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USBULC6-3F3K
P1-P3
P4-P6
P7-P9
P10-P10
DocID023694 Rev 1
7/10
USBULC6-
3F3K
Packag
e inform
ation
10
4 Package
informatio
n
In orde
r to meet e
nvironm
ental requi
rements, ST offers th
ese de
vices
in different gr
ades of
ECOP
ACK
®
packages
, dependi
ng on th
eir level
of env
ironmental com
pliance
. ECOP
ACK
®
speci
fication
s, grade
definitio
ns and pr
oduct
status are a
vailable a
t:
www
.st.c
om
.
ECOP
ACK
®
is an
ST tra
demark.
Figure 17. Package dimensions
Figure 18. Footprint recommendations
Figure 19. Marking
0.82 mm ± 30 µm
0.82 mm ± 30µm
400 µm ± 40
255 µm ± 40
400 µm ± 40
605 µm ± 55
210 µm
210 µm
220 µm recommended
220 µm recommended
260 µm maximum
Solder stencil opening :
Copper pad Diameter:
Solder mask opening:
300 µm minimum
x
y
x
w
z
w
Dot
xx = marking
yww = datecode
(y = year
ww = week)
z = manufacturing location
Obsolete Product(s) - Obsolete Product(s)
Tape and
reel spec
ification
USBULC6-3F3K
8/10
Doc
ID023694 Re
v 1
5
T
ape a
nd reel specificatio
n
Figur
e 20. T
ape and ree
l specif
ications
Dot identifying Pin A1 location
User direction of unreeling
All dimensions are typical values in mm
4.0
2.0
2.0
8.0
1.75
3.5
Ø 1.55
0.69
0.92
0.20
ST
ST
ST
xxz
yww
xxz
yww
xxz
yww
0.92
ST
xxz
yww
ST
xxz
yww
ST
xxz
yww
ST
xxz
yww
ST
xxz
yww
Obsolete Product(s) - Obsolete Product(s)
DocID023694 Rev 1
9/10
USBULC
6-3F3K
Ordering
infor
mation
10
6 Ordering
information
7 Revision
history
T
able
3. Orderi
ng information
Order code
Marking
Package
Weight
Base qty
Delivery mode
USBULC6
-3F3
EV
Flip C
hip
0.86 mg
10 000
T
ape and reel
T
able 4. Docu
ment revis
ion histo
ry
Date
Revision
Changes
14-Mar-2014
1
Initial rele
ase.
Obsolete Product(s) - Obsolete Product(s)
P1-P3
P4-P6
P7-P9
P10-P10
USBULC6-3F3K
Mfr. #:
Buy USBULC6-3F3K
Manufacturer:
STMicroelectronics
Description:
TVS DIODE 3V 4FLIPCHIP
Lifecycle:
New from this manufacturer.
Delivery:
DHL
FedEx
Ups
TNT
EMS
Payment:
T/T
Paypal
Visa
MoneyGram
Western
Union
Products related to this Datasheet
USBULC6-3F3K