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PCA9518D,118

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21
PCA9518_5 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 05 — 2 December 2008 16 of 21
NXP Semiconductors
PCA9518
Expandable 5-channel I
2
C-bus hub
13.4 Reflow soldering
Key characteristics in reflow soldering are:
• Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 11) than a SnPb process, thus
reducing the process window
• Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
• Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 6 and 7
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 11.
Table 6. SnPb eutectic process (from J-STD-020C)
Package thickness (mm) Package reflow temperature (°C)
Volume (mm
3
)
< 350 ≥ 350
< 2.5 235 220
≥ 2.5 220 220
Table 7. Lead-free process (from J-STD-020C)
Package thickness (mm) Package reflow temperature (°C)
Volume (mm
3
)
< 350 350 to 2000 > 2000
< 1.6 260 260 260
1.6 to 2.5 260 250 245
> 2.5 250 245 245
PCA9518_5 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 05 — 2 December 2008 17 of 21
NXP Semiconductors
PCA9518
Expandable 5-channel I
2
C-bus hub
For further information on temperature profiles, refer to Application Note
AN10365
“Surface mount reflow soldering description”
.
14. Abbreviations
MSL: Moisture Sensitivity Level
Fig 11. Temperature profiles for large and small components
001aac844
temperature
time
minimum peak temperature
= minimum soldering temperature
maximum peak temperature
= MSL limit, damage level
peak
temperature
Table 8. Abbreviations
Acronym Description
CDM Charged-Device Model
BiCMOS Bipolar Complementary Metal-Oxide Semiconductor
DUT Device Under Test
ESD ElectroStatic Discharge
HBM Human Body Model
I/O Input/Output
I
2
C-bus Inter-Integrated Circuit bus
MM Machine Model
RC Resistor Capacitor network
SMBus System Management Bus
PCA9518_5 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 05 — 2 December 2008 18 of 21
NXP Semiconductors
PCA9518
Expandable 5-channel I
2
C-bus hub
15. Revision history
Table 9. Revision history
Document ID Release date Data sheet status Change notice Supersedes
PCA9518_5 20081202 Product data sheet - PCA9518_4
Modifications:
• The format of this data sheet has been redesigned to comply with the new identity guidelines of
NXP Semiconductors.
• Legal texts have been adapted to the new company name where appropriate.
• Section 6.1 “Enable”: added new 3
rd
paragraph
• Figure 5 “Typical application: multiple expandable 5-channel I
2
C-bus hubs”: added 2
nd
paragraph
below drawing.
• Figure 6 “Bus waveforms”:
– changed symbol from “t
st
” to “t
stretch
”
– changed symbol from “t
r1
” to “t
PHL1
”
– changed symbol from “t
r2
” to “t
PHL2
”
– changed symbol from “t
Er1
” to “t
PLH2
, t
PLH1
”
• Table 3 “Limiting values”:
– changed symbol/parameter from “V
CC
to GND, supply voltage range V
CC
” to
“V
CC
, supply voltage” (and placed “V
CC
to GND” in Conditions column)
– changed symbol/parameter from “V
bus
, voltage range I
2
C-bus, SCL or SDA” to
“V
I2C-bus
,I
2
C-bus voltage” (and placed “SCL or SDA” in Conditions column)
– changed symbol/parameter from “I, DC current (any pin)” to “I
I
, input current” (and placed
“any pin” in Conditions column)
– changed parameter for P
tot
from “power dissipation” to “total power dissipation”
• Table 4 “Static characteristics”:
– sub-section “Supplies”; symbol I
CCH
: changed parameter from “quiescent supply current, both
channels HIGH” to “HIGH-level supply current”; moved “both channels HIGH” to Conditions
column
– sub-section “Supplies”; symbol I
CCL
: changed parameter from “quiescent supply current, both
channels LOW” to “LOW-level supply current”; moved “both channels LOW” to Conditions
column
– sub-section “Supplies”; symbol I
CCLc
: changed parameter from “quiescent supply current in
contention” to “contention LOW-level supply current”
– sub-section “Input SCL; input/output SDA”, symbol used for parameter “input leakage current”
changed from “I
I
” to “I
LI
”
– sub-section “Input SCL; input/output SDA”, symbol V
OL
−V
ILc
: parameter changed from “LOW
level input voltage below output LOW level voltage” to “difference between LOW-level output
and LOW-level input voltage contention”
– (old) table note 1 is split into (new) Table note [1] and Table note [2]
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PCA9518D,118

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Buy PCA9518D,118
Manufacturer:
NXP Semiconductors
Description:
IC I2C BUS HUB 5-CH 20SOIC
Lifecycle:
New from this manufacturer.
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