DATA SHEET • SE2600S WLAN SWITCH/LNA FEM
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
4 November 2, 2011 • Skyworks Proprietary and Confidential Information • Products and Product Information are Subject to Change Without Notice 201654C
Table 7. SE2600S Electrical Specifications: Receive Characteristics (RFC to RX Port) (Note 1)
(VC1 = VC3 = 0 V, V
DD = 3.3 V, TA = +25 °C, All Unused Ports Terminated With 50 Ω, Unless Otherwise Noted)
Parameter Symbol Test Condition Min Typical Max Units
Frequency f 2.4 2.5 GHz
Receive gain, LNA enabled S21 +11 +12 +13 dB
Receive gain, LNA bypassed S21_BYP 4 3 dB
Input return loss S11 10 8 dB
Output return loss S22 10 8 dB
Noise Figure NF 1.8 2.0 dB
1 dB Input Compression Point IP1dB 6 5 dBm
Turn-on/turn-off time TON, TOFF 90/10% of final output
power level
400 ns
Note 1: Performance is guaranteed only under the conditions listed in this Table.
Table 8. SE2600S Control Logic
Mode Path VC1
(Pin 9)
VC2
(Pin 6)
VC3
(Pin 11)
VON
(Pin 3)
All off N/A 0 0 0 0
Transmit TX to RFC 0 0 1 0
Bluetooth RFC to BT 1 0 0 0
High gain (receive) RFC to RX 0 1 0 1
Bypass (receive) RFC to RX 0 1 0 0
Note
: “0” = 0 V to +0.3 V. “1” = +2.7 V to +3.6 V. Any state other than described in this Table places the switch into an undefined state. An undefined state will not damage the device.
Evaluation Board Description
The SE2600S Evaluation Board is used to test the performance of
the SE2600S LNA FEM. An Evaluation Board schematic diagram is
provided in Figure 3. Table 9 provides the Bill of Materials (BOM)
list for Evaluation Board components. An assembly drawing for the
Evaluation Board is shown in Figure 4.
Evaluation Board Setup Procedure
Step 1: Connect system ground to pin 1 of the J14 header.
Step 2: Apply 3.3 V to pin 14 of the J14 header.
Step 3: Select a path/mode according to the information in
Table 8. For the J14 header pinout, refer to the Evaluation
Board silkscreen and schematic in Figure 3.
NOTE: In case only three controls are available from the
application, (transmit, receive, and Bluetooth), connect the
VC2 and VON signals together. In this configuration, the
LNA is always “on” in receive mode (corresponding to high
gain mode in Table 8). The LNA 3
rd
Order Input Intercept
Point (IIP3) is > +5 dBm.
Evaluation Board Losses
The board losses from the RF connectors of the Evaluation Board
to the pins of the SE2600S are:
RFC: 0.175 dB
TX: 0.165 dB
RX: 0.175 dB
BT: 0.21 dB
Package Dimensions
The PCB layout footprint for the SE2600S is provided in Figure 5.
Typical case markings are shown in Figure 6. Package
dimensions for the 11-bump WLCSP are shown in Figure 7, and
tape and reel dimensions are provided in Figure 8.
DATA SHEET • SE2600S WLAN SWITCH/LNA FEM
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
201654C • Skyworks Proprietary and Confidential Information • Products and Product Information are Subject to Change Without Notice November 2, 2011 5
Package and Handling Information
Instructions on the shipping container label regarding exposure to
moisture after the container seal is broken must be followed.
Otherwise, problems related to moisture absorption may occur
when the part is subjected to high temperature during solder
assembly.
The SE2600S is rated to Moisture Sensitivity Level 1 (MSL1) at
260 °C. It can be used for lead or lead-free soldering. For
additional information, refer to the Skyworks Application Note,
PCB Design and SMT Assembly Guidelines for Wafer Level Chip
Scale Packages, document number 201676.
Care must be taken when attaching this product, whether it is
done manually or in a production solder reflow environment.
Production quantities of this product are shipped in a standard
tape and reel format.
Underfill Requirements
The assembly of a WLCSP onto an electrical substrate requires
special handling and normally needs an underfill liquid epoxy mold
compound. When fully cured, the underfill material forms a rigid,
low-stress seal that dissipates stress on solder joints and extends
thermal cycling performance. Skyworks recommends the use of
Loctite Hysol 4549 as an underfill material, which should be cured
for 30 minutes at +165 °C.
If the WLCSP is attached without an underfill, the circuit is more
susceptible to mechanical damage. Damage can even occur if
components in close proximity to the WLCSP are soldered or
unsoldered on the substrate without evenly preheating the entire
board and die. Mechanical damage to the solder joint between the
board and die could result, which may impact electrical
connectivity.
Pad Coordinates
The SE2600S pad coordinates are provided in Table 10 (also refer
to the pinout diagram in Figure 2). The origin of the coordinates
(i.e., X = 0, Y = 0) is located at the center of the SE2600S
package. Sense is top view through package (PCB footprint).
Figure 3. SE2600S Evaluation Board Schematic
DATA SHEET • SE2600S WLAN SWITCH/LNA FEM
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
6 November 2, 2011 • Skyworks Proprietary and Confidential Information • Products and Product Information are Subject to Change Without Notice 201654C
Table 9. SE2600S Evaluation Board Bill of Materials (BOM)
Component Value Size Manufacturer Manufacturer’s Part # Characteristics
C7 1 nF 0402 Murata GRM155R71H102KA01 Multi-layer ceramic
C8 10 pF 0402 Murata GRM1555C1H100JZ01 Multi-layer ceramic
C11 2.2 μF 0603 Murata GRM188R71A225KE15D Monolithic ceramic
J14 100 mil Samtec TSW-107-07-G-D 7x2 100 mil pin header
R14, R15, R16, R17 100 kΩ 0402 Panasonic ERJ2GEJ104 Thick film chip resistor
Table 10. SE2600S Bump Pad Coordinates
Bump Number Bump Label
Bump Coordinates
X
(μm)
Y
(μm)
1 TX 375 +375
2 GND 375 +125
3 VON 375 375
4 RX 125 375
5 VDD +125 375
6 VC2 +375 375
7 GND +375 125
8 BT +375 +125
9 VC1 +375 +375
10 RFC +125 +375
11 VC3 125 +375

SE2600S-R

Mfr. #:
Manufacturer:
Skyworks Solutions, Inc.
Description:
RF Front End 2.4GHz Gain 12 dB NF 1.8dB
Lifecycle:
New from this manufacturer.
Delivery:
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