MAX16904SATB52/V+T

MAX16904
2.1MHz, High-Voltage,
600mA Mini-Buck Converter
10
If the input voltage is reduced and the device
approaches dropout, it tries to turn on the high-side
FET continuously. To maintain gate charge on the high-
side FET, the BST capacitor must be periodically
recharged. To ensure proper charge on the BST
capacitor when in dropout, the high-side FET is turned
off every 6.5µs and the low-side FET is turned on for
about 150ns. This gives an effective duty cycle
of > 97% and a switching frequency of 150kHz when in
dropout.
Spread-Spectrum Option
The device has an optional spread-spectrum version. If
this option is selected, then the internal operating fre-
quency varies by +6% relative to the internally generat-
ed operating frequency of 2.1MHz (typ). Spread
spectrum is offered to improve EMI performance of the
device. By varying the frequency 6% only in the posi-
tive direction, the device still guarantees that the
2.1MHz frequency does not drop into the AM band limit
of 1.8MHz. Additionally, with the low minimum on-time
of 80ns (typ) no pulse skipping is observed for a 5V
output with 18V input maximum battery voltage in
steady state.
The internal spread spectrum does not interfere with
the external clock applied on the SYNC pin. It is active
only when the device is running with internally generat-
ed switching frequency.
Power-Good (PGOOD)
The device features an open-drain power-good output.
PGOOD is an active-high output that pulls low when the
output voltage is below 91% of its nominal value.
PGOOD is high impedance when the output voltage is
above 93% of its nominal value. Connect a 20k (typ)
pullup resistor to an external supply or the on-chip BIAS
output.
Overcurrent Protection
The device limits the peak output current to 1.05A (typ).
To protect against short-circuit events, the device shuts
off when OUTS is below 1.5V (typ) and one overcurrent
event is detected. The device attempts a soft-start
restart every 30ms and stays off if the short circuit has
not been removed. When the current limit is no longer
present, it reaches the output voltage by following the
normal soft-start sequence. If the device die reaches
the thermal limit of +175°C (typ) during the current-limit
event, it immediately shuts off.
Thermal-Overload Protection
The device features thermal-overload protection. The
device turns off when the junction temperature exceeds
+175°C (typ). Once the device cools by 15°C (typ), it
turns back on with a soft-start sequence.
Applications Information
Inductor Selection
Three key inductor parameters must be specified for
operation with the device: inductance value (L), peak
inductor current (I
PEAK
), and inductor saturation current
(I
SAT
). The minimum required inductance is a function
of operating frequency, input-to-output voltage differen-
tial, and the peak-to-peak inductor current
(I
P-P
). Higher I
P-P
allows for a lower inductor value,
while a lower I
P-P
requires a higher inductor value. A
lower inductor value minimizes size and cost, improves
large-signal and transient response, but reduces effi-
ciency due to higher peak currents and higher peak-to-
peak output-voltage ripple for the same output
capacitor. On the other hand, higher inductance
increases efficiency by reducing the ripple current.
Resistive losses due to extra wire turns can exceed the
benefit gained from lower ripple current levels especial-
ly when the inductance is increased without also allow-
ing for larger inductor dimensions. A good compromise
is to choose I
P-P
equal to 30% of the full load current.
Use the following equation to calculate the inductance:
V
IN
and V
OUT
are typical values so that efficiency is
optimum for typical conditions. The switching frequency
is ~2.1MHz. The peak-to-peak inductor current, which
reflects the peak-to-peak output ripple, is worse at the
maximum input voltage. See the
Output Capacitor
sec-
tion to verify that the worst-case output ripple is accept-
able. The inductor saturation current is also important to
avoid runaway current during continuous output short
circuit. The output current may reach 1.22A since this is
the maximum current limit. Choose an inductor with a
saturation current of greater than 1.22A to ensure prop-
er operation and avoid runaway.
Input Capacitor
The discontinuous input current of the buck converter
causes large input ripple current. The switching frequen-
cy, peak inductor current, and the allowable peak-to-
peak input-voltage ripple dictate the input capacitance
requirement. Increasing the switching frequency or the
inductor value lowers the peak-to-average current ratio
yielding a lower input capacitance requirement.
The input ripple comprises mainly of V
Q
(caused by
the capacitor discharge) and V
ESR
(caused by the
L
VVV
Vf I
OUT IN OUT
IN SW P P
=
××
()
MAX16904
2.1MHz, High-Voltage,
600mA Mini-Buck Converter
11
ESR of the input capacitor). The total voltage ripple is
the sum of V
Q
and V
ESR
. Assume the input-voltage
ripple from the ESR and the capacitor discharge is
equal to 50% each. The following equations show the
ESR and capacitor requirement for a target voltage rip-
ple at the input:
where:
and:
where I
OUT
is the output current, D is the duty cycle,
