74HC245
http://onsemi.com
3
MAXIMUM RATINGS (Note 1)
Symbol
Parameter Value Unit
V
CC
DC Supply Voltage *0.5 to )7.0 V
V
IN
DC Input Voltage *0.5 to V
CC
)0.5 V
V
OUT
DC Output Voltage (Note 2) *0.5 to V
CC
)0.5 V
I
IK
DC Input Diode Current $20 mA
I
OK
DC Output Diode Current $35 mA
I
OUT
DC Output Sink Current $35 mA
I
CC
DC Supply Current per Supply Pin $75 mA
I
GND
DC Ground Current per Ground Pin $75 mA
T
STG
Storage Temperature Range *65 to )150
_C
T
L
Lead Temperature, 1 mm from Case for 10 Seconds 260
_C
T
J
Junction Temperature Under Bias )150
_C
q
JA
Thermal Resistance TSSOP 128
_C/W
P
D
Power Dissipation in Still Air at 85_C TSSOP
450 mW
MSL Moisture Sensitivity Level 1
F
R
Flammability Rating Oxygen Index: 30% to 35% UL 94 V−0 @ 0.125 in
V
ESD
ESD Withstand Voltage Human Body Model (Note 3)
Machine Model (Note 4)
u2000
u200
V
I
LATCHUP
Latchup Performance Above V
CC
and Below GND at 85_C (Note 5)
$300 mA
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 20 ounce copper trace with no air flow.
2. I
O
absolute maximum rating must observed.
3. Tested to EIA/JESD22−A114−A.
4. Tested to EIA/JESD22−A115−A.
5. Tested to EIA/JESD78.
RECOMMENDED OPERATING CONDITIONS
Symbol Parameter Min Max Unit
V
CC
DC Supply Voltage (Referenced to GND) 2.0 6.0 V
V
in
, V
out
DC Input Voltage, Output Voltage (Referenced to GND) 0 V
CC
V
T
A
Operating Temperature, All Package Types –55 +125
_C
t
r
, t
f
Input Rise and Fall Time V
CC
= 2.0 V
(Figure 3) V
CC
= 4.5 V
V
CC
= 6.0 V
0
0
0
1000
500
400
ns
