RT9018A/B
4
DS9018A/B-07 September 2010www.richtek.com
Note 1. Stresses listed as the above "Absolute Maximum Ratings" may cause permanent damage to the device. These are for
stress ratings. Functional operation of the device at these or any other conditions beyond those indicated in the
operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended
periods may remain possibility to affect device reliability.
Note 2. θ
JA
is measured in the natural convection at T
A
= 25°C on a high effective thermal conductivity test board (4 Layers,
2S2P) of JEDEC 51-7 thermal measurement standard. The case point of θ
JC
is on the expose pad for SOP-8 (Exposed
Pad) package.
Note 3. Devices are ESD sensitive. Handling precaution recommended.
Note 4. The device is not guaranteed to function outside its operating conditions.
Note 5. The dropout voltage is defined as V
IN
-V
OUT
, which is measured when V
OUT
is V
OUT(NORMAL)
- 100mV.
Note 6. Quiescent, or ground current, is the difference between input and output currents. It is defined by I
Q
= I
IN
- I
OUT
under no
load condition (I
OUT
= 0mA). The total current drawn from the supply is the sum of the load current plus the ground pin
current.
Note 7. Regulation is measured at constant junction temperature by using a 2ms current pulse. Devices are tested for load
regulation in the load range from 1mA to 3A.
Parameter Symbol Test Conditions Min Typ Max Unit
Chip Enable
EN Input Bias Current I
EN
V
EN
= 0V -- 12 -- μA
RT9018A -- 10 20 VDD Shutdown
Current
RT9018B
I
SHDN
V
EN
= 0V
-- -- 1
μA
Logic-Low Voltage V
ENL
V
DD
= 5V -- -- 0.2
EN Threshold
Logic-High Voltage V
ENH
V
DD
= 5V 1.2 -- --
V
Power Good
PGOOD Rising Threshold -- 90 93 %
PGOOD Hysteresis 3 10 -- %
PGOOD Sink Capability I
PGOOD
= 10mA -- 0.2 0.4 V
PGOOD Delay 0.5 1.5 5 ms
Thermal Protection
Thermal Shutdown Temperature T
SD
-- 160 -- °C
Thermal Shutdown Hysteresis ΔT
SD
-- 30 -- °C
Thermal Shutdown Temperature
Fold-back
V
OUT
< 0.4V -- 110 -- °C
