Sheet ADG408/ADG409
Rev. D | Page 15 of 15
16
9
81
PIN 1
SEATING
PLANE
8°
0°
4.50
4.40
4.30
6.40
BSC
5.10
5.00
4.90
0.65
BSC
0.15
0.05
1.20
MAX
0.20
0.09
0.75
0.60
0.45
0.30
0.19
COPLANARITY
0.10
COMPLIANT TO JEDEC STANDARDS MO-153-AB
Figure 30. 16-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-16)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Temperature Range Package Description Package Option
ADG408BN −40°C to +85°C 16-Lead Plastic Dual In-Line Package [PDIP] N-16
ADG408BNZ −40°C to +85°C 16-Lead Plastic Dual In-Line Package [PDIP] N-16
ADG408BR −40°C to +85°C 16-Lead Narrow Body Small Outline Package [SOIC_N] R-16
ADG408BR-REEL −40°C to +85°C 16-Lead Narrow Body Small Outline Package [SOIC_N] R-16
ADG408BR-REEL7 −40°C to +85°C 16-Lead Narrow Body Small Outline Package [SOIC_N] R-16
ADG408BRU −40°C to +85°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADG408BRU-REEL −40°C to +85°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADG408BRU-REEL7 −40°C to +85°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADG408BRUZ −40°C to +85°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADG408BRUZ-REEL −40°C to +85°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADG408BRUZ-REEL7 −40°C to +85°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADG408BRZ −40°C to +85°C 16-Lead Narrow Body Small Outline Package [SOIC_N] R-16
ADG408BRZ-REEL −40°C to +85°C 16-Lead Narrow Body Small Outline Package [SOIC_N] R-16
ADG408BRZ-REEL7 −40°C to +85°C 16-Lead Narrow Body Small Outline Package [SOIC_N] R-16
ADG408BCHIPS DIE
ADG409BNZ −40°C to +85°C 16-Lead Plastic Dual In-Line Package [PDIP] N-16
ADG409BR −40°C to +85°C 16-Lead Narrow Body Small Outline Package [SOIC_N] R-16
ADG409BR-REEL7 −40°C to +85°C 16-Lead Narrow Body Small Outline Package [SOIC_N] R-16
ADG409BRUZ −40°C to +85°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADG409BRUZ-REEL7 −40°C to +85°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADG409BRZ −40°C to +85°C 16-Lead Narrow Body Small Outline Package [SOIC_N] R-16
ADG409BRZ-REEL −40°C to +85°C 16-Lead Narrow Body Small Outline Package [SOIC_N] R-16
ADG409BRZ-REEL7 −40°C to +85°C 16-Lead Narrow Body Small Outline Package [SOIC_N] R-16
1
Z = RoHS Compliant Part
©2001–2015 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D00027-0-3/15(D)
P1-P3P4-P6P7-P9P10-P12P13-P15

ADG409BR-REEL

Mfr. #:
Buy ADG409BR-REEL
Manufacturer:
Analog Devices Inc.
Description:
Multiplexer Switch ICs 4:1 40 Ohm LC2MOS High Performance
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

Products related to this Datasheet