AD8564
Rev. B | Page 12 of 12
16
9
81
PIN 1
SEATING
PLANE
8°
0°
4.50
4.40
4.30
6.40
BSC
5.10
5.00
4.90
0.65
BSC
0.15
0.05
1.20
MAX
0.20
0.09
0.75
0.60
0.45
0.30
0.19
COPLANARITY
0.10
COMPLIANT TO JEDEC STANDARDS MO-153-AB
Figure 20. 16-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-16)
Dimensions shown in millimeters
ORDERING GUIDE
Model Temperature Range Package Description Package Option
AD8564AN −40°C to +125°C 16-Lead Plastic Dual In-Line Package [PDIP] N-16
AD8564ANZ
1
−40°C to +125°C 16-Lead Plastic Dual In-Line Package [PDIP] N-16
AD8564AR −40°C to +125°C 16-Lead Standard Small Outline Package [SOIC_N] R-16
AD8564AR-REEL −40°C to +125°C 16-Lead Standard Small Outline Package [SOIC_N] R-16
AD8564AR-REEL7 −40°C to +125°C 16-Lead Standard Small Outline Package [SOIC_N] R-16
AD8564ARZ
1
−40°C to +125°C 16-Lead Standard Small Outline Package [SOIC_N] R-16
AD8564ARZ-REEL
1
−40°C to +125°C 16-Lead Standard Small Outline Package [SOIC_N] R-16
AD8564ARZ-REEL7
1
−40°C to +125°C 16-Lead Standard Small Outline Package [SOIC_N] R-16
AD8564ARU-REEL −40°C to +125°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
AD8564ARUZ-REEL
1
−40°C to +125°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
1
Z = RoHS Compliant Part.
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C01103-0-8/07(B)
