MCP14628
DS22083A-page 4 © 2008 Microchip Technology Inc.
TEMPERATURE CHARACTERISTICS
Switching Times
HIGHDR Rise Time t
RH
—10—nsC
L
=3.3nF,
Note 1, Note 2
LOWDR Rise Time t
RL
—10—nsC
L
=3.3nF,
Note 1, Note 2
HIGHDR Fall Time t
FH
—10—nsC
L
=3.3nF,
Note 1, Note 2
LOWDR Fall Time t
FL
—6.0—nsC
L
=3.3nF,
Note 1, Note 2
HIGHDR Turn-off Propagation
Delay
t
PDLH
— 15 — ns No Load, Note 2
LOWDR Turn-off Propagation
Delay
t
PDLL
— 16 — ns No Load, Note 2
HIGHDR Turn-on Propagation
Delay
t
PDHH
10 18 30 ns No Load, Note 2
LOWDR Turn-on Propagation
Delay
t
PDHL
10 22 30 ns No Load, Note 2
Tri-State Propagation Delay t
PTS
— 35 — ns No Load, Note 2
Minimum LOWDR On Time in DCM t
LGMIN
— 400 — ns FCCM pin low Note 1
Electrical Specifications: Unless otherwise noted, all parameters apply with V
CC
= 5V.
Parameter Sym Min Typ Max Units Comments
Temperature Ranges
Specified Temperature Range T
A
-40 — +85 °C
Maximum Junction Temperature T
J
— — +150 °C
Storage Temperature T
A
-65 — +150 °C
Package Thermal Resistances
Thermal Resistance, 8L-SOIC θ
JA
— 149.5 — °C/W
Thermal Resistance, 8L-DFN (3x3) θ
JA
— 60.0 — °C/W Typical Four-layer board
with vias to ground plane
DC CHARACTERISTICS (CONTINUED)
Electrical Specifications: Unless otherwise noted, V
CC
=5V, T
J
= -40°C to +125°C
Parameters Sym Min Typ Max Units Conditions
Note 1: Parameter ensured by design, not production tested.
2: See Figure 4-1 for parameter definition.
