USBULC6-3F3K

DocID023694 Rev 1 7/10
USBULC6-3F3K Package information
10
4 Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK
®
specifications, grade definitions and product status are available at: www.st.com
.
ECOPACK
®
is an ST trademark.
Figure 17. Package dimensions
Figure 18. Footprint recommendations Figure 19. Marking
0.82 mm ± 30 µm
0.82 mm ± 30µm
400 µm ± 40
255 µm ± 40
400 µm ± 40
605 µm ± 55
210 µm
210 µm
220 µm recommended
220 µm recommended
260 µm maximum
Solder stencil opening :
Copper pad Diameter:
Solder mask opening:
300 µm minimum
x
y
x
w
z
w
Dot
xx = marking
yww = datecode
(y = year
ww = week)
z = manufacturing location
Obsolete Product(s) - Obsolete Product(s)
Tape and reel specification USBULC6-3F3K
8/10 DocID023694 Rev 1
5 Tape and reel specification
Figure 20. Tape and reel specifications
Dot identifying Pin A1 location
User direction of unreeling
All dimensions are typical values in mm
4.0
2.0
2.0
8.0
1.75
3.5
Ø 1.55
0.69
0.92
0.20
ST
ST
ST
xxz
yww
xxz
yww
xxz
yww
0.92
ST
xxz
yww
ST
xxz
yww
ST
xxz
yww
ST
xxz
yww
ST
xxz
yww
Obsolete Product(s) - Obsolete Product(s)
DocID023694 Rev 1 9/10
USBULC6-3F3K Ordering information
10
6 Ordering information
7 Revision history
Table 3. Ordering information
Order code Marking Package Weight Base qty Delivery mode
USBULC6-3F3 EV Flip Chip 0.86 mg 10 000 Tape and reel
Table 4. Document revision history
Date Revision Changes
14-Mar-2014 1 Initial release.
Obsolete Product(s) - Obsolete Product(s)

USBULC6-3F3K

Mfr. #:
Manufacturer:
STMicroelectronics
Description:
TVS DIODE 3V 4FLIPCHIP
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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