and f
SW
is the switching frequency. Use additional
input capacitance at lower input voltages to avoid pos-
sible undershoot below the UVLO threshold during tran-
sient loading.
Output Capacitor
The allowable output-voltage ripple and the maximum
deviation of the output voltage during step load cur-
rents determine the output capacitance and its ESR.
The output ripple comprises of V
Q
(caused by the
capacitor discharge) and V
ESR
(caused by the ESR of
the output capacitor). Use low-ESR ceramic or alu-
minum electrolytic capacitors at the output. For alu-
minum electrolytic capacitors, the entire output ripple is
contributed by V
ESR
. Use the ESR
OUT
equation to cal-
culate the ESR requirement and choose the capacitor
accordingly. If using ceramic capacitors, assume the
contribution to the output ripple voltage from the ESR
and the capacitor discharge to be equal. The following
equations show the output capacitance and ESR
requirement for a specified output-voltage ripple.
where:
I
P-P
is the peak-to-peak inductor current as calculated
above and f
SW
is the converter’s switching frequency.
The allowable deviation of the output voltage during
fast transient loads also determines the output capaci-
tance and its ESR. The output capacitor supplies the
step load current until the converter responds with a
greater duty cycle. The response time (t
RESPONSE
)
depends on the closed-loop bandwidth of the convert-
er. The device’s high switching frequency allows for a
higher closed-loop bandwidth, thus reducing
t
RESPONSE
and the output capacitance requirement.
The resistive drop across the output capacitor’s ESR
and the capacitor discharge causes a voltage droop
during a step load. Use a combination of low-ESR tan-
talum and ceramic capacitors for better transient load
and ripple/noise performance. Keep the maximum out-
put-voltage deviations below the tolerable limits of the
electronics being powered. When using a ceramic
capacitor, assume an 80% and 20% contribution from
the output capacitance discharge and the ESR drop,
respectively. Use the following equations to calculate
the required ESR and capacitance value:
where I
STEP
is the load step and t
RESPONSE
is the
response time of the converter. The converter response
time depends on the control-loop bandwidth.
PCB Layout Guidelines
Careful PCB layout is critical to achieve low switching
power losses and clean stable operation. Use a multilayer
board wherever possible for better noise immunity. Refer
to the MAX16904 Evaluation Kit for recommended PCB
layout. Follow these guidelines for a good PCB layout:
1) The input capacitor (4.7µF, see the applications
schematic in the
Typical Operating Circuits
) should be
placed right next to the SUP pins (pins 2 and 3 on the
TSSOP-EP package). Because the device operates at
2.1MHz switching frequency, this placement is critical
for effective decoupling of high-frequency noise from
the SUP pins.
ESR
V
I
C
It
V
OUT
ESR
STEP
OUT
STEP RESPONSE
Q
=
=
×
I
VV V
Vf L
V
PP
IN OUT OUT
IN SW
OUT RIPPLE
=
−×
××
()
_
≅+∆∆VV
ESR Q
ESR
V
I
C
I
Vf
ESR
PP
OUT
PP
QSW
=
=
××
8
D
V
V
OUT
IN
=
I
VV V
Vf L
PP
IN OUT OUT
IN SW
=
−×
××
()
ESR
V
I
I
C
IDD
ESR
OUT
PP
IN
OUT
=
+
=
×−
2
1(
))
Vf
QSW
×
MAX16904
2.1MHz, High-Voltage,
600mA Mini-Buck Converter
12
2) Solder the exposed pad to a large copper plane
area under the device. To effectively use this copper
area as heat exchanger between the PCB and ambi-
ent, expose the copper area on the top and bottom
side. Add a few small vias or one large via on the
copper pad for efficient heat transfer. Connect the
exposed pad to PGND ideally at the return terminal
of the output capacitor.
3) Isolate the power components and high current
paths from sensitive analog circuitry.
4) Keep the high current paths short, especially at the
ground terminals. The practice is essential for stable
jitter-free operation.
5) Connect the PGND and GND together preferably at
the return terminal of the output capacitor. Do not
connect them anywhere else.
6) Keep the power traces and load connections short.
This practice is essential for high efficiency. Use
thick copper PCB to enhance full load efficiency and
power dissipation capability.
7) Route high-speed switching nodes away from sensi-
tive analog areas. Use internal PCB layers as PGND
to act as EMI shields to keep radiated noise away
from the device and analog bypass capacitor.
ESD Protection
The device’s ESD tolerance is rated for Human Body
Model and Machine Model. The Human Body Model
discharge components are C
S
= 100pF and R
D
= 1.5k
(Figure 1). The Machine Model discharge components
are C
S
= 200pF and R
D
= 0 (Figure 2).
Figure 1. Human Body ESD Test Circuit
STORAGE
CAPACITOR
HIGH-
VOLTAGE
DC
SOURCE
DEVICE
UNDER
TEST
CHARGE-CURRENT-
LIMIT RESISTOR
DISCHARGE
RESISTANCE
1M
R
D
1.5k
C
S
100pF
STORAGE
CAPACITOR
HIGH-
VOLTAGE
DC
SOURCE
DEVICE
UNDER
TEST
CHARGE-CURRENT-
LIMIT RESISTOR
DISCHARGE
RESISTANCE
R
D
0
C
S
200pF
Figure 2. Machine Model ESD Test Circuit

MAX16904SATB52/V+T

Mfr. #:
Manufacturer:
Maxim Integrated
Description:
Switching Voltage Regulators 2.1MHz, High-Voltage, Mini-Buck Converter
Lifecycle:
New from this manufacturer.
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