Obsolete Product(s) - Obsolete Product(s)
LIS3L06AL Package Information
15/17
6 Package Information
In order to meet environmental requirements, ST offers these devices in ECOPACK
®
packages. These packages have a Lead-free second level interconnect. The category of
second Level Interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label.
ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.
Figure 20. LGA-8 Mechanical Data & Package Dimensions
OUTLINE AND
MECHANICAL DATA
DIM.
mm inch
MIN. TYP. MAX. MIN. TYP. MAX.
A1 1.460 1.520 1.600 0.0574 0.0598 0.0629
A2 1.330 0.0523
A3 0.180 0.220 0.260 0.007 0.0086 0.0102
D1 4.850 5.000 5.150 0.190 0.1968 0.2027
E1 4.850 5.000 5.150 0.190 0.1968 0.2027
L 1.270 0.05
L1 2.540 0.1
M 1.225 0.0482
M1 0.875 0.900 0.925 0.0344 0.0354 0.0364
N 2.000 0.0787
N1 1.225 0.0482
N2 1.170 0.046
P1 1.300 1.350 1.400 0.0511 0.0531 0.0551
P2 0.740 0.790 0.840 0.0291 0.0311 0.033
T1 1.170 0.046
T2 0.615 0.640 0.665 0.0242 0.0251 0.0261
R 1.200 1.600 0.0472 0.0629
h 0.150 0.0059
k 0.050 0.0019
j 0.100 0.0039
LGA8 (5x5x1.6mm)
Land Grid Array Package
7669231 C
P2
P1
D1
K D
DETAIL A
E
E1
(4x)
D
K
E
K
Detail A
D
E
4
3
2
1
A1
A2
A3
R
seating plane
5
6
7
8
L1
T2
L
= =
M1
T1
M
N1N2 N
hAC B
h
AC
B
j
AC
B
j
AC B
SOLDER MASK
OPENING
METAL PAD
B
A
K
K C