ADG408/ADG409 Data Sheet
Rev. D | Page 6 of 15
ABSOLUTE MAXIMUM RATINGS
T
A
= 25°C, unless otherwise noted.
Table 3.
Parameter Rating
V
DD
to V
SS
44 V
V
DD
to GND −0.3 V to +32 V
V
SS
to GND +0.3 V to −32 V
Analog, Digital Inputs
V
SS
− 2 V to V
DD
+ 2 V or 20 mA,
whichever occurs first
Continuous Current, S or D 20 mA
Peak Current, S or D
(Pulsed at 1 ms, 10% Duty Cycle
Maximum)
40 mA
Operating Temperature Range
Industrial (B Version) −40°C to +85°C
Extended (T Version) −55°C to +125°C
Storage Temperature Range −65°C to +150°C
Junction Temperature 150°C
CERDIP Package, Power Dissipation 900 mW
θ
JA
, Thermal Impedance 76°C/W
Lead Temperature, Soldering
(10 sec)
300°C
PDIP Package, Power Dissipation 470 mW
θ
JA,
Thermal Impedance 117°C/W
Lead Temperature, Soldering
(10 sec)
260°C
TSSOP Package, Power Dissipation 450 mW
θ
JA
, Thermal Impedance 155°C/W
θ
JC
, Thermal Impedance 50°C/W
SOIC Package, Power Dissipation 600 mW
θ
JA
, Thermal Impedance 77°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) 215°C
Infrared (15 sec) 220°C
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
ESD CAUTION
