4
RF Device Data
Freescale Semiconductor, Inc.
MMH3111NT1
50 OHM TYPICAL CHARACTERISTICS
35
47
4
V
DD
, DRAIN VOLTAGE (V)
Figure 8. Third Order Output Intercept Point
versus Drain Voltage
45
43
41
39
IP3, THIRD ORDER OUTPUT INTERCEPT POINT (dBm)
4.2 4.4 54.6
100-- 4 0 -- 2 0 0 2 0 4 0 6 0 8 0
43
48
T, TEMPERATURE (_C)
Figure 9. Third Order Output Intercept Point
versus Case Temperature
46
45
44
IP3, THIRD ORDER OUTPUT INTERCEPT POINT (dBm)
Figure 10. Third Order Intermodulation versus
Output Power
P
out
, OUTPUT POWER (dBm)
IMD, THIRD ORDER
INTERMODULATION DISTORTION (dBc)
10 12 14
-- 7 0
-- 2 5
-- 5 5
-- 6 5
-- 4 5
150
10
4
10
6
120
Figure 11. MTTF versus Junction Temperature
10
5
125 130 135 140 145
T
J
, JUNCTION TEMPERATURE (C)
NOTE: The MTTF is calculated with V
DD
=5Vdc,I
DD
= 150 mA
MTTF (YEARS)
4
0
8
0
f, FREQUENCY (GHz)
Figure 12. Noise Figure versus Frequency
6
4
2
123
NF, NOISE FIGURE (dB)
-- 7 0
-- 3 0
10
P
out
, OUTPUT POWER (dBm)
Figure 13. Single--Carrier W--CDMA Adjacent
Channel Power Ratio versus Output Power
-- 4 0
-- 5 0
-- 6 0
161412
ACPR, ADJACENT CHANNEL POWER RATIO (dBc)
19
47
V
DD
= 5 Vdc, f = 900 MHz, 10 dBm per Tone
Two--Tone Measurements, 1 MHz Tone Spacing
18
-- 3 5
11918
37
4.8
-- 3 0
-- 4 0
-- 5 0
-- 6 0
16
13 15 17
f = 900 MHz, 10 dBm per tone
Two--Tone Measurements, 1 MHz Tone Spacing
V
DD
=5Vdc
f = 900 MHz
1 MHz Tone Spacing
V
DD
= 5 Vdc, f = 2140 MHz
Single--Carrier W--CDMA, 3.84 MHz Channel Bandwidth
Input Signal PAR = 8.5 dB @ 0.01% Probability on CCDF
V
DD
=5Vdc
MMH3111NT1
5
RF Device Data
Freescale Semiconductor, Inc.
50 OHM APPLICATION CIRCUIT: 800--1900 MHz
Figure 14. 50 Ohm Test Circuit Schematic
Figure 15. S21, S11 and S22 versus Frequency
-- 4 0
600
f, FREQUENCY (MHz)
800 1000
20
10
0
-- 1 0
-- 2 0
-- 3 0
S21, S11, S22 (dB)
S21
S11
RF
OUTPUT
RF
INPUT
V
SUPPLY
C3
Z1 Z2
C1
C2
R1
L1
V
CC
DUT
Figure 16. 50 Ohm Test Circuit Component Layout
Z1 0.347 x 0.058 Microstrip
Z2 0.068 x 0.058 Microstrip
Z3 0.418 x 0.058 Microstrip
Z4 0.089 x 0.058 Microstrip
Z5 0.172 x 0.058 Microstrip
Z6 0.403 x 0.058 Microstrip
Z7 0.086 x 0.058 Microstrip
Z8 0.261 x 0.058 Microstrip
PCB Getek Grade ML200C, 0.031,
r
=4.1
Z8
C6
Z7Z6
C4
Z5Z4
L2
Z3
C5
1200 1400 1600 1800 2000
S22
MMG30XX
Rev 2
C1
C5
L2
R1
C4
C3
L1
C2
C6
V
DD
=5Vdc
Table 8. 50 Ohm Test Circuit Component Designations and Values
Part Description Part Number Manufacturer
C1, C2 47 pF Chip Capacitors 06035J470BBS AVX
C3 0.1 F Chip Capacitor C0603C104J5RAC Kemet
C4 1 F Chip Capacitor C0603C105J5RAC Kemet
C5 0.7 pF Chip Capacitor 06035J0R7BBS AVX
C6 0.4 pF Chip Capacitor 12105J0R4BBS AVX
L1 56 nH Chip Inductor HK160856NJ--T Taiyo Yuden
L2 12 nH Chip Inductor HK160812NJ--T Taiyo Yuden
R1
0 Ω, 1/10 W Chip Resistor
CRCW06030000FKEA Vishay
6
RF Device Data
Freescale Semiconductor, Inc.
MMH3111NT1
50 OHM APPLICATION CIRCUIT: 1900--2200 MHz
Figure 17. 50 Ohm Test Circuit Schematic
Figure 18. S21, S11 and S22 versus Frequency
-- 3 0
f, FREQUENCY (MHz)
1800
20
10
0
-- 1 0
-- 2 0
S21, S11, S22 (dB)
S21
S11
RF
OUTPUT
RF
INPUT
V
SUPPLY
C3
Z1 Z2
C1
C2
R1
L1
V
CC
DUT
Figure 19. 50 Ohm Test Circuit Component Layout
Z1 0.347 x 0.058 Microstrip
Z2 0.068 x 0.058 Microstrip
Z3 0.507 x 0.058 Microstrip
Z4 0.172 x 0.058 Microstrip
Z5 0.403 x 0.058 Microstrip
Z6 0.086 x 0.058 Microstrip
Z7 0.261 x 0.058 Microstrip
PCB Getek Grade ML200C, 0.031,
r
=4.1
Z7
C6
Z6Z5
C4
Z4Z3
C5
1900 2000 2100 2200 2300
S22
MMG30XX
Rev 2
C1
C5
R1
C4
C3
L1
C2
C6
V
DD
=5Vdc
Table 9. 50 Ohm Test Circuit Component Designations and Values
Part Description Part Number Manufacturer
C1, C2 0.01 F Chip Capacitors 06035J470BBS AVX
C3 0.1 F Chip Capacitor C0603C104J5RAC Kemet
C4 1 F Chip Capacitor C0603C105J5RAC Kemet
C5 0.7 pF Chip Capacitor 06035J0R7BBS AVX
C6 0.4 pF Chip Capacitor 12105J0R4BBS AVX
L1 56 nH Chip Inductor HK160856NJ--T Taiyo Yuden
R1
0 Ω, 1/10 W Chip Resistor
CRCW06030000FKEA Vishay

MMH3111NT1

Mfr. #:
Manufacturer:
NXP / Freescale
Description:
RF Amplifier 22DBM 12DB GPA SOT-89
Lifecycle:
New from this manufacturer.
Delivery:
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Payment:
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