MC100ELT22DTG

MC10ELT22, MC100ELT22
www.onsemi.com
4
Table 6. TTL INPUT DC CHARACTERISTICS V
CC
= 4.75 V to 5.25 V; T
A
= −40°C to 85°C
Symbol
Characteristic Condition Min Typ Max Unit
I
IH
Input HIGH Current V
IN
= 2.7 V;
V
IN
= (V
CC
− 0.025) V
20
mA
I
IHH
Input HIGH Current V
IN
= 7.0 V 100
mA
I
IL
Input LOW Current V
IN
= 0.5 V;
V
IN
= (GND + 0.025) V
−0.6 mA
V
IK
Input Clamp Diode Voltage I
IN
= −18 mA −1.2 V
V
IH
Input HIGH Voltage 2.0 V
CC
− 0.025 V V
V
IL
Input LOW Voltage GND + 0.025 V 0.8 V
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm.
Table 7. AC CHARACTERISTICS V
CC
= 4.75 V to 5.25 V; GND= 0.0 V
Symbol
Characteristic
−40°C 25°C 85°C
Unit
Min Typ Max Min Typ Max Min Typ Max
f
MAX
Maximum Input Frequency 500 MHz
t
PLH
Propagation Delay (Note 6)
1.5 V to 50%
0.6 1.2 0.9 1.2 1.5 0.6 1.35 ns
t
PHL
Propagation Delay (Note 6)
1.5 V to 50%
0.4 1.0 0.5 0.8 1.1 0.7 1.30 ns
t
skew
Within−Device Skew (Note 7)
Device−to−Device Skew (Note 8)
50
300
100
600
50
300
100
600
50
350
100
750
ps
t
JITTER
CLOCK Random Jitter (RMS) 0.5 ps
t
r
/t
f
Output Rise/Fall Time
(20−80%)
0.4 1.6 0.4 1.6 0.4 1.6 ns
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm.
6. Specifications for standard TTL input signal.
7. Skew is measured between outputs under identical transitions and conditions on any one device.
8. Device−to−Device Skew for identical transitions at identical V
CC
levels.
MC10ELT22, MC100ELT22
www.onsemi.com
5
Figure 2. Typical Termination for Output Driver and Device Evaluation
(See Application Note AND8020/D − Termination of ECL Logic Devices.)
Driver
Device
Receiver
Device
QD
Q D
Z
o
= 50 W
Z
o
= 50 W
50 W 50 W
V
TT
V
TT
= V
CC
− 2.0 V
ORDERING INFORMATION
Device Package Shipping
MC10ELT22DG SO−8
(Pb−Free)
98 Units / Rail
MC10ELT22DR2G SO−8
(Pb−Free)
2500 Tape & Reel
MC10ELT22DTG TSSOP−8
(Pb−Free)
100 Units / Rail
MC10ELT22DTR2G TSSOP−8
(Pb−Free)
2500 Tape & Reel
MC100ELT22DG SO−8
(Pb−Free)
98 Units / Rail
MC100ELT22DR2G SO−8
(Pb−Free)
2500 Tape & Reel
MC100ELT22DTG TSSOP−8
(Pb−Free)
100 Units / Rail
MC100ELT22DTR2G TSSOP−8
(Pb−Free)
2500 Tape & Reel
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specification Brochure, BRD8011/D.
Resource Reference of Application Notes
AN1405/D ECL Clock Distribution Techniques
AN1406/D Designing with PECL (ECL at +5.0 V)
AN1503/D
ECLinPSt I/O SPiCE Modeling Kit
AN1504/D Metastability and the ECLinPS Family
AN1568/D Interfacing Between LVDS and ECL
AN1672/D The ECL Translator Guide
AND8001/D Odd Number Counters Design
AND8002/D Marking and Date Codes
AND8020/D Termination of ECL Logic Devices
AND8066/D Interfacing with ECLinPS
AND8090/D AC Characteristics of ECL Devices
MC10ELT22, MC100ELT22
www.onsemi.com
6
PACKAGE DIMENSIONS
SOIC−8 NB
CASE 751−07
ISSUE AK
SEATING
PLANE
1
4
58
N
J
X 45
_
K
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
6. 751−01 THRU 751−06 ARE OBSOLETE. NEW
STANDARD IS 751−07.
A
B
S
D
H
C
0.10 (0.004)
DIM
A
MIN MAX MIN MAX
INCHES
4.80 5.00 0.189 0.197
MILLIMETERS
B 3.80 4.00 0.150 0.157
C 1.35 1.75 0.053 0.069
D 0.33 0.51 0.013 0.020
G 1.27 BSC 0.050 BSC
H 0.10 0.25 0.004 0.010
J 0.19 0.25 0.007 0.010
K 0.40 1.27 0.016 0.050
M 0 8 0 8
N 0.25 0.50 0.010 0.020
S 5.80 6.20 0.228 0.244
−X−
−Y−
G
M
Y
M
0.25 (0.010)
−Z−
Y
M
0.25 (0.010) Z
S
X
S
M
____
1.52
0.060
7.0
0.275
0.6
0.024
1.270
0.050
4.0
0.155
ǒ
mm
inches
Ǔ
SCALE 6:1
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*

MC100ELT22DTG

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
Translation - Voltage Levels 5V Dual TTL to Diff PECL
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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