©2014 Silicon Storage Technology, Inc. DS-70005004G 10/14
4
2.4 GHz High-Efficiency, High-Gain Power Amplifier Module
SST12LP17E
Data Sheet
Pin Assignments
Figure 2: Pin Assignments for 8-contact X2SON and 8-contact USON
Pin Descriptions
Table 1: Pin Description
Symbol Pin No. Pin Name Type
1
1. I=Input, O=Output
Function
GND 0 Ground Low inductance ground pad
VCC2 1 Power Supply PWR Power supply, 2
nd
stage
VCC1 2 Power Supply PWR Power supply, 1
st
stage
RFIN 3 I RF input, DC decoupled
VREF 4 PWR 1
st
and 2
nd
stage idle current control
DET 5 O On-chip power detector
RFOUT 6 O RF output, DC decoupled
DNU 7 Do Not Use Do not use or connect
DNU 8 Do Not Use Do not use or connect
T1.0 75004
4
3
2
1
5
6
7
8
VCC2
RFIN
VREF
VCC1
DNU
RFOUT
DNU
Top View
RF & DC
Ground
0
(Contacts
facing down)
DET
1426 F2.0
©2014 Silicon Storage Technology, Inc. DS-70005004G 10/14
5
2.4 GHz High-Efficiency, High-Gain Power Amplifier Module
SST12LP17E
Data Sheet
Electrical Specifications
The DC and RF specifications for the power amplifier are specified below. Refer to Table 3 for the DC voltage
and current specifications. Refer to Figures 3 through 8 for the RF performance.
Absolute Maximum Stress Ratings (Applied conditions greater than those listed under “Absolute
Maximum Stress Ratings” may cause permanent damage to the device. This is a stress rating only and
functional operation of the device at these conditions or conditions greater than those defined in the
operational sections of this data sheet is not implied. Exposure beyond absolute maximum stress rat-
ing conditions may affect device reliability.)
Input power to pin 3 (P
IN
)..................................................... +5dBm
Average output power from Pin 6 (P
OUT
)
1
......................................+25.5 dBm
1. Never measure with CW source. Pulsed single-tone source with <50% duty cycle is recommended. Exceeding the max-
imum rating of average output power could cause permanent damage to the device.
Supply Voltage at pins 1 and 2 (V
CC
)
2
......................................-0.3V to +6.0V
2. V
CC
maximum rating of 6.0V for RF output power levels up to 10 dBm.
Reference voltage to pin 4 (V
REF
).........................................-0.3V to +3.3V
DC supply current (I
CC
)
3
..................................................... 300mA
3. Measured with 100% duty cycle 54 Mbps 802.11g OFDM Signal
Operating Temperature (T
A
)............................................. -40ºC to +85ºC
Storage Temperature (T
STG
) ........................................... -40ºC to +120ºC
Maximum Junction Temperature (T
J
)............................................ +150ºC
Surface Mount Solder Reflow Temperature ............................ 260°C for 10 seconds
ESD Level for Human Body Model, HBM ......................................... 1250V
Table 2: Operating Range
Range Ambient Temp V
CC
Industrial -40°C to +85°C 3.0V to 4.6V
T2.1 75004
Table 3: DC Electrical Characteristics at 25°C
Symbol Parameter Min. Typ Max. Unit
V
CC
Supply Voltage at pins 1 and 2 3.0 3.3 4.6 V
I
CQ
Idle current to meet EVM ~3% @ 18 dBm Output Power, 802.11g OFDM
54 Mbps signal
60 mA
V
REG
Reference Voltage for pin 4 2.9 V
I
CC
Current consumption to meet 802.11g OFDM 54 Mbps spectrum mask
@ 21.5 dBm
138 mA
Current consumption to meet 802.11b DSSS 54 Mbps spectrum mask
@ 22 dBm
155 mA
Current consumption to meet EVM ~3% @ 18 dBm Output Power with
802.11g OFDM 54 Mbps signal
105 mA
T3.1 75004
©2014 Silicon Storage Technology, Inc. DS-70005004G 10/14
6
2.4 GHz High-Efficiency, High-Gain Power Amplifier Module
SST12LP17E
Data Sheet
Table 4: RF Characteristics at 25°C
Symbol Parameter Min. Typ Max. Unit
F
L-U
Frequency range 2412 2484 MHz
G Small signal gain 27 28 dB
G
VAR1
Gain variation over band (2412–2484 MHz) ±0.5 dB
G
VAR2
Gain ripple over channel (20 MHz) 0.2 dB
2f, 3f, 4f, 5f Harmonics at 23 dBm, without external filters -40 dBc
EVM
EVM @ 18 dBm output with 802.11g OFDM 54 Mbps
signal
3%
EVM @ 17 dBm output with MCS7-40 MHz band-
width
2.5 %
P
OUT
Output Power to meet 802.11g OFDM 54 Mbps
spectrum mask
20.5 21.5 dBm
Output Power to meet 802.11b DSSS 1 Mbps
spectrum mask
21 22.5 dBm
T4.2 75004
Table 5: Characteristics at 25°C for Bluetooth Applications
Symbol Parameter Min. Typ Max. Unit
F
L-U
Frequency range 2412 2484 MHz
G Small signal gain (configured as shown in Figure 9
on page 10)
26 28 dB
Small signal gain (V
REF
= 3.0V with 1.5kΩ series
resistor)
23 26 dB
ICC DC current at 17 dBm CW (configured as shown in
Figure 9 on page 10)
100 mA
DC current at 12 dBm CS (V
REF
= 3.0V with 1.5kΩ
series resistor)
50 mA
Power Meeting Bluetooth spectrum power density using 3
Mbps modulation (-20 dBm at 1.5 MHz and -40 dBm
at 2.5 MHz, 100 kHz RBW)
(configured as shown in Figure 9 on page 10)
17 dBm
Meeting Bluetooth spectrum power density using 3
Mbps modulation (-20 dBm at 1.5 MHz and -40 dBm
at 2.5 MHz, 100 kHz RBW)
(V
REF
= 3.0V with 1.5kΩ series resistor)
12 dBm
T5.2 75004

SST12LP17E-XX8E

Mfr. #:
Manufacturer:
Microchip Technology
Description:
RF Amplifier WLAN 11b/g/n Fully-integrated PA
Lifecycle:
New from this manufacturer.
Delivery:
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