HMC788A-EP Enhanced Product
Rev. 0 | Page 8 of 8
OUTLINE DIMENSIONS
1.50
1.40
1.30
0.40
0.35
0.30
TOP VIEW
SIDE VIEW
0.30
0.25
0.20
BOTTOM VIEW
PIN 1 INDEX
AREA
0.90
0.85
0.80
0.90
0.80
0.70
0.203 REF
0.05 MAX
0.02 NOM
1.30 REF
0.65
BSC
EXPOSED
PAD
02-09-2017-C
PKG-004900/005352
2.05
2.00 SQ
1.95
5
8
1
4
COPLANARITY
0.08
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
SEATING
PLANE
PIN 1
INDIC
A
T
OR AREA OPTIONS
(SEE DETAIL A)
DETAIL A
(JEDEC 95)
Figure 14. 6-Lead Lead Frame Chip Scale Package [LFCSP]
2 mm × 2 mm Body and 0.85 mm Package Height
(CP-6-10)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Temperature Range MSL Rating
2
Package Description Package Option
HMC788ACPSZ-EP-PT −55°C to +105°C MSL1 6-Lead Lead Frame Chip Scale Package [LFCSP] CP-6-10
HMC788ACPSZ-EP-R7 −55°C to +105°C MSL1 6-Lead Lead Frame Chip Scale Package [LFCSP] CP-6-10
1
All models are RoHS Compliant.
2
See the Absolute Maximum Ratings section.
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D16213-0-10/17(0)